Patent US5982633A successfully refreshed from Google Patents.
US5982633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Opposed ball grid array mounting
Assignee: Hewlett Packard Development Co LP
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Filing: 1997-08-20
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Granted: 1999-11-09
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Expires: 2017-08-20
Abstract
Abstract A printed circuit board or card includes a pair of ball grid array packages connected one over the other on opposite sides of the board or card. The packages may connect through feed-through vias so that board space on the underside of the board, populated by feed-through vias, can be utilized to provide additional functionality. In one implementation, GTL resistive terminations and decoupling capacitors may be included in the ball grid array package on the underside of the board or card.
Inventors
- 👤 Jeff K. Jeansonne
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:05
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0237; H05K1/0246; H05K1/18; H05K1/181; H05K1/0216; H05K1/023; H05K1/0231; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10022; H05K2201/10431; H05K2201/10507; H05K2201/10545; H05K2201/10613; H05K2201/10621; H05K2201/10734; H10; H10W; H10W90/00; H10W90/701; H10W90/731; H10W90/734; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
122 words
A board for connecting electronic devices, said board having opposing first and second sides, said board comprising: a first ball grid array package mounted on the first side of the board; a second ball grid array package mounted on the second side of the board; a plurality of feed-through vias extending through said board to connect said first ball grid array package to said second ball grid array package; an integrated circuit (IC) mounted on said board connected to said first ball grid array package through a plurality of signal paths; and wherein said second ball grid array package includes pull-up resistors connected to said vias to pull high the signal paths between said IC and said first ball grid array package.
Claim 2
Dependent Claim
122 words
A board for connecting electronic devices, said board having opposing first and second sides, said board comprising: a first ball grid array package mounted on the first side of the board; a second ball grid array package mounted on the second side of the board; a plurality of feed-through vias extending through said board to connect said first ball grid array package to said second ball grid array package; an integrated circuit (IC) mounted on said board connected to said first ball grid array package through a plurality of signal paths; and wherein said second ball grid array package includes pull-up resistors connected to said vias to pull high the signal paths between said IC and said first ball grid array package.
Claim 3
Dependent Claim
14 words
The board of claim 1 wherein said second ball grid array includes decoupling capacitors.
Claim 4
Dependent Claim
11 words
The board of claim 2 wherein said IC is a processor.
Claim 5
Dependent Claim
12 words
The board of claim 3 wherein said processor uses Gunning transceiver logic.
Claim 6
Dependent Claim
21 words
The board of claim 1 wherein said first and second ball grid array packages are situated one directly above the other.
Claim 7
Dependent Claim
25 words
The board of claim 5 wherein each of said ball grid array packages has solder balls, said balls of each package having the same arrangement.
Claim 8
Dependent Claim
17 words
The board of claim 1 wherein said IC is mounted on the first side of the board.
Claim 9
Dependent Claim
16 words
The board of claim 1 wherein said plurality of pull-up resistors includes more than 100 resistors.
Claim 10
Dependent Claim
91 words
A computer system comprising: a board; a processor mounted on said board; a bridge mounted on said board in a first ball grid array package and connected to said processor; signal lines connecting said processor to said bridge; a second ball grid array package connected to said first ball grid array package through said board, said second ball grid array containing decoupling capacitors connected to power and ground planes and pull-up resistors connected to said signal lines to pull said signal lines high; and an input/output device coupled to the processor.
Claim 11
Dependent Claim
91 words
A computer system comprising: a board; a processor mounted on said board; a bridge mounted on said board in a first ball grid array package and connected to said processor; signal lines connecting said processor to said bridge; a second ball grid array package connected to said first ball grid array package through said board, said second ball grid array containing decoupling capacitors connected to power and ground planes and pull-up resistors connected to said signal lines to pull said signal lines high; and an input/output device coupled to the processor.
Claim 12
Dependent Claim
19 words
The system of claim 9 wherein said first and second ball grid array packages are connected through feed-through vias.
Claim 13
Dependent Claim
12 words
The system of claim 9 wherein said system uses Gunning transceiver logic.
Claim 14
Dependent Claim
14 words
The system of claim 9 wherein said input/output device is connected to said bridge.
Claim 15
Dependent Claim
12 words
The system of claim 9 wherein said input/output device is a monitor.
Claim 16
Dependent Claim
12 words
The system of claim 9 wherein said input/output device is a keyboard.
Claim 17
Dependent Claim
13 words
The system of claim 9 wherein said input/output device is a disk drive.
Claim 18
Independent Claim
118 words
A method for connecting ball grid array packages to a board comprising the steps of: securing a first ball grid array package to a first surface of said board; securing a second ball grid array package containing decoupling capacitors to said board on the opposite side of said board directly beneath said first ball grid array package; and connecting said decoupling capacitors to power and ground planes; securing an integrated circuit to the board; and connecting the integrated circuit to the first ball array package by way of a plurality of signal paths; and electrically connecting pull-up resistors within the second ball array package to the signal paths between the integrated circuit and the first ball array package.
Claim 19
Independent Claim
118 words
A method for connecting ball grid array packages to a board comprising the steps of: securing a first ball grid array package to a first surface of said board; securing a second ball grid array package containing decoupling capacitors to said board on the opposite side of said board directly beneath said first ball grid array package; and connecting said decoupling capacitors to power and ground planes; securing an integrated circuit to the board; and connecting the integrated circuit to the first ball array package by way of a plurality of signal paths; and electrically connecting pull-up resistors within the second ball array package to the signal paths between the integrated circuit and the first ball array package.
Claim 20
Dependent Claim
16 words
The method of claim 16 including the step of electrically connecting said packages through said board.
Claim 21
Dependent Claim
26 words
The method of claim 17 including the step of connecting one of said packages to the other by way of feed through vias through said board.
Claim 22
Dependent Claim
26 words
The method of claim 18 including the step of causing the solder balls of each package to align with the solder balls of the other package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-08 | 2003-05-10 | 2003-11-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-08 | 2007-05-10 | 2007-11-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-08 | 2011-05-10 | 2011-11-09 | $7700.00 | Window Closed / Lapsed |