Patent US3584740A successfully refreshed from Google Patents.
Patent US6004187A successfully refreshed from Google Patents.
US6004187A
Expired / Lapsed
US
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Method and apparatus for measuring film thickness and film thickness distribution during polishing
Assignee: Canon Inc
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Filing: 1997-08-27
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Granted: 1999-12-21
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Expires: 2017-08-27
Abstract
Abstract Disclosed is a method of polishing the surface of a film provided on a substrate, by use of a polishing device, while relatively moving the film surface and the polishing device. The method includes a position detecting step for detecting a predetermined position on the surface of the film, a first measurement step for measuring an absolute value of the film thickness at the predetermined position, and a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through the first measurement step. The method also includes a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of a data obtained through the first and second measurement steps, and a control step for controlling continuation/discontinuation of polishing, on the basis of a data obtained through the film thickness distribution measurement step.
Inventors
- 👤 Masaru Nyui
- 👤 Mikichi Ban
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 06:09
CPC Classifications
B; B24; B24B; B24B7/00; B24B37/00; B24B37/005; B24B37/013; H; H10; H10P; H10P74/00; H10P74/23; H10P74/238
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
142 words
A method of polishing the surface of a film provided on a substrate, by use of polishing means, while relatively moving the film surface and the polishing means, said method comprising: a position detecting step for detecting a predetermined position on the surface of the film; a first measurement step for measuring an absolute value of the film thickness at the predetermined position; a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through said first measurement step; a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of data obtained through said first and second measurement steps; and a control step for controlling continuation/discontinuation of polishing, on the basis of data obtained through said film thickness distribution measurement step.
Claim 2
Independent Claim
142 words
A method of polishing the surface of a film provided on a substrate, by use of polishing means, while relatively moving the film surface and the polishing means, said method comprising: a position detecting step for detecting a predetermined position on the surface of the film; a first measurement step for measuring an absolute value of the film thickness at the predetermined position; a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through said first measurement step; a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of data obtained through said first and second measurement steps; and a control step for controlling continuation/discontinuation of polishing, on the basis of data obtained through said film thickness distribution measurement step.
Claim 3
Dependent Claim
31 words
A method according to claim 1, wherein the film thickness information of the film at said second measurement step includes one of a film thickness difference and a film thickness average.
Claim 4
Dependent Claim
36 words
A method according to claim 1, wherein said control step includes discontinuing the polishing when one of the film thickness of the film and the film thickness distribution of the film comes into a predetermined range.
Claim 5
Dependent Claim
42 words
A method according to claim 1, wherein said first and second measurement steps, said film thickness distribution measurement step and said control step are carried out during a process in which the surface of the film is polished by the polishing means.
Claim 6
Dependent Claim
29 words
A method according to claim 1, wherein a polishing pad of the polishing means has an area which is narrower than the area of the surface of the film.
Claim 7
Dependent Claim
138 words
A polishing apparatus for polishing the surface of a film provided on a substrate, by use of polishing means, while relatively moving the film surface and the polishing means, said apparatus comprising: position detecting means for detecting a predetermined position on the surface of the film; first measuring means for measuring an absolute value of the film thickness at the predetermined position; second measuring means for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through said first measuring means; film thickness distribution measuring means for detecting a film thickness distribution of the film, on the basis of data obtained through said first and second measuring means; and control means for controlling continuation/discontinuation of polishing, on the basis of data obtained through said film thickness distribution measuring means.
Claim 8
Dependent Claim
138 words
A polishing apparatus for polishing the surface of a film provided on a substrate, by use of polishing means, while relatively moving the film surface and the polishing means, said apparatus comprising: position detecting means for detecting a predetermined position on the surface of the film; first measuring means for measuring an absolute value of the film thickness at the predetermined position; second measuring means for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through said first measuring means; film thickness distribution measuring means for detecting a film thickness distribution of the film, on the basis of data obtained through said first and second measuring means; and control means for controlling continuation/discontinuation of polishing, on the basis of data obtained through said film thickness distribution measuring means.
Claim 9
Dependent Claim
34 words
An apparatus according to claim 6, wherein the film thickness information of the film to be obtained with said second measuring means includes one of a film thickness difference and a film thickness average.
Claim 10
Dependent Claim
35 words
An apparatus according to claim 6, wherein said control means discontinues the polishing when one of the film thickness of the film and the film thickness distribution of the film comes into a predetermined range.
Claim 11
Dependent Claim
40 words
An apparatus according to claim 6, wherein said first and second measuring means, said film thickness distribution measuring means and said control means operate during a process in which the surface of the film is polished by the polishing means.
Claim 12
Dependent Claim
27 words
An apparatus according to claim 6, wherein said polishing means has a polishing pad with an area narrower than the area of the surface of the film.
Claim 13
Dependent Claim
31 words
An apparatus according to claim 6, wherein said apparatus comprises plural first measuring means and plural second measuring means, for executing measurements at different positions on the surface of the film.
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| 3.5 Years (Year 4) | 2002-12-20 | 2003-06-21 | 2003-12-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-20 | 2007-06-21 | 2007-12-21 | $3760.00 | Window Closed / Lapsed |
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