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Patent US5986346A successfully refreshed from Google Patents.
US5986346A
Expired / Lapsed
US
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Semiconductor device with improved pad connection
Assignee: Socionext Inc
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Filing: 1999-03-22
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Granted: 1999-11-16
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Expires: 2019-03-22
Abstract
Abstract A semiconductor device includes a semiconductor chip and a wiring formed on the chip. An interlayer film is located on the wiring. A pad is located on the interlayer film and is connected to the wiring with contacts that extend from the wiring, through the interlayer film, to the pad. The contacts include a first group of contacts located near the perimeter of the pad and a second group of pads located near the center of the pad. By limiting the number and placement of the contacts, the pad allows for a secure connection between the pad and the wiring and between the pad and a bonding wire.
Inventors
- 👤 Takahiro Katoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:44
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10P; H10P14/00; H10P14/40; H10W70/00; H10W70/60; H10W72/071; H10W72/075; H10W72/07551; H10W72/07553; H10W72/50; H10W72/531; H10W72/536; H10W72/541; H10W72/5449; H10W72/59; H10W72/921; H10W72/923; H10W72/9232; H10W72/931; H10W72/932; H10W72/934; H10W72/951
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
94 words
A semiconductor device comprising: a semiconductor chip; a wiring formed on the semiconductor chip; an interlayer film disposed on top of the wiring; a pad disposed on top of the interlayer film and including an outer edge and a central region; and a plurality of contacts formed within the interlayer film to interconnect the pad with the wiring, the plurality of contacts including first and second contact groups which are disposed in an offset manner so as to be locally concentrated along the outer edge and in the central region, respectively, of the pad.
Claim 2
Dependent Claim
94 words
A semiconductor device comprising: a semiconductor chip; a wiring formed on the semiconductor chip; an interlayer film disposed on top of the wiring; a pad disposed on top of the interlayer film and including an outer edge and a central region; and a plurality of contacts formed within the interlayer film to interconnect the pad with the wiring, the plurality of contacts including first and second contact groups which are disposed in an offset manner so as to be locally concentrated along the outer edge and in the central region, respectively, of the pad.
Claim 3
Dependent Claim
19 words
The semiconductor device according to claim 1, further comprising a wire bonded to the central region of the pad.
Claim 4
Dependent Claim
27 words
The semiconductor device according to claim 2, wherein the contacts of the first contact group are disposed at equal intervals around the outer edge of the pad.
Claim 5
Dependent Claim
33 words
The semiconductor device according to claim 3, wherein the contacts of the second contact group are disposed in the central region of the pad so as to radially extend from a center thereof.
Claim 6
Dependent Claim
26 words
The semiconductor device according to claim 3, wherein the contacts of the second contact group are disposed at an equal spacing and form a frame configuration.
Claim 7
Dependent Claim
32 words
The semiconductor device according to claim 2, wherein the pad is substantially rectangular and the contacts of the first contact group are disposed at at least the four corners of the pad.
Claim 8
Dependent Claim
28 words
The semiconductor device according to claim 6, wherein the contacts of the second contact group are disposed so as to radially extend from the center of the pad.
Claim 9
Dependent Claim
25 words
The semiconductor device according to claim 6, wherein the contacts of the second contact group are substantially disposed only at central positions within the pad.
Claim 10
Dependent Claim
28 words
The semiconductor device according to claim 2, wherein the number of contacts in the second contact group assures a given bonding strength between the pad and the wiring.
Claim 11
Dependent Claim
28 words
The semiconductor device according to claim 2, wherein the number of contacts in the second contact group assures a given bonding strength between the pad and the wire.
Claim 12
Dependent Claim
33 words
The semiconductor device according to claim 2, wherein the number of contacts in the second contact group is chosen in accordance with an area designated for bonding between the pad and the wire.
Claim 13
Dependent Claim
83 words
A semiconductor device comprising: a semiconductor chip; a wiring formed on the semiconductor chip; an interlayer film disposed on top of the wiring; a pad disposed on top of the interlayer film and including an outer edge and a central region; and first and second contacts formed within the interlayer film for interconnecting the wiring with the pad, the first contact being disposed along the outer edge of the pad and the second contact being disposed in the central region of the pad.
Claim 14
Dependent Claim
83 words
A semiconductor device comprising: a semiconductor chip; a wiring formed on the semiconductor chip; an interlayer film disposed on top of the wiring; a pad disposed on top of the interlayer film and including an outer edge and a central region; and first and second contacts formed within the interlayer film for interconnecting the wiring with the pad, the first contact being disposed along the outer edge of the pad and the second contact being disposed in the central region of the pad.
Claim 15
Dependent Claim
19 words
The semiconductor device according to claim 12 further comprising a wire bonded to the central region of the pad.
Claim 16
Dependent Claim
15 words
The semiconductor device according to claim 11, wherein the first contact forms a closed loop.
Claim 17
Dependent Claim
16 words
The semiconductor device according to claim 11, wherein the first contact comprises a plurality of contacts.
Claim 18
Dependent Claim
16 words
The semiconductor device according to claim 11, wherein the second contact comprises a plurality of contacts.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-15 | 2003-05-17 | 2003-11-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-15 | 2007-05-17 | 2007-11-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-15 | 2011-05-17 | 2011-11-16 | $7700.00 | Window Closed / Lapsed |