Method of manufacturing multilayered circuit

Abstract

Abstract Translated from Japanese (57)【要約】 【目的】高密度で高機能の多層回路、特に薄膜多層回路 を高歩留り，短時間で製造すること。 【構成】積層する各シートは、平面方向に展開する配線 層と垂直方向に接続するバイア配線層おのおのが少なく とも１層ずつから成る単位で１シートを形成する。この 各シートにおいてはシート表面及び裏面のバイアまたは 配線の導体部に、塑性変形の容易な導体を形成するか、 あるいは前記塑性変形の容易な導体より塑性変形のしに くい導体で突起を形成する。更に、個別に形成した各シ ートを重ね、これを加圧または加熱することによりシー ト間で一方のシートの塑性変形の容易な導体と他方のシ ートのそれより塑性変形のしにくい導体とが電気的に接 続し、回路の多層化を達成する。 (57) [Abstract] [Purpose] To manufacture high-density and high-performance multilayer circuits, especially thin-film multilayer circuits with high yield and in a short time. [Structure] Each sheet to be laminated forms one sheet by a unit including at least one via wiring layer connected in a plane direction and at least one via wiring layer connected in a vertical direction. In each of these sheets, a conductor that is easily plastically deformed is formed on the conductor portion of the via or wiring on the front and back surfaces of the sheet, or Alternatively, the protrusion is formed of a conductor that is less likely to be plastically deformed than the conductor that is easily plastically deformed. Furthermore, by stacking the individually formed sheets and pressing or heating them, the conductors that are easily plastically deformed between one sheet and the conductors that are less likely to be plastically deformed than the other sheet are electrically connected between the sheets. Connect to and achieve multi-layering of the circuit.

Inventors

• 👤 Hideo Arima
• 👤 英夫 有馬

Bibliographic Details