US5791969A
Expired / Lapsed
US
⏱️ 0.0 years remaining
System and method of automatically polishing semiconductor wafers
Assignee: Individual
•
Filing: 1997-02-13
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Granted: 1998-08-11
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Expires: 2017-02-13
Abstract
Abstract A method of automatically polishing a semiconductor wafer having a substrate and a surface film. A wafer mounting device, which may include a vacuum chuck, holds the semiconductor wafer without requiring that the wafer have a central aperture. The mounting device and wafer are moved with an orbit-within-an-orbit motion while a tape transport mechanism applies an abrasive polishing tape to the surface film of the moving wafer to polish one surface of the wafer to a flatness of less than two microns. The polishing tape passes arcuately around a roller and passes between the roller and the surface film and contacts the surface film in a line running across the width of the tape. The system determines the thickness of the wafer surface film during the polishing process with a real time measurement device such as an effipsometer, or by determining a work-performed factor and calculating an estimated film thickness from the work-performed factor. Finally, the system automatically controls the polishing process to stop polishing the semiconductor wafer when the wafer surface film achieves a predefined planarization.
Inventors
- 👤 Douglas E. Lund
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:47
CPC Classifications
B; B24; B24B; B24B21/00; B24B37/00; B24B37/005; B24B37/013; B24B37/04; B24B37/07; B24B37/10; B24B37/105; B24B49/00; B24B49/12
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
141 words
A method of automatically polishing a semiconductor wafer having a substrate and a surface film, said method comprising the steps of: holding said semiconductor wafer without requiring that said wafer have a central aperture; polishing one surface of said wafer to a microscopically smooth surface by applying a polishing tape to the surface film of the wafer with a tape transport mechanism, said tape contacting said surface film in a line; determining the thickness of said surface film in real time while polishing said wafer; and automatically controlling said polishing step with a control computer, said automatic controlling step including the steps of: providing measurements of said surface film thickness to said control computer in real time; and stopping said polishing step when the thickness of said surface film, averaged over the entire surface of said wafer, achieves a predefined value.
Claim 2
Independent Claim
141 words
A method of automatically polishing a semiconductor wafer having a substrate and a surface film, said method comprising the steps of: holding said semiconductor wafer without requiring that said wafer have a central aperture; polishing one surface of said wafer to a microscopically smooth surface by applying a polishing tape to the surface film of the wafer with a tape transport mechanism, said tape contacting said surface film in a line; determining the thickness of said surface film in real time while polishing said wafer; and automatically controlling said polishing step with a control computer, said automatic controlling step including the steps of: providing measurements of said surface film thickness to said control computer in real time; and stopping said polishing step when the thickness of said surface film, averaged over the entire surface of said wafer, achieves a predefined value.
Claim 3
Dependent Claim
36 words
The method of automatically polishing a semiconductor wafer of claim 1 wherein said step of holding said semiconductor wafer without requiring that said wafer have a central aperture includes holding said wafer with a vacuum chuck.
Claim 4
Dependent Claim
43 words
The method of automatically polishing a semiconductor wafer of claim 2 wherein said step of polishing one surface of said wafer to a microscopically smooth surface includes: mounting said wafer on a mounting mechanism; and moving said mounting mechanism in an orbit-within-an-orbit motion.
Claim 5
Dependent Claim
40 words
The method of automatically polishing a semiconductor wafer of claim 3 wherein said step of mounting said wafer on a mounting mechanism includes supplying a negative pressure of approximately 10 Torr to said vacuum chuck with a rotary vacuum mechanism.
Claim 6
Dependent Claim
36 words
The method of automatically polishing a semiconductor wafer of claim 4 wherein said step of determining the thickness of said surface film in real time includes measuring the thickness of said surface film with an ellipsometer.
Claim 7
Dependent Claim
61 words
The method of automatically polishing a semiconductor wafer of claim 1 wherein said step of polishing one surface of said wafer to a microscopically smooth surface includes: mounting said wafer on a mounting mechanism; moving said mounting mechanism in an orbit-within-an-orbit motion; and applying an abrasive polishing tape to the surface film of the moving wafer with a tape transport mechanism.
Claim 8
Dependent Claim
40 words
The method of automatically polishing a semiconductor wafer of claim 1 wherein said step of mounting said wafer on a mounting mechanism includes supplying a negative pressure of approximately 10 Torr to said vacuum chuck with a rotary vacuum mechanism.
Claim 9
Dependent Claim
36 words
The method of automatically polishing a semiconductor wafer of claim 1 wherein said step of determining the thickness of said surface film, in real time, includes measuring the thickness of said surface film with an ellipsometer.
Claim 10
Dependent Claim
73 words
The method of automatically polishing a semiconductor wafer of claim 1 wherein said step of polishing one surface of said wafer to a microscopically smooth surface by applying a polishing tape to the surface film of the wafer includes applying a polishing tape from the group consisting of: dry impregnated abrasive tape; wet impregnated abrasive tape; dry impregnated chemical tape; wet impregnated chemical tape; dry fabric web tape; and wet fabric web tape.
