Patent US5963792A successfully refreshed from Google Patents.
US5963792A
Expired / Lapsed
US
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Use of an oxide surface to facilitate gate break on a carrier substrate for a semiconductor device
Assignee: Micron Technology Inc
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Filing: 1998-06-09
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Granted: 1999-10-05
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Expires: 2018-06-09
Abstract
Abstract An encapsulant molding technique used in chip-on-board encapsulation wherein an oxidizable metal layer is patterned on a substrate and the oxidizable metal layer is oxidized to facilitate removal of unwanted encapsulant material. The oxidizable metal layer which adheres to the substrate is applied over a specific portion of the substrate. The oxidizable metal layer is oxidized to form a metal oxide layer which does not adhere to encapsulant materials.
Inventors
- 👤 Richard W. Wensel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:09
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/114; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/541; H10W72/5445; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
127 words
A method of encapsulating a semiconductor device, comprising: providing a carrier substrate; forming an oxide-surfaced material layer on said carrier substrate; attaching a semiconductor device to said carrier substrate after forming said oxide-surfaced material layer; placing an encapsulant mold having a cavity over said semiconductor device, wherein said semiconductor device resides within said encapsulant mold cavity and wherein said encapsulant mold includes an interconnection channel, a portion of said oxide-surfaced material layer forming a side of said interconnection channel adjacent said carrier substrate; injecting an encapsulant material into said encapsulant mold cavity through said interconnection channel, wherein said encapsulant material substantially solidifies in said encapsulant mold cavity and said interconnection channel; removing said encapsulant mold; and removing said substantially solidified encapsulant material residing over oxide-surfaced material layer.
Claim 2
Independent Claim
127 words
A method of encapsulating a semiconductor device, comprising: providing a carrier substrate; forming an oxide-surfaced material layer on said carrier substrate; attaching a semiconductor device to said carrier substrate after forming said oxide-surfaced material layer; placing an encapsulant mold having a cavity over said semiconductor device, wherein said semiconductor device resides within said encapsulant mold cavity and wherein said encapsulant mold includes an interconnection channel, a portion of said oxide-surfaced material layer forming a side of said interconnection channel adjacent said carrier substrate; injecting an encapsulant material into said encapsulant mold cavity through said interconnection channel, wherein said encapsulant material substantially solidifies in said encapsulant mold cavity and said interconnection channel; removing said encapsulant mold; and removing said substantially solidified encapsulant material residing over oxide-surfaced material layer.
Claim 3
Dependent Claim
35 words
The method of claim 1, wherein forming said oxide-surfaced material layer comprises: applying an oxidizable metal layer over a predetermined location on said carrier substrate; and oxidizing an upper surface of said oxidizable metal layer.
Claim 4
Dependent Claim
19 words
The method of claim 2, wherein said oxidizable metal layer is selected from the group comprising copper and silver.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-10-04 | 2003-04-05 | 2003-10-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-10-04 | 2007-04-05 | 2007-10-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-10-04 | 2011-04-05 | 2011-10-05 | $7700.00 | Window Closed / Lapsed |