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US5899711A Expired / Lapsed US ⏱️ 0.0 years remaining

Method for enhancing hydrogenation of thin film transistors using a metal capping layer and method for batch hydrogenation

Assignee: Thomson Licensing SAS
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Filing: 1996-10-11
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Granted: 1999-05-04
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Expires: 2016-10-11
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Abstract

Abstract A method for enhancing hydrogenation of an oxide-coated polycrystalline silicon thin-film transistor or devices includes depositing a metal capping layer on the device prior to hydrogenation. In addition, a method for batch hydrogenation of substrates or plates carrying the oxide-coated polycrystalline silicon devices includes placing the plates in a downstream flow from a hydrogen plasma.

Inventors

  • 👤 Donald L. Smith

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 19:30
CPC Classifications
H; H10; H10P; H10P95/00; H10P95/94

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 53 words
A method of hydrogenating a polycrystalline silicon device, comprising: depositing a silicon dioxide passivating layer on a polycrystalline silicon device; forming a continuous metal capping layer covering an entire surface of said silicon dioxide passivating layer; and hydrogenating said device having said continuous metal capping layer in the presence of a hydrogen plasma.
Claim 2
Independent Claim 53 words
A method of hydrogenating a polycrystalline silicon device, comprising: depositing a silicon dioxide passivating layer on a polycrystalline silicon device; forming a continuous metal capping layer covering an entire surface of said silicon dioxide passivating layer; and hydrogenating said device having said continuous metal capping layer in the presence of a hydrogen plasma.
Claim 3
Dependent Claim 17 words
The hydrogenating method according to claim 1, wherein said device is a transistor that comprises polycrystalline silicon.
Claim 4
Dependent Claim 18 words
The hydrogenating method according to claim 1, wherein said hydrogenating occurs at a temperature of about 350° C.
Claim 5
Dependent Claim 22 words
The hydrogenating method according to claim 1, wherein said metal is selected from the group consisting of aluminum, platinum, palladium and nickel.
Claim 6
Dependent Claim 19 words
The hydrogenating method according to claim 1, wherein said forming comprises sputtering to form said continuous metal capping layer.
Claim 7
Dependent Claim 25 words
The hydrogenating method according to claim 1, wherein said silicon dioxide passivating layer has a thickness of from about 100 nm to about 1000 nm.
Claim 8
Dependent Claim 24 words
The hydrogenating method according to claim 1, wherein said metal capping layer has a thickness of from about 20 nm to about 200 nm.
Claim 9
Dependent Claim 16 words
The hydrogenating method according to claim 1, wherein said hydrogenating is performed for about 1.2 hours.
Claim 10
Independent Claim 40 words
A method of hydrogenating a polycrystalline silicon device, comprising: depositing a silicon dioxide layer on said polycrystalline silicon device; forming a palladium capping layer on said silicon dioxide layer; and hydrogenating said device in the presence of a hydrogen gas.
Claim 11
Independent Claim 40 words
A method of hydrogenating a polycrystalline silicon device, comprising: depositing a silicon dioxide layer on said polycrystalline silicon device; forming a palladium capping layer on said silicon dioxide layer; and hydrogenating said device in the presence of a hydrogen gas.
Claim 12
Independent Claim 40 words
A method of batch hydrogenating polycrystalline silicon thin-film devices, comprising: placing a plurality of substrates or plates carrying polycrystalline silicon thin-film devices in a vessel downstream of a hydrogen plasma; and hydrogenating said devices with a supply of hydrogen atoms.
Claim 13
Independent Claim 40 words
A method of batch hydrogenating polycrystalline silicon thin-film devices, comprising: placing a plurality of substrates or plates carrying polycrystalline silicon thin-film devices in a vessel downstream of a hydrogen plasma; and hydrogenating said devices with a supply of hydrogen atoms.
Claim 14
Dependent Claim 25 words
The batch hydrogenating method of claim 10, wherein said devices comprise a continuous metal capping layer covering an entire surface of a silicon dioxide layer.
Claim 15
Dependent Claim 18 words
The batch hydrogenating method of claim 11, further comprising adding oxygen or water vapor to said hydrogen plasma.
Claim 16
Dependent Claim 24 words
The batch hydrogenating method of claim 11, wherein said hydrogenating occurs at a temperature of about 350° C. and pressure of about 0.3 Torr.
Claim 17
Dependent Claim 15 words
The batch hydrogenating method of claim 11, wherein said hydrogenating is for about 1 hour.
Claim 18
Dependent Claim 24 words
The hydrogenating method according to claim 9, wherein the palladium capping layer is continuous and covers an entire surface of the silicon dioxide layer.
Claim 19
Dependent Claim 12 words
The batch hydrogenating method of claim 11, wherein said metal is palladium.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-05-03 2002-11-02 2003-05-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-05-03 2006-11-02 2007-05-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-05-03 2010-11-02 2011-05-04 $7700.00 Window Closed / Lapsed

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