Patent US5904497A successfully refreshed from Google Patents.
US5904497A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for semiconductor assembly which includes testing of chips and replacement of bad chips prior to final assembly
Assignee: Micron Technology Inc
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Filing: 1997-08-22
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Granted: 1999-05-18
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Expires: 2017-08-22
Abstract
Abstract A semiconductor assembly, and method for forming same, comprises a support such as a printed circuit board (PCB), at least one semiconductor die, and a surface plate manufactured from a material such as ceramic, plastic, silicon, or the like. The semiconductor die is removably attached to the PCB, and an electrical interconnect such as a wire bond electrically couples the PCB and the die. The surface plate is attached to the die and leaves exposed the terminals on the die. The die is burned in and tested. Responsive to the die passing the test, the surface plate is underfilled, for example with a glob top material, to seal the electrical interconnect and its attachment to the PCB and to the die. Responsive to the die failing the test, the die is removed and replaced with another die. Various other embodiments of the invention are described.
Inventors
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:25
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/23; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W76/00; H10W76/40; H10W90/00; H10W46/00; H10W90/20; H10W90/231; H10W90/284; H10W90/291; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
51 words
A method for forming a semiconductor assembly comprising the following steps: attaching an unencapsulated semiconductor die having terminals thereon to a support; electrically coupling said die with said support; placing a surface plate in contact with said die and leaving exposed said terminals; testing said semiconductor die with said terminals exposed.
Claim 2
Independent Claim
51 words
A method for forming a semiconductor assembly comprising the following steps: attaching an unencapsulated semiconductor die having terminals thereon to a support; electrically coupling said die with said support; placing a surface plate in contact with said die and leaving exposed said terminals; testing said semiconductor die with said terminals exposed.
Claim 3
Dependent Claim
17 words
The method of claim 1 wherein said surface plate contacts said die during said step of testing.
Claim 4
Dependent Claim
56 words
The method of claim 1 further comprising the following steps: determining that said die passes said test and passing said die in response to said test; responsive to said die passing said test, placing a filler between said die and said surface plate thereby encapsulating an electrical interconnect which electrically couples said die with said support.
Claim 5
Dependent Claim
21 words
The method of claim 3 wherein said filler contacts at least two of said support, said die, and said surface plate.
Claim 6
Dependent Claim
12 words
The method of claim 3 wherein said electrical interconnect comprises bond wires.
Claim 7
Dependent Claim
13 words
The method of claim 3 wherein said electrical interconnect includes tape automated bonding.
Claim 8
Dependent Claim
45 words
The method of claim 1 further comprising the following steps: attaching said surface plate to said die with a first adhesive having a first thickness and with a second adhesive having a second thickness wherein said second thickness is substantially thicker than said first thickness.
Claim 9
Dependent Claim
129 words
The method of claim 1 wherein said die is a first die and is attached to said support at a first location, further comprising the following steps: determining that said first die fails said test and failing said first die in response to said test; removing said first die from said first location; attaching a second semiconductor die having terminals thereon to said support at said first location; electrically coupling said second die and said support; placing a surface plate in contact with said second die; burning in then testing said second die; responsive to said second die passing said test, placing a filler between said second die and a surface plate attached to said second die thereby encapsulating wires which electrically couple said second die with said support.
Claim 10
Independent Claim
69 words
A method used during the formation of an electronic device comprising the following steps: providing at least first and second unpackaged semiconductor die; providing a support; mechanically attaching said first unpackaged die to said support; electrically coupling said first unpackaged die to said support; testing said first unpackaged die; and responsive to said first unpackaged die failing said test, mechanically coupling said second unpackaged die with said first die.
Claim 11
Independent Claim
69 words
A method used during the formation of an electronic device comprising the following steps: providing at least first and second unpackaged semiconductor die; providing a support; mechanically attaching said first unpackaged die to said support; electrically coupling said first unpackaged die to said support; testing said first unpackaged die; and responsive to said first unpackaged die failing said test, mechanically coupling said second unpackaged die with said first die.
Claim 12
Dependent Claim
90 words
The method of claim 9 further comprising the following steps: providing a surface plate having first and second portions; attaching said first portion of said surface plate to said first die wherein said second portion of said surface plate overhangs bond pads of said first unpackaged die such that said second portion of said surface plate and said bond pads have a space therebetween; and providing a filler material to fill said space between said second portion of said surface plate and said bond pads of said first unpackaged die.
Claim 13
Dependent Claim
32 words
The method of claim 10 wherein said step of providing said filler material comprises the step of contacting said surface plate, said unpackaged first die, and said support with said filler material.
Claim 14
Dependent Claim
33 words
The method of claim 10 wherein said step of mechanically coupling said second unpackaged die with said first unpackaged die comprises the step of attaching said second unpackaged die to said surface plate.
Claim 15
Dependent Claim
35 words
The method of claim 9 further comprising the step of electrically uncoupling said first unpackaged die such that said first unpackaged die provides no electrical signal to said support during electrical operation of said support.
Claim 16
Independent Claim
136 words
A method used during the formation of an electronic device comprising the following steps: providing at least one unpackaged semiconductor die having a circuit side with conductive pads thereon; providing a support; mechanically attaching said unpackaged die to said support; electrically coupling said unpackaged die to said support; attaching a first portion of a surface plate to said circuit side of said die wherein a second portion of said surface plate overhangs said conductive pads such that said second portion of said surface plate and said pads have a space therebetween; subsequent to electrically coupling said die to said support, testing said unpackaged die; and responsive to said unpackaged die passing said test, providing a filler material to fill said space between said second portion of said surface plate and said pads of said unpackage die.
Claim 17
Independent Claim
136 words
A method used during the formation of an electronic device comprising the following steps: providing at least one unpackaged semiconductor die having a circuit side with conductive pads thereon; providing a support; mechanically attaching said unpackaged die to said support; electrically coupling said unpackaged die to said support; attaching a first portion of a surface plate to said circuit side of said die wherein a second portion of said surface plate overhangs said conductive pads such that said second portion of said surface plate and said pads have a space therebetween; subsequent to electrically coupling said die to said support, testing said unpackaged die; and responsive to said unpackaged die passing said test, providing a filler material to fill said space between said second portion of said surface plate and said pads of said unpackage die.
Claim 18
Dependent Claim
25 words
The method of claim 14 wherein said step of providing said filler comprises contacting said die, said surface plate, and said support with said filler.
Claim 19
Dependent Claim
35 words
The method of claim 14 wherein said step of electrically coupling said die with said support comprises the step of forming bond wires between said conductive pads on said die and pads on said support.
Claim 20
Independent Claim
105 words
A method of forming a semiconductor device comprising the following steps: providing at least first and second unpackaged semiconductor wafer sections; providing a support for said unpackaged wafer sections; attaching said first semiconductor wafer section to said support; testing said first semiconductor wafer section; and responsive to said first semiconductor wafer section failing said test, mechanically coupling said second wafer section with said first wafer section, wherein at least a portion of said first wafer section is interposed between said support and said second wafer section and wherein said first wafer section provides no electrical signal to said support during electrical operation of said support.
Claim 21
Independent Claim
105 words
A method of forming a semiconductor device comprising the following steps: providing at least first and second unpackaged semiconductor wafer sections; providing a support for said unpackaged wafer sections; attaching said first semiconductor wafer section to said support; testing said first semiconductor wafer section; and responsive to said first semiconductor wafer section failing said test, mechanically coupling said second wafer section with said first wafer section, wherein at least a portion of said first wafer section is interposed between said support and said second wafer section and wherein said first wafer section provides no electrical signal to said support during electrical operation of said support.
Claim 22
Dependent Claim
75 words
The method of claim 17 wherein said step of providing said support includes providing a printed circuit board, and wherein said method further comprises the following steps: electrically coupling said first wafer section with said printed circuit board; electrically decoupling said first wafer section such that said first wafer section provides no electrical signal to said support during electrical operation of said support; and electrically coupling said second wafer section with said printed circuit board.
Claim 23
Dependent Claim
22 words
The method of claim 18 wherein said step of electrically decoupling said first wafer. section comprises the step of adjusting a jumper.
Claim 24
Dependent Claim
66 words
Of The method of claim 18 wherein said step of electrically coupling said first wafer section with said printed circuit board comprises the step of wire bonding said first wafer section with said printed circuit board, and wherein said step of electrically coupling said second wafer section with said printed circuit board includes tape automated bonding of said second wafer section and said printed circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-05-17 | 2002-11-16 | 2003-05-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-05-17 | 2006-11-16 | 2007-05-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-05-17 | 2010-11-16 | 2011-05-18 | $7700.00 | Window Closed / Lapsed |