Patent US6002171A successfully refreshed from Google Patents.
US6002171A
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US
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Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package
Assignee: Bell Semiconductor LLC
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Filing: 1997-09-22
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Granted: 1999-12-14
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Expires: 2017-09-22
Abstract
Abstract Provided is a multi-piece integrated heat spreader/stiffener assembly which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener assembly has two pieces, both composed of a high modulus, high thermal conductivity material shaped to attach to each other and a die on the surface of a packaging substrate. A first piece of this assembly is bonded to the substrate surface adjacent to an electrically connected die and to the top surface of the die prior to the dispensation and curing of underfill material which provides the mechanical connection between the die and the substrate. With the first piece of the assembly in place, access may still be had to at least one edge of the die to dispense and cure the underfill epoxy. Once the underfill material is cured by heating, the second piece of the assembly is placed and bonded on the substrate either abutting or overlapping with the first piece. A ball grid array (BGA) process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.
Inventors
- 👤 Kishor V. Desai
- 👤 Sunil A. Patel
- 👤 John P. McCormick
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 01:15
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W74/00; H10W74/10; H10W74/15; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
161 words
An integrated heat spreader/stiffener assembly for securing a semiconductor die to a packaging substrate comprising: a packaging substrate; a semiconductor die mounted on the substrate; a first piece comprising a material, the first piece having, a top portion, a circumferential side region attached to said top portion, and a cavity partially defined by said top portion and said circumferential side region, the top of said cavity covering said semiconductor die and the circumferential side region of said cavity partially enclosing said semiconductor die; wherein said first piece of said integrated heat spreader/stiffener assembly is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die relative to said substrate; and one or more additional pieces, at least one of which is coupled to said first piece such that said die is enclosed by a combination of said first piece and said one or more additional pieces.
Claim 2
Dependent Claim
161 words
An integrated heat spreader/stiffener assembly for securing a semiconductor die to a packaging substrate comprising: a packaging substrate; a semiconductor die mounted on the substrate; a first piece comprising a material, the first piece having, a top portion, a circumferential side region attached to said top portion, and a cavity partially defined by said top portion and said circumferential side region, the top of said cavity covering said semiconductor die and the circumferential side region of said cavity partially enclosing said semiconductor die; wherein said first piece of said integrated heat spreader/stiffener assembly is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die relative to said substrate; and one or more additional pieces, at least one of which is coupled to said first piece such that said die is enclosed by a combination of said first piece and said one or more additional pieces.
Claim 3
Dependent Claim
49 words
The integrated heat spreader/stiffener assembly of claim 1 wherein said first piece and at least one of said one or more additional pieces are comprised of a material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm·K.
Claim 4
Dependent Claim
14 words
The integrated heat spreader/stiffener assembly of claim 2, wherein said material comprises nickel-plated copper.
Claim 5
Dependent Claim
19 words
The integrated heat spreader/stiffener assembly of claim 3, wherein said nickel-plated copper is about 10 to 50 mils thick.
Claim 6
Dependent Claim
21 words
The integrated heat spreader/stiffener assembly of claim 1, wherein said top portion of said first piece is substantially square in shape.
Claim 7
Dependent Claim
32 words
The integrated heat spreader/stiffener assembly of claim 5, wherein said cavity is about 15.5 to 20 mm long, by about 15.5 to 20 mm wide, by about 0.4 to 0.6 mm deep.
Claim 8
Dependent Claim
26 words
The integrated heat spreader/stiffener assembly of claim 6, wherein said cavity is about 16 mm long, by about 16 mm wide, by about 0.5 mm deep.
Claim 9
Dependent Claim
23 words
The integrated heat spreader/stiffener assembly of claim 1 wherein at least one of said one or more additional pieces abuts said first piece.
Claim 10
Dependent Claim
23 words
The integrated heat spreader/stiffener assembly of claim 1 wherein at least one of said one or more additional pieces overlaps said first piece.
Claim 11
Dependent Claim
240 words
A semiconductor package, comprising: a packaging substrate having a top side and an underside; a semiconductor die having an active surface, a top surface and a perimeter, said active surface of said die bonded to the top side of said substrate; an underfill material substantially disposed between said die and said substrate; and a first assembly comprising one or more pieces bonded to said top surface of said die and to said top side of said substrate, said first assembly comprising, a top portion, a circumferential side region, and a cavity partially defined by said top portion and said circumferential side region, the top of said cavity covering and the circumferential side region of said cavity partially enclosing the semiconductor die mounted on the packaging substrate+; and a second assembly comprising one or more pieces distinct from said one or more pieces of said first assembly, said second assembly attached to the top portion of said first assembly such that a plane defined by an interface between said first assembly and said second assembly is substantially perpindicular to a plane defined by the top side of said substrate; wherein said first piece is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die relative to said substrate; and said semiconductor die is enclosed by a structure comprising said first piece and said second piece.
Claim 12
Dependent Claim
240 words
A semiconductor package, comprising: a packaging substrate having a top side and an underside; a semiconductor die having an active surface, a top surface and a perimeter, said active surface of said die bonded to the top side of said substrate; an underfill material substantially disposed between said die and said substrate; and a first assembly comprising one or more pieces bonded to said top surface of said die and to said top side of said substrate, said first assembly comprising, a top portion, a circumferential side region, and a cavity partially defined by said top portion and said circumferential side region, the top of said cavity covering and the circumferential side region of said cavity partially enclosing the semiconductor die mounted on the packaging substrate+; and a second assembly comprising one or more pieces distinct from said one or more pieces of said first assembly, said second assembly attached to the top portion of said first assembly such that a plane defined by an interface between said first assembly and said second assembly is substantially perpindicular to a plane defined by the top side of said substrate; wherein said first piece is attached to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die relative to said substrate; and said semiconductor die is enclosed by a structure comprising said first piece and said second piece.
Claim 13
Dependent Claim
20 words
The semiconductor package of claim 10, further comprising a solder ball grid array attached to the underside of said substrate.
Claim 14
Dependent Claim
14 words
The semiconductor package of claim 10, wherein said underfill material comprises a thermo-set epoxy.
Claim 15
Dependent Claim
35 words
The semiconductor package of claim 10, wherein said pieces are comprised of a material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm·K.
Claim 16
Dependent Claim
12 words
The semiconductor package of claim 13, wherein said material comprises nickel-plated copper.
Claim 17
Dependent Claim
17 words
The semiconductor package of claim 14, wherein said nickel-plated copper is about 10 to 50 mils thick.
Claim 18
Dependent Claim
19 words
The semiconductor package of claim 10, wherein said top portion of said first assembly is substantially square in shape.
Claim 19
Dependent Claim
14 words
A semiconductor package of claim 10, wherein said second assembly abuts said first assembly.
Claim 20
Dependent Claim
14 words
The semiconductor package of claim 10, wherein said second assembly overlaps said first assembly.
Claim 21
Independent Claim
132 words
An apparatus for securing a semiconductor die to a packaging substrate, comprising: a first means, comprising a material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm·K, for contacting and covering a top surface of a semiconductor die and partially circumferentially enclosing said die; and a second means, comprising material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm·K, separate from said first means, for completing the circumferential enclosure of said die; wherein said apparatus is capable of attaching to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die relative to said substrate.
Claim 22
Independent Claim
132 words
An apparatus for securing a semiconductor die to a packaging substrate, comprising: a first means, comprising a material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm·K, for contacting and covering a top surface of a semiconductor die and partially circumferentially enclosing said die; and a second means, comprising material having a modulus between about 9×10 6 and 30×10 6 psi and a thermal conductivity between about 2 and 4 W/cm·K, separate from said first means, for completing the circumferential enclosure of said die; wherein said apparatus is capable of attaching to said die and to said packaging substrate to hold said die substantially in place on said substrate, and substantially prevent warpage of said die relative to said substrate.
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| 3.5 Years (Year 4) | 2002-12-13 | 2003-06-14 | 2003-12-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-13 | 2007-06-14 | 2007-12-14 | $3760.00 | Window Closed / Lapsed |
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