Abstract A method to achieve good stepper focus and exposure over an entire wafer for a particular mask level before the start of a product run is described. This method can also be used to produce a characterization of lens field curvature (i.e., a surface of optimum focus across the lens) and to characterize lens astigmatism, defocus sensitivity, relative resolution, and other characteristics, and to check the stepper for optical column tilt. The process prevents the complexities of resist development from affecting determination of focus. The process involves forming an array of latent images in a resist and examining the scattered light from the edges of the latent images. Analysis of the scattered light quickly provides information on correct exposure and focus together with lens characteristics over the printing field.
A method comprising: providing a substrate, having a resist, to a lithography tool; forming a full field array having first elements of latent images in said resist, each first element of said full field array being a sub field array having second elements, each second element of said sub field array being a feature clump having third elements, each element of said feature clump being a feature group having fourth elements, each feature clump being characterized by at least one predetermined lithographic parameter; interrogating selected feature groups to measure scattered energy; displaying for each sub field array the scattered energy of each said feature group as a function of the associated lithographic parameter of its respective feature clump; adjusting said lithography tool so that said scattered energies of selected feature groups tend towards a desired value; and providing a wafer to said lithography tool and forming at least one integrated circuit upon said wafer.
Claim 2
Independent Claim
154 words
A method comprising: providing a substrate, having a resist, to a lithography tool; forming a full field array having first elements of latent images in said resist, each first element of said full field array being a sub field array having second elements, each second element of said sub field array being a feature clump having third elements, each element of said feature clump being a feature group having fourth elements, each feature clump being characterized by at least one predetermined lithographic parameter; interrogating selected feature groups to measure scattered energy; displaying for each sub field array the scattered energy of each said feature group as a function of the associated lithographic parameter of its respective feature clump; adjusting said lithography tool so that said scattered energies of selected feature groups tend towards a desired value; and providing a wafer to said lithography tool and forming at least one integrated circuit upon said wafer.