US5969426A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrateless resin encapsulated semiconductor device
Assignee: Renesas Electronics Corp
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Filing: 1995-12-13
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Granted: 1999-10-19
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Expires: 2015-12-13
Abstract
Abstract A semiconductor device includes an encapsulating resin encapsulating a semiconductor substrate, a lead pattern or a laminated wiring layers transferred or secured on the lower surface of the encapsulating resin and a plurality of external electrode disposed on the lower surface of the lead pattern. The device may be manufactured by bonding a semiconductor substrate on a transferring substrate to which a lead pattern is formed, resin encapsulating an upper portion of the transferring substrate to cover the semiconductor substrate, and removing only the transferring substrate with the lead pattern left bonded to the encapsulating resin and the semiconductor substrate.
Inventors
- 👤 Shinji Baba
- 👤 Jun Shibata
- 👤 Tetsuya Ueda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 21:39
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W76/00; H10W76/40; H10W90/00; H10W90/701; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7424; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/656; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/01; H10W72/012; H10W72/01204; H10W72/01251; H10W72/01255; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/241; H10W72/242; H10W72/251; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/851; H10W72/874; H10W72/877; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W72/952; H10W74/131; H10W74/142; H10W74/15; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
124 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface and a plurality of bonding layers on the front surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead pattern exposed at the lower surface of the encapsulating resin, directly bonded to the bonding layers, and comprising a plurality of laminated wiring layers; a frame for providing rigidity, bonded to the plurality of laminated wiring layers; and a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, at least partially outside the resin encapsulation, and projecting outwardly from the lead pattern whereby the semiconductor device is free of a substrate including leads.
Claim 2
Dependent Claim
124 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface and a plurality of bonding layers on the front surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead pattern exposed at the lower surface of the encapsulating resin, directly bonded to the bonding layers, and comprising a plurality of laminated wiring layers; a frame for providing rigidity, bonded to the plurality of laminated wiring layers; and a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, at least partially outside the resin encapsulation, and projecting outwardly from the lead pattern whereby the semiconductor device is free of a substrate including leads.
Claim 3
Dependent Claim
117 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface and a plurality of bonding layers on the front surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead pattern exposed at the lower surface of the encapsulating resin, directly bonded to the bonding layers, and comprising a lead frame secured to the lower surface of the encapsulating resin; and a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, at least partially outside the resin encapsulation, and projecting outwardly from the lower surface whereby the semiconductor device is free of a substrate including leads.
Claim 4
Dependent Claim
117 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface and a plurality of bonding layers on the front surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead pattern exposed at the lower surface of the encapsulating resin, directly bonded to the bonding layers, and comprising a lead frame secured to the lower surface of the encapsulating resin; and a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, at least partially outside the resin encapsulation, and projecting outwardly from the lower surface whereby the semiconductor device is free of a substrate including leads.
Claim 5
Dependent Claim
38 words
The resin encapsulated semiconductor device free of a substrate including leads as claimed in claim 2, further comprising a bonding layer, disposed between the semiconductor chip and the lead frame, bonding the semiconductor chip to the lead pattern.
Claim 6
Dependent Claim
33 words
The resin encapsulated semiconductor device free of a substrate including leads as claimed in claim 2, wherein the lower surface of the encapsulating resin and the lead pattern are coated with a resin.
Claim 7
Dependent Claim
34 words
The resin encapsulated semiconductor device free of a substrate including leads as claimed in claim 2, wherein the lower surface of the encapsulating resin and the lead pattern are covered with an encapsulating resin.
Claim 8
Dependent Claim
31 words
The resin encapsulated semiconductor device free of a substrate including leads as claimed in claim 2, wherein the lead pattern expands externally of the encapsulating resin to define as test pad.
Claim 9
Dependent Claim
30 words
The resin encapsulated semiconductor device free of a substrate including leads as claimed in claim 2, including a plurality of semiconductor chips or electronic components embedded in the encapsulating resin.
Claim 10
Dependent Claim
34 words
The resin encapsulated semiconductor device free of a substrate including leads as claimed in claim 2, including a substrate metal layer on the semiconductor chip electrically connecting the bonding layers to the lead pattern.
Claim 11
Dependent Claim
29 words
The resin encapsulated semiconductor device free of a substrate including leads as claimed in claim 2, wherein the lower surface of the encapsulating resin is free of a substrate.
Claim 12
Dependent Claim
139 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface and a plurality of bonding layers on the front surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead pattern exposed at the lower surface of the encapsulating resin, directly bonded to the bonding layers, and comprising a plurality of laminated wiring layers; a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, located at least partially outside the resin encapsulation, and projecting outwardly from the lead pattern whereby the semiconductor device is free of a substrate including leads; and a frame surrounding the semiconductor chip, containing the encapsulating resin, and bonded to the plurality of laminated wiring layers for increasing the rigidity of the semiconductor device.
Claim 13
Dependent Claim
139 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface and a plurality of bonding layers on the front surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead pattern exposed at the lower surface of the encapsulating resin, directly bonded to the bonding layers, and comprising a plurality of laminated wiring layers; a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, located at least partially outside the resin encapsulation, and projecting outwardly from the lead pattern whereby the semiconductor device is free of a substrate including leads; and a frame surrounding the semiconductor chip, containing the encapsulating resin, and bonded to the plurality of laminated wiring layers for increasing the rigidity of the semiconductor device.
Claim 14
Dependent Claim
131 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface, a plurality of bonding layers on the front surface, and a rear surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead frame having a die pad to which the rear surface of the semiconductor chip is bonded and including a lead pattern exposed at the lower surface of the encapsulating resin and secured to the lower surface of the encapsulating resin; and a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, located at least partially outside the resin encapsulation, and projecting outwardly from the lower surface whereby the semiconductor device is free of a substrate including leads.
Claim 15
Dependent Claim
131 words
A resin encapsulated semiconductor device free of a substrate including leads comprising: a semiconductor chip having a front surface, a plurality of bonding layers on the front surface, and a rear surface; an encapsulating resin encapsulating the semiconductor chip and having a lower surface; a lead frame having a die pad to which the rear surface of the semiconductor chip is bonded and including a lead pattern exposed at the lower surface of the encapsulating resin and secured to the lower surface of the encapsulating resin; and a plurality of external electrodes disposed on the lead pattern at the lower surface of the resin encapsulation, located at least partially outside the resin encapsulation, and projecting outwardly from the lower surface whereby the semiconductor device is free of a substrate including leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-10-18 | 2003-04-19 | 2003-10-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-10-18 | 2007-04-19 | 2007-10-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-10-18 | 2011-04-19 | 2011-10-19 | $7700.00 | Window Closed / Lapsed |