Claim 11
Dependent Claim
41 words
The method of automatically polishing a semiconductor wafer of claim 9 wherein said step of applying a dry impregnated abrasive tape includes applying a polishing tape having an abrasive embedded in a binder system which is coated onto a flexible backing.
Claim 12
Dependent Claim
41 words
The method of automatically polishing a semiconductor wafer of claim 9 wherein said step of applying a wet impregnated abrasive tape includes applying a polishing tape having an abrasive embedded in a binder system which is coated onto a flexible backing.
Claim 13
Dependent Claim
34 words
The method of automatically polishing a semiconductor wafer of claim 9 wherein said step of applying a wet impregnated abrasive tape includes applying a polishing tape that utilizes liquid slurry as a wetting agent.
Claim 14
Dependent Claim
34 words
The method of automatically polishing a semiconductor wafer of claim 9 wherein said step of applying a wet fabric web tape includes applying a polishing tape that utilizes liquid slurry as a wetting agent.
Claim 15
Dependent Claim
34 words
The method of automatically polishing a semiconductor wafer of claim 9 wherein said step of applying a wet impregnated abrasive tape includes applying a polishing tape that utilizes liquid chemicals as a wetting agent.
Claim 16
Dependent Claim
34 words
The method of automatically polishing a semiconductor wafer of claim 9 wherein said step of applying a wet impregnated chemical tape includes applying a polishing tape that utilizes liquid chemicals as a wetting agent.
Claim 17
Dependent Claim
34 words
The method of automatically polishing a semiconductor wafer of claim 9 wherein said step of applying a wet fabric web tape includes applying a polishing tape that utilizes liquid chemicals as a wetting agent.
Claim 18
Independent Claim
190 words
A method of automatically polishing a semiconductor wafer having a substrate and a surface film, said method comprising the steps of: holding said semiconductor wafer with a mounting mechanism without requiring that said wafer have a central aperture; polishing one surface of said wafer to a microscopically smooth surface, said polishing step comprising: moving said mounting mechanism in an orbit-within-an-orbit motion; and applying a polishing tape to the surface film of the wafer with a tape transport mechanism, said tape transport mechanism including a roller around which said polishing tape arcuately passes, said tape passing between said roller and said surface film and contacting said surface film in a line running across the width of the tape; measuring the thickness of said surface film with an ellipsometer in real time while polishing said wafer; and automatically controlling said polishing step with a control computer, said automatic controlling step including the steps of: providing measurements of said surface film thickness to said control computer in real time; and stopping said polishing step when the thickness of said surface film, averaged over the entire surface of said wafer, achieves a predefined value.
Claim 19
Independent Claim
190 words
A method of automatically polishing a semiconductor wafer having a substrate and a surface film, said method comprising the steps of: holding said semiconductor wafer with a mounting mechanism without requiring that said wafer have a central aperture; polishing one surface of said wafer to a microscopically smooth surface, said polishing step comprising: moving said mounting mechanism in an orbit-within-an-orbit motion; and applying a polishing tape to the surface film of the wafer with a tape transport mechanism, said tape transport mechanism including a roller around which said polishing tape arcuately passes, said tape passing between said roller and said surface film and contacting said surface film in a line running across the width of the tape; measuring the thickness of said surface film with an ellipsometer in real time while polishing said wafer; and automatically controlling said polishing step with a control computer, said automatic controlling step including the steps of: providing measurements of said surface film thickness to said control computer in real time; and stopping said polishing step when the thickness of said surface film, averaged over the entire surface of said wafer, achieves a predefined value.
Claim 20
Dependent Claim
61 words
The method of automatically polishing a semiconductor wafer of claim 17 wherein said step of applying a polishing tape to the surface film of the wafer includes applying a polishing tape from the group consisting of: dry impregnated abrasive tape; wet impregnated abrasive tape; dry impregnated chemical tape; wet impregnated chemical tape; dry fabric web tape; and wet fabric web tape.
Claim 21
Dependent Claim
41 words
The method of automatically polishing a semiconductor wafer of claim 18 wherein said step of applying a wet impregnated abrasive tape to the surface film of the wafer includes applying a polishing tape that utilizes liquid slurry as a wetting agent.
Claim 22
Dependent Claim
41 words
The method of automatically polishing a semiconductor wafer of claim 18 wherein said step of applying a wet impregnated chemical tape to the surface film of the wafer includes applying a polishing tape that utilizes liquid chemicals as a wetting agent.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-10 | 2002-02-09 | 2002-08-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-10 | 2006-02-09 | 2006-08-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-10 | 2010-02-09 | 2010-08-11 | $7700.00 | Window Closed / Lapsed |