Patent US5928598A successfully refreshed from Google Patents.
US5928598A
Expired / Lapsed
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Method of making a microelectronic device package
Assignee: CTS Corp
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Filing: 1997-05-09
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Granted: 1999-07-27
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Expires: 2017-05-09
Abstract
Abstract A method (38) for packaging a microelectronic device (10) and a device (10) packaged by the method (38). The method (38) includes a step of providing (42) a first material (16) on an active surface of the microelectronic device (10). The first material (16) has a first temperature coefficient of expansion. The method (38) also includes steps of heating (46) the microelectronic device (10) and the first material (16) to a predetermined first temperature and molding (48) a second material (20) about the microelectronic device (10) and the first material (16). The second material (20) has a second temperature coefficient of expansion less than that of the first material (16). A final step of cooling (50) the first material (16), the second material (20) and the microelectronic device (10) provides a packaged microelectronic device (30).
Inventors
- 👤 Michael John Anderson
- 👤 Gary Carl Johnson
- 👤 Mark Phillip Popovich
- 👤 Jeffrey Eames Christensen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 23:05
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/10; H03H9/1064; H03H3/00; H03H3/007; H03H3/08; C; C09; C09K; C09K2323/00; C09K2323/06; C09K2323/061; H10; H10W; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T428/00; Y10T428/23; Y10T428/232; Y10T428/239; Y10T428/31504; Y10T428/31511; Y10T428/3154; Y10T428/31551; Y10T428/31609; Y10T428/31612; Y10T428/31623; Y10T428/31627; Y10T428/31645; Y10T428/31649; Y10T428/31652; Y10T428/31663; Y10T428/31667; Y10T428/31721; Y10T428/31786
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
147 words
A method for packaging a acoustic wave device, said method comprising steps of: providing a first material on an active surface of said acoustic wave device, said first material having a first temperature coefficient of expansion; treating said first material to provide enhanced adhesion to said second material, wherein said treating step includes exposing said first material to ultraviolet radiation; heating said acoustic wave device and said first material to a predetermined first temperature in a range of from 100 to 250 degrees Centigrade; molding a second material about said acoustic wave device and said first material, said second material having a second temperature coefficient of expansion less than one-third that of said first material; and cooling said first material, said second material and said acoustic wave device to provide a packaged acoustic wave device including a void between said acoustic wave device and said first material.
Claim 2
Independent Claim
147 words
A method for packaging a acoustic wave device, said method comprising steps of: providing a first material on an active surface of said acoustic wave device, said first material having a first temperature coefficient of expansion; treating said first material to provide enhanced adhesion to said second material, wherein said treating step includes exposing said first material to ultraviolet radiation; heating said acoustic wave device and said first material to a predetermined first temperature in a range of from 100 to 250 degrees Centigrade; molding a second material about said acoustic wave device and said first material, said second material having a second temperature coefficient of expansion less than one-third that of said first material; and cooling said first material, said second material and said acoustic wave device to provide a packaged acoustic wave device including a void between said acoustic wave device and said first material.
Claim 3
Dependent Claim
44 words
A method as claimed in claim 1, wherein said molding step includes a step of molding a second material having a temperature coefficient of expansion of less than thirty parts per million per degree Centigrade about said acoustic wave device and said first material.
Claim 4
Independent Claim
90 words
A method for packaging an acoustic wave device, said method comprising steps of: providing a first material on an active surface of said acoustic wave device; molding a second material about said acoustic wave device and said first material, said second material having a second temperature coefficient of expansion less than one-third that of said first material; and cooling said first material, said second material and said acoustic wave device to provide a packaged acoustic wave device having a void disposed between said acoustic wave device and said first material.
Claim 5
Independent Claim
90 words
A method for packaging an acoustic wave device, said method comprising steps of: providing a first material on an active surface of said acoustic wave device; molding a second material about said acoustic wave device and said first material, said second material having a second temperature coefficient of expansion less than one-third that of said first material; and cooling said first material, said second material and said acoustic wave device to provide a packaged acoustic wave device having a void disposed between said acoustic wave device and said first material.
Claim 6
Dependent Claim
26 words
A method as claimed in claim 3, wherein said step of providing a first material includes a step of providing a first material comprising dimethyl siloxane.
Claim 7
Dependent Claim
24 words
A method as claimed in claim 3, further comprising a step of treating said first material to provide enhanced adhesion to said second material.
Claim 8
Dependent Claim
23 words
A method as claimed in claim 5, wherein said step of treating includes a step of exposing said first material to ultraviolet radiation.
Claim 9
Dependent Claim
48 words
A method as claimed in claim 3, wherein said molding step includes a step of molding a second material comprising a material chosen from a group consisting of novolac epoxy, polyester, phenolic, liquid crystal polymer, polytetrafluoroethylene, polyaryletherketone and polyimide about said acoustic wave device and said first material.
Claim 10
Dependent Claim
37 words
A method as claimed in claim 3, wherein said molding step includes a step of heating said acoustic wave device and said first material to a temperature in a range of from 100 to 250 degrees Centigrade.
Claim 11
Dependent Claim
35 words
A method as claimed in claim 3, wherein said molding step includes a step of molding a second material having a temperature coefficient of expansion of less than thirty parts per million per degree Centigrade.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-26 | 2003-01-25 | 2003-07-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-26 | 2007-01-25 | 2007-07-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-26 | 2011-01-25 | 2011-07-27 | $7700.00 | Window Closed / Lapsed |