Semiconductor device having spherical terminals attached to the lead frame embedded within the package body

Claim 2

A semiconductor device accommodated in a package, comprising: a semiconductor chip; a package body for accommodating the semiconductor chip, said package body comprising a metallic lead frame having a bottom surface; and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from the bottom surface, each of said terminal members being of a spherical form, of a substantially identical diameter, the respective, uppermost surfaces of the spherical terminal members being fused to and thereby embedded in respective, fused regions of the bottom surface of the lead frame, the respective terminal members thereby being retained within said package body and prevented from coming off.

Claim 3

A semiconductor device as claimed in claim 1 in which each of said plurality of terminal members is of an identical diameter of approximately 1 mm.

Claim 4

A semiconductor device as claimed in claim 1 in which each of said plurality of terminal members projects from the bottom surface of the package body by a substantially common distance.

Claim 5

A semiconductor device as claimed in claim 3 in which said respective distances of projection of said terminal members vary from an identical distance by an amount of less than 5 μm.

Claim 6

A semiconductor device accommodated in a package, comprising: a semiconductor chip; a package body for accommodating the semiconductor chip, said package body comprising a metallic lead frame having a top surface and a bottom surface; and a plurality of terminal members of a fusible metallic material selectively, electrically connected to the semiconductor chip, each of said terminal members having a spherical form of a substanstially identical diameter and the plurality of terminal members having uppermost surfaces lying substantially in a common plane and defining corresponding positions relative to the bottom surface of the lead frame, the lead frame having a plurality of fused regions extending therethrough from the upper surface to the bottom surface thereof and respectively in alignment with the corresponding positions of the plurality of spherical terminal members, the plurality of fused regions furthermore encompassing the uppermost surfaces of the respective spherical terminal members such that at least the uppermost surfaces of the spherical terminal members are embedded in and integral with the respective fused regions of the lead frame, the spherical terminal members thereby being retained within said package body and prevented from coming off while protruding therefrom by a common distance and being connected through the respective fused regions to the semiconductor chip.

Claim 7

A semiconductor device accommodated in a package, comprising: a semiconductor chip; a package body for accommodating the semiconductor chip, said package body comprising a metallic lead frame having a top surface and a bottom surface; and a plurality of terminal members of a fusible metallic material selectively, electrically connected to the semiconductor chip, each of said terminal members having a spherical form of a substanstially identical diameter and the plurality of terminal members having uppermost surfaces lying substantially in a common plane and defining corresponding positions relative to the bottom surface of the lead frame, the lead frame having a plurality of fused regions extending therethrough from the upper surface to the bottom surface thereof and respectively in alignment with the corresponding positions of the plurality of spherical terminal members, the plurality of fused regions furthermore encompassing the uppermost surfaces of the respective spherical terminal members such that at least the uppermost surfaces of the spherical terminal members are embedded in and integral with the respective fused regions of the lead frame, the spherical terminal members thereby being retained within said package body and prevented from coming off while protruding therefrom by a common distance and being connected through the respective fused regions to the semiconductor chip.

Claim 8

A semiconductor device accommodated in a package, comprising: a semiconductor chip; a package body for accommodating the semiconductor chip, said package body comprising a metallic lead frame having a top surface and a bottom surface; the package body comprising a plastic material encapsulating the semiconductor chip and the metallic lead frame therewithin and having a plurality of openings formed in a bottom portion thereof and exposing therethrough corresponding positions on the bottom surface of the metallic lead frame; and a plurality of terminal members of a fusible metallic material selectively, electrically connected to the semiconductor chip, each of said terminal members having a spherical form of a substantially identical diameter, the depth of each opening in the package body being less than the diameter, but greater than half the diameter, of the spherical terminal members, at least the surface of each terminal member and the bottom surface of the metallic lead frame being formed of a low melting temperature material, the plurality of terminal members being received, respectively, in the plurality of openings and having uppermost surfaces lying substantially in a common plane and integrally interconnected with the metallic lead frame, at the respective positions on the bottom surface of the metallic lead frame, by corresponding fused regions produced by annealing same together, the spherical terminal members thereby being embedded in said package body and retained with at least the uppermost surfaces thereof embedded in and integral with the respective fused regions of the metallic lead frame and thereby being retained within said package and prevented from coming off, while protruding from the respective openings by a common distance and being connected through the respective fused regions to the semiconductor chip.

Claim 9

A semiconductor device accommodated in a package, comprising: a semiconductor chip; a package body for accommodating the semiconductor chip, said package body comprising a metallic lead frame having a top surface and a bottom surface; the package body comprising a plastic material encapsulating the semiconductor chip and the metallic lead frame therewithin and having a plurality of openings formed in a bottom portion thereof and exposing therethrough corresponding positions on the bottom surface of the metallic lead frame; and a plurality of terminal members of a fusible metallic material selectively, electrically connected to the semiconductor chip, each of said terminal members having a spherical form of a substantially identical diameter, the depth of each opening in the package body being less than the diameter, but greater than half the diameter, of the spherical terminal members, at least the surface of each terminal member and the bottom surface of the metallic lead frame being formed of a low melting temperature material, the plurality of terminal members being received, respectively, in the plurality of openings and having uppermost surfaces lying substantially in a common plane and integrally interconnected with the metallic lead frame, at the respective positions on the bottom surface of the metallic lead frame, by corresponding fused regions produced by annealing same together, the spherical terminal members thereby being embedded in said package body and retained with at least the uppermost surfaces thereof embedded in and integral with the respective fused regions of the metallic lead frame and thereby being retained within said package and prevented from coming off, while protruding from the respective openings by a common distance and being connected through the respective fused regions to the semiconductor chip.