US5894173A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Stress relief matrix for integrated circuit packaging
Assignee: Texas Instruments Inc
•
Filing: 1997-11-05
•
Granted: 1999-04-13
•
Expires: 2017-11-05
Abstract
Abstract An integrated circuit package (10, 40) may comprise an integrated circuit chip (12, 42) and a substrate (14, 44) opposite the chip (12, 42). A connector (20, 52) may be disposed between the chip (12, 42) and the substrate (14, 44) to electrically couple the chip (12, 42) and the substrate (14, 44). A matrix (24, 50) may be disposed about the connector (20, 52). The matrix (24, 50) may comprise a blend of liquid crystal polymer and thermoplastic polymer. The matrix (24, 50) may have a coefficient of thermal expansion in a direction (26, 56) substantially parallel to the chip (12, 42) and the substrate (14, 44) that is greater than that of the chip (12, 42) and that is less than that of the substrate (14, 44) in the substantially parallel direction (26, 56). In a direction (28, 58) normal to the substantially parallel direction (26, 56), the matrix (24, 50) may have a coefficient of thermal expansion that is approximately that of the connector (20, 52).
Inventors
- 👤 Elizabeth G. Jacobs
- 👤 Katherine G. Heinen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:09
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/251; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
124 words
An integrated circuit package, comprising: an integrated circuit chip; a substrate opposite the chip; a connector disposed between the chip and the substrate; the connector electrically coupling the chip to the substrate; a matrix disposed about the connector; the matrix comprising a blend of liquid crystal polymer and thermoplastic polymer; the matrix having a coefficient of thermal expansion in a direction substantially parallel to the chip the substrate that is greater than that of the chip in the substantially parallel direction and that is less than that of the substrate in the substantially parallel direction; and the matrix having a coefficient of thermal expansion in a direction normal to the substantially parallel direction that is approximately that of the connector in the normal direction.
Claim 2
Dependent Claim
124 words
An integrated circuit package, comprising: an integrated circuit chip; a substrate opposite the chip; a connector disposed between the chip and the substrate; the connector electrically coupling the chip to the substrate; a matrix disposed about the connector; the matrix comprising a blend of liquid crystal polymer and thermoplastic polymer; the matrix having a coefficient of thermal expansion in a direction substantially parallel to the chip the substrate that is greater than that of the chip in the substantially parallel direction and that is less than that of the substrate in the substantially parallel direction; and the matrix having a coefficient of thermal expansion in a direction normal to the substantially parallel direction that is approximately that of the connector in the normal direction.
Claim 3