US5729438A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Discrete component pad array carrier
Assignee: NXP USA Inc
•
Filing: 1996-06-07
•
Granted: 1998-03-17
•
Expires: 2016-06-07
Abstract
Abstract A pad array carrier module for packaging discrete electronic components is provided. A circuit substrate (8) contains component mounting pad pairs (20), each consisting of a power pad (22) and a ground pad (21), on a first side (10). Component mounting pads are electrically connected by circuit traces (23), through conductive vias (14), to terminal solder pads (16) on the second side (12) of the circuit substrate. Some of the ground pads are connected to a common ground solder pad (17). Likewise, some of the power pads are connected to a common supply voltage solder pad (19). Solder spheres (18) are attached to the solder pads. Discrete electronic components (24) are conductively coupled (26) to the component-mounting pad pairs.
Inventors
- 👤 Kevin J. Pieper
- 👤 Mitra E. Geeban
- 👤 Richard J. Kolcz
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 03:06
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/181; H05K1/02; H05K1/0213; H05K1/0216; H05K1/023; H05K1/14; H05K1/141; H05K1/0231; H05K1/16; H05K1/167; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10022; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K2201/10734; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/36; H05K3/368; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
182 words
A ball grid array module with non-semiconductor discrete electronic components, comprising: a circuit substrate having opposing first and second sides electrically connected by a plurality of conductive vias in said substrate, and terminal solder pads on the second side, displaced away from said vias and connected to the vias; a plurality of component-mounting pad pairs disposed on said first side, each of said pad pairs consisting of a ground pad and a power pad, said power pads connected to the vias by a circuit trace; some of the ground pads on said first side electrically connected to a circuit ground solder pad on said second side by one or more of the vias; some of the power pads on said first side electrically connected to a supply voltage solder pad on said second side by one or more of the vias; solder spheres attached to said terminal solder pads; a plurality of discrete components, each component conductively coupled to a component-mounting pad pair, all of said discrete components being non-semiconducting: and wherein an integrated circuit is not attached to said circuit substrate.
Claim 2
Dependent Claim
182 words
A ball grid array module with non-semiconductor discrete electronic components, comprising: a circuit substrate having opposing first and second sides electrically connected by a plurality of conductive vias in said substrate, and terminal solder pads on the second side, displaced away from said vias and connected to the vias; a plurality of component-mounting pad pairs disposed on said first side, each of said pad pairs consisting of a ground pad and a power pad, said power pads connected to the vias by a circuit trace; some of the ground pads on said first side electrically connected to a circuit ground solder pad on said second side by one or more of the vias; some of the power pads on said first side electrically connected to a supply voltage solder pad on said second side by one or more of the vias; solder spheres attached to said terminal solder pads; a plurality of discrete components, each component conductively coupled to a component-mounting pad pair, all of said discrete components being non-semiconducting: and wherein an integrated circuit is not attached to said circuit substrate.
Claim 3
Dependent Claim
19 words
The ball grid array module of claim 1, wherein said discrete components are soldered to said component-mounting pad pairs.
Claim 4
Dependent Claim
14 words
The ball grid array module of claim 1, wherein said discrete components are leadless.
Claim 5
Dependent Claim
20 words
The ball grid array module of claim 1, wherein said circuit substrate consists of a glass-reinforced printed circuit board material.
Claim 6
Dependent Claim
18 words
The ball grid array module of claim 1, wherein said circuit substrate consists of a flexible film material.
Claim 7
Dependent Claim
16 words
The ball grid array module of claim 1, wherein said discrete components have mixed electrical values.
Claim 8
Dependent Claim
19 words
The ball grid array module of claim 1, wherein said discrete components are either rectangular or cylindrical in shape.
Claim 9
Dependent Claim
17 words
The ball grid array module of claim 1, wherein said discrete components consist of thick film components.
Claim 10
Dependent Claim
24 words
The ball grid array module of claim 1, further comprising a protection means overlying at least the discrete components on said substrate first side.
Claim 11
Dependent Claim
15 words
The ball grid array module of claim 1, wherein said discrete components are substantially exposed.
Claim 12
Dependent Claim
15 words
The ball grid array module of claim 1, wherein said discrete components are uniformly spaced.
Claim 13
Dependent Claim
19 words
The ball grid array module of claim 1, wherein said terminal solder pads are arranged in a regularly-spaced array.
Claim 14
Dependent Claim
23 words
The ball grid array module of claim 1, wherein at least 10 terminal solder pads are disposed on said circuit substrate second side.
Claim 15
Dependent Claim
24 words
The ball grid array module of claim 1, wherein between 10 and 100 terminal solder pads are disposed on said circuit substrate second side.
Claim 16
Dependent Claim
24 words
The ball grid array module of claim 1, wherein between 100 and 250 terminal solder pads are disposed on said circuit substrate second side.
Claim 17
Dependent Claim
185 words
A ball grid array printed circuit board resistor network module, comprising: a printed circuit board having opposing first and second sides electrically connected by a plurality of conductive vias in said printed circuit board, and terminal solder pads on the second side, displaced away from said vias and connected to the vias; a plurality of component-mounting pad pairs disposed on said first side, each of said pad pairs consisting of a ground pad and a power pad, said power pads connected to the vias by a circuit trace; some of the ground pads on said first side electrically connected to a circuit ground solder pad on said second side by one or more of the vias; some of the power pads on said first side electrically connected to a supply voltage solder pad on said second side by one or more of the vias; solder spheres attached to said terminal solder pads; a plurality of leadless resistors, each resistor conductively coupled to a component-mounting pad pair, all of said leadless resistors being non-semiconducting: and wherein an integrated circuit is not attached to said circuit substrate.
Claim 18
Dependent Claim
185 words
A ball grid array printed circuit board resistor network module, comprising: a printed circuit board having opposing first and second sides electrically connected by a plurality of conductive vias in said printed circuit board, and terminal solder pads on the second side, displaced away from said vias and connected to the vias; a plurality of component-mounting pad pairs disposed on said first side, each of said pad pairs consisting of a ground pad and a power pad, said power pads connected to the vias by a circuit trace; some of the ground pads on said first side electrically connected to a circuit ground solder pad on said second side by one or more of the vias; some of the power pads on said first side electrically connected to a supply voltage solder pad on said second side by one or more of the vias; solder spheres attached to said terminal solder pads; a plurality of leadless resistors, each resistor conductively coupled to a component-mounting pad pair, all of said leadless resistors being non-semiconducting: and wherein an integrated circuit is not attached to said circuit substrate.
Claim 19
Dependent Claim
19 words
The ball grid array module of claim 16, wherein said leadless resistors are soldered to said component-mounting pad pairs.
Claim 20
Dependent Claim
15 words
The printed circuit board module of claim 16, wherein said resistors have mixed resistance values.
Claim 21
Dependent Claim
17 words
The printed circuit board module of claim 16, wherein said leadless resistors consist of thick film resistors.
Claim 22
Dependent Claim
22 words
The printed circuit board module of claim 16, further comprising a protection means overlying at least the resistors on said first side.
Claim 23
Dependent Claim
15 words
The printed circuit board module of claim 16, wherein said leadless resistors are substantially exposed.
Claim 24
Dependent Claim
25 words
The printed circuit board module of claim 16, wherein between 10 and 100 terminal solder pads are disposed on said printed circuit board second side.
Claim 25
Dependent Claim
184 words
A ball grid array printed circuit board capacitor network module, comprising: a printed circuit board having opposing first and second sides electrically connected by a plurality of conductive vias in said printed circuit board, and terminal solder pads on the second side, displaced away from said vias and connected to the vias; a plurality of component-mounting pad pairs disposed on said first side, each of said pad pairs consisting of a ground pad and a power pad, said power pads connected to the vias by a circuit trace; some of the ground pads on said first side electrically connected to a circuit ground solder pad on said second side by one or more of the vias; some of the power pads on said first side electrically connected to a supply voltage solder pad on said second side by one or more of the vias; solder spheres attached to said terminal solder pads; a plurality of leadless capacitors, each capacitor conductively coupled to a component-mounting pad pair, all of said capacitors being non-semiconducting: and wherein an integrated circuit is not attached to said circuit substrate.
Claim 26
Dependent Claim
184 words
A ball grid array printed circuit board capacitor network module, comprising: a printed circuit board having opposing first and second sides electrically connected by a plurality of conductive vias in said printed circuit board, and terminal solder pads on the second side, displaced away from said vias and connected to the vias; a plurality of component-mounting pad pairs disposed on said first side, each of said pad pairs consisting of a ground pad and a power pad, said power pads connected to the vias by a circuit trace; some of the ground pads on said first side electrically connected to a circuit ground solder pad on said second side by one or more of the vias; some of the power pads on said first side electrically connected to a supply voltage solder pad on said second side by one or more of the vias; solder spheres attached to said terminal solder pads; a plurality of leadless capacitors, each capacitor conductively coupled to a component-mounting pad pair, all of said capacitors being non-semiconducting: and wherein an integrated circuit is not attached to said circuit substrate.
Claim 27
Dependent Claim
19 words
The ball grid array module of claim 23, wherein said leadless capacitors are soldered to said component-mounting pad pairs.
Claim 28
Dependent Claim
15 words
The printed circuit board module of claim 23, wherein said capacitors have mixed resistance values.
Claim 29
Dependent Claim
17 words
The printed circuit board module of claim 23, wherein said leadless capacitors consist of thick film capacitors.
Claim 30
Dependent Claim
22 words
The printed circuit board module of claim 23, further comprising a protection means overlying at least the capacitors on said first side.
Claim 31
Dependent Claim
15 words
The printed circuit board module of claim 23, wherein said leadless capacitors are substantially exposed.
Claim 32
Dependent Claim
25 words
The printed circuit board module of claim 23, wherein between 10 and 100 terminal solder pads are disposed on said printed circuit board second side.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-16 | 2001-09-15 | 2002-03-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-16 | 2005-09-15 | 2006-03-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-16 | 2009-09-15 | 2010-03-17 | $7700.00 | Window Closed / Lapsed |