US5934979A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chemical mechanical polishing apparatus using multiple polishing pads
Assignee: Applied Materials Inc
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Filing: 1997-03-10
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Granted: 1999-08-10
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Expires: 2017-03-10
Abstract
Abstract A chemical mechanical polishing apparatus includes a rotating plate on which a substrate is received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be varied to control the rate of material removed by the pad.
Inventors
- 👤 Homayoun Talieh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 13:05
CPC Classifications
B; B24; B24B; B24B49/00; B24B49/16; B24B21/00; B24B21/004; B24B21/04; B24B21/06; B24B37/00; B24B37/04; B24B37/07; B24B37/10; B24B37/105; B24B37/107; B24B37/11; B24B37/20; B24B37/26; B24B37/27; B24B37/30; B24B41/00; B24B41/06; B24B41/068; B24B49/10; B24B53/00; B24B53/017; B24B7/00
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
104 words
A method of chemical mechanical polishing a substrate, comprising the steps of: locating a substrate of the type suitable for circuit fabrication on a member; rotating the member to rotate the substrate; positioning a plurality of polishing pads each having a diameter no larger than a radius of the substrate on a surface of the substrate as the substrate rotates; selectively supplying a chemically reactive liquid to a specific area between the substrate and at least one of the plurality of polishing pads through at least one polishing pad; and moving the polishing pads across the surface of the substrate to polish the substrate.
Claim 2
Independent Claim
104 words
A method of chemical mechanical polishing a substrate, comprising the steps of: locating a substrate of the type suitable for circuit fabrication on a member; rotating the member to rotate the substrate; positioning a plurality of polishing pads each having a diameter no larger than a radius of the substrate on a surface of the substrate as the substrate rotates; selectively supplying a chemically reactive liquid to a specific area between the substrate and at least one of the plurality of polishing pads through at least one polishing pad; and moving the polishing pads across the surface of the substrate to polish the substrate.
Claim 3
Dependent Claim
21 words
The method of claim 1, further comprising biasing the polishing pads against the surface of the substrate as the substrate rotates.
Claim 4
Dependent Claim
29 words
The method of claim 2, further comprising varying the bias forces of the polishing pads against the substrate as the polishing pads move across the surface of the substrate.
Claim 5
Dependent Claim
26 words
The method of claim 3, further comprising varying the speed of rotation of the substrate as the polishing pads move across the surface of the substrate.
Claim 6
Dependent Claim
22 words
The method of claim 1, further comprising cleaning the polishing pads before positioning the polishing pads on the surface of the substrate.
Claim 7
Dependent Claim
30 words
The method of claim 1, wherein the surface area of each polishing pad which contacts the substrate is at least ten times smaller than the surface area of the substrate.
Claim 8
Dependent Claim
95 words
The method of claim 1, further comprising rotating a primary polishing arm about its longitudinal axis, wherein an intermediate member is connected to a lower end of the primary polishing arm, an upper end of a secondary polishing arm is connected to the intermediate member in a position offset from the longitudinal axis of the primary polishing arm, and at least one of the polishing pads is connected to a lower end of the secondary polishing arm, so that rotating the primary polishing arm causes the at least one of the polishing pads to orbit.
Claim 9
Dependent Claim
26 words
The method of claim 7, wherein multiple secondary polishing arms, each with a polishing pad on a lower end thereof, are connected to the intermediate member.
Claim 10
Independent Claim
89 words
An apparatus for chemical mechanical polishing a substrate, comprising: a rotatable member for receiving and rotating a substrate of the type suitable for circuit fabrication; a plurality of polishing pads each having a diameter no larger than a radius of the substrate, the polishing pads selectively engagable with the substrate to polish a surface thereof; and a slurry supply to selectively provide a chemically reactive liquid to specific area between the substrate and at least one of the plurality of polishing pads through the at least one polishing pad.
Claim 11
Independent Claim
89 words
An apparatus for chemical mechanical polishing a substrate, comprising: a rotatable member for receiving and rotating a substrate of the type suitable for circuit fabrication; a plurality of polishing pads each having a diameter no larger than a radius of the substrate, the polishing pads selectively engagable with the substrate to polish a surface thereof; and a slurry supply to selectively provide a chemically reactive liquid to specific area between the substrate and at least one of the plurality of polishing pads through the at least one polishing pad.
Claim 12
Dependent Claim
26 words
The polishing apparatus of claim 9, further comprising a primary polishing arm having a longitudinal axis and laterally movable parallel to the surface of the substrate.
Claim 13
Dependent Claim
18 words
The polishing apparatus of claim 10, further comprising a variable load member connected to the primary polishing arm.
Claim 14
Dependent Claim
18 words
The polishing apparatus of claim 11, further comprising a variable speed motor coupled to said primary polishing arm.
Claim 15
Dependent Claim
24 words
The polishing apparatus of claim 12, further comprising a process controller interconnected to, and controlling, said variable load member and said variable speed motor.
Claim 16
Dependent Claim
44 words
The polishing apparatus of claim 9, wherein at least one of said polishing pads is received on an end of an engagement arm having a first longitudinal axis, and said engagement arm rotates about a second longitudinal axis offset from said first longitudinal axis.
Claim 17
Dependent Claim
19 words
The polishing apparatus of claim 14, wherein said engagement arm is laterally moveable across the surface of the substrate.
Claim 18
Dependent Claim
85 words
The polishing apparatus of claim 10, further comprising an intermediate member connected to a lower end of the primary polishing arm, and a secondary polishing arm having an upper end connected to the intermediate member in a position offset from the longitudinal axis of the primary polishing arm, wherein at least one of the polishing pads is connected to a lower end of the secondary polishing arm so that rotating the primary polishing arm causes the at least one of the polishing pads to orbit.
Claim 19
Dependent Claim
32 words
The polishing apparatus of claim 16 further comprising a plurality of secondary polishing arms connected to the intermediate member, each secondary polishing arm having a polishing pad on a lower end thereof.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-09 | 2003-02-08 | 2003-08-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-09 | 2007-02-08 | 2007-08-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-09 | 2011-02-08 | 2011-08-10 | $7700.00 | Window Closed / Lapsed |