US5982026A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Inexpensive resin molded semiconductor device
Assignee: NEC Electronics Corp
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Filing: 1997-07-16
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Granted: 1999-11-09
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Expires: 2017-07-16
Abstract
Abstract In a resin molded semiconductor device, a metal lead frame includes an island and leads, and the leads have bulged terminal portions. Also, a semiconductor chip is mounted on the island, and external terminals are adhered to the bulged terminal portions opposite to the semiconductor chip. Further, an envelope of resin encapsulates the metal lead frame, the semiconductor chip and a part of each of the external terminals.
Inventors
- 👤 Youichi Tsunoda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 01:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/464; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/50; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
85 words
A resin molded semiconductor device comprising: a metal lead frame including an island and leads, said leads having bulged terminal portions; a semiconductor chip mounted on said island; external terminals adhered to said bulged terminal portions opposite to said semiconductor chip; and an envelope of resin for encapsulating said metal lead frame, said semiconductor chip and a part of each of said external terminals, wherein recess portions and protrusion portions each corresponding to one of said recess portions are formed in said bulged terminal portions.
Claim 2
Dependent Claim
85 words
A resin molded semiconductor device comprising: a metal lead frame including an island and leads, said leads having bulged terminal portions; a semiconductor chip mounted on said island; external terminals adhered to said bulged terminal portions opposite to said semiconductor chip; and an envelope of resin for encapsulating said metal lead frame, said semiconductor chip and a part of each of said external terminals, wherein recess portions and protrusion portions each corresponding to one of said recess portions are formed in said bulged terminal portions.
Claim 3
Dependent Claim
26 words
The device as set forth in claim 1, wherein each of said external terminals comprises a solder ball in contact with one of said protrusion portions.
Claim 4
Dependent Claim
26 words
The device as set forth in claim 1, wherein each of said external terminals comprises a flanged pin in contact with one of said recess portions.
Claim 5
Dependent Claim
20 words
The device as set forth in claim 1, wherein said semiconductor chip is connected by bonding wire to said leads.
Claim 6
Dependent Claim
85 words
A resin molded semiconductor device comprising: a metal lead frame including an island and leads, said leads having bulged terminal portions, recess portions and protrusion portions in combination being formed in said bulged terminal portions; a semiconductor chip mounted on said island and connected by bonding wire to said leads; solder balls adhered at said protrusion portions opposite to said semiconductor chip; and an envelope of resin for encapsulating said metal lead frame, said semiconductor chip and a part of each of said solder balls.
Claim 7
Dependent Claim
85 words
A resin molded semiconductor device comprising: a metal lead frame including an island and leads, said leads having bulged terminal portions, recess portions and protrusion portions in combination being formed in said bulged terminal portions; a semiconductor chip mounted on said island and connected by bonding wire to said leads; solder balls adhered at said protrusion portions opposite to said semiconductor chip; and an envelope of resin for encapsulating said metal lead frame, said semiconductor chip and a part of each of said solder balls.
Claim 8
Dependent Claim
85 words
A resin molded semiconductor device comprising: a metal lead frame including an island and leads, said leads having bulged terminal portions, recess portions and protrusion portions in combination being formed in said bulged terminal portions; a semiconductor chip mounted on said island and connected by bonding wire to said leads; flanged pins adhered at said recess portions opposite to said semiconductor chip; and an envelope of resin for encapsulating said metal lead frame, said semiconductor chip and a part of each of said flanged pins.
Claim 9
Dependent Claim
85 words
A resin molded semiconductor device comprising: a metal lead frame including an island and leads, said leads having bulged terminal portions, recess portions and protrusion portions in combination being formed in said bulged terminal portions; a semiconductor chip mounted on said island and connected by bonding wire to said leads; flanged pins adhered at said recess portions opposite to said semiconductor chip; and an envelope of resin for encapsulating said metal lead frame, said semiconductor chip and a part of each of said flanged pins.
Claim 10
Dependent Claim
71 words
The metal lead frame used for a soldered semiconductor device, comprising: an island for mounting a semiconductor chip; suspenders, connected to said island, for supporting said island; tie bars for avoiding resin leakage; leads, connected to said tie bars; and a frame, connected to said suspenders, said tie bars and said leads, said leads having bulged terminal portions, wherein recess portions and protrusion portions are formed in said bulged terminal portions.
Claim 11
Dependent Claim
71 words
The metal lead frame used for a soldered semiconductor device, comprising: an island for mounting a semiconductor chip; suspenders, connected to said island, for supporting said island; tie bars for avoiding resin leakage; leads, connected to said tie bars; and a frame, connected to said suspenders, said tie bars and said leads, said leads having bulged terminal portions, wherein recess portions and protrusion portions are formed in said bulged terminal portions.
References Cited (Backward Citations)
JPS63190370A
Cited
US5045921A
Cited
US5317188A
Cited
US5293072A
Cited
US5389739A
Cited
US5717252A
Cited
US5668405A
Cited
JPH08139259A
Cited
US5729051A
Cited
US5663594A
Cited
US5677566A
Cited
US5663593A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-08 | 2003-05-10 | 2003-11-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-08 | 2007-05-10 | 2007-11-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-08 | 2011-05-10 | 2011-11-09 | $7700.00 | Window Closed / Lapsed |