US5907903A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-layer-multi-chip pyramid and circuit board structure and method of forming same
Assignee: International Business Machines Corp
•
Filing: 1998-01-08
•
Granted: 1999-06-01
•
Expires: 2018-01-08
Abstract
Abstract The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.
Inventors
- 👤 Joseph George Ameen
- 👤 Joseph Funari
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 23:08
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H05; H05K; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09481; H05K2201/095; H05K2201/09572; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K2201/10954; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/041; H05K2203/0455; H05K2203/11; H05K2203/1115; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3494; H10; H10W; H10W72/00; H10W72/60; H10W90/00; H10W90/20; H10W90/22; H10W90/288; H10W90/291; H10W90/297; H10W90/701; H10W90/721; H10W90/722; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
310 words
A process for forming a multi-chip, multi-layer chip carrier and circuit board structure comprising the steps of; a. providing a first chip carrier formed of a first flexible film of dielectric material having a top surface and bottom surface; and having at least one I/C chip disposed on said top surface of said first flexible film; electrical circuitry on said top surface of said first flexible film connected to said I/C chip; a plurality of solder balls disposed on said bottom surface of said first flexible film; electrically conducting vias extending from said top surface to said bottom surface interconnecting said circuitry on the top surface with at least some of said solder balls on the bottom surface of said first flexible film; b. providing a second chip carrier formed of a second flexible film of dielectric material having a top surface and a bottom surface; at least one I/C chip and a plurality of pads disposed on said top surface of said second flexible film; electrical circuitry on said top surface of said second flexible film connected to said I/C chip and said pads; a plurality of solder balls disposed on the bottom surface of said second flexible film; electrically conducting vias extending from said top surface to said bottom surface interconnecting said circuitry on the top surface with at least some of said solder balls on the bottom surface of said second flexible film; c. connecting said solder balls of the first chip carrier electrically and mechanically to said pads on the top surface of the second chip carrier; d. providing a circuit board formed of a dielectric material having a top surface with a plurality of pads disposed on said top surface, and e. connecting said solder balls of said second chip carrier electrically and mechanically to said pads on said top surface of said circuit board.
Claim 2
Dependent Claim
310 words
A process for forming a multi-chip, multi-layer chip carrier and circuit board structure comprising the steps of; a. providing a first chip carrier formed of a first flexible film of dielectric material having a top surface and bottom surface; and having at least one I/C chip disposed on said top surface of said first flexible film; electrical circuitry on said top surface of said first flexible film connected to said I/C chip; a plurality of solder balls disposed on said bottom surface of said first flexible film; electrically conducting vias extending from said top surface to said bottom surface interconnecting said circuitry on the top surface with at least some of said solder balls on the bottom surface of said first flexible film; b. providing a second chip carrier formed of a second flexible film of dielectric material having a top surface and a bottom surface; at least one I/C chip and a plurality of pads disposed on said top surface of said second flexible film; electrical circuitry on said top surface of said second flexible film connected to said I/C chip and said pads; a plurality of solder balls disposed on the bottom surface of said second flexible film; electrically conducting vias extending from said top surface to said bottom surface interconnecting said circuitry on the top surface with at least some of said solder balls on the bottom surface of said second flexible film; c. connecting said solder balls of the first chip carrier electrically and mechanically to said pads on the top surface of the second chip carrier; d. providing a circuit board formed of a dielectric material having a top surface with a plurality of pads disposed on said top surface, and e. connecting said solder balls of said second chip carrier electrically and mechanically to said pads on said top surface of said circuit board.
Claim 3
Dependent Claim
60 words
The method as defined in claim 1 wherein said solder balls of said second chip carrier are joined to said pads on the top surface of said circuit board by applying a joining material having a melting point lower than said solder balls on said second chip carrier to the pads on said circuit board, and reflowing said joining material.
Claim 4
Dependent Claim
15 words
The method as defined in claim 2 wherein said joining material is a solder paste.
Claim 5
Dependent Claim
25 words
The method as defined in claim 1 wherein the vias in each film of dielectric material includes holes having metal plated on the surfaces thereof.
Claim 6
Dependent Claim
22 words
The method as defined in claim 4 wherein said solder balls of each of said chip carriers are reflowed into said vias.
Claim 7
Dependent Claim
24 words
The method as defined in claim 1 further characterized by attaching at least one stiffener to one surface of at least one chip carrier.
Claim 8
Dependent Claim
20 words
The method as defined in claim 6 wherein each stiffener is secured to the top surface of a chip carrier.
Claim 9
Dependent Claim
26 words
The structure as defined in claim 1 further characterized by securing a heat sink in thermal conducting relationship with at least one of said I/C chips.
Claim 10
Dependent Claim
16 words
The method as defined in claim 8 wherein each heat sink includes a strip of metal.
Claim 11
Dependent Claim
23 words
The method as defined in claim 9 wherein each strip of metal is bonded to an I/C chip by a thermally conducting adhesive.
Claim 12
Dependent Claim
38 words
The method as defined in claim 8 wherein said heat sink is formed by applying a thermal adhesive between at least one I/C chip on said second chip carrier and the second surface of said first chip carrier.
References Cited (Backward Citations)
DE274129C
Cited
JPS5892230A
Cited
US4499607A
Cited
US4807021A
Cited
US4801992A
Cited
US5016138A
Cited
US5109601A
Cited
US5019946A
Cited
US5107586A
Cited
JPH04290258A
Cited
JPH0582710A
Cited
US5239448A
Cited
US5222014A
Cited
US5247423A
Cited
JPH05335633A
Cited
US5285352A
Cited
US5399898A
Cited
US5397921A
Cited
US5454160A
Cited
US5715144A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-31 | 2002-11-30 | 2003-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-31 | 2006-11-30 | 2007-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-31 | 2010-11-30 | 2011-06-01 | $7700.00 | Window Closed / Lapsed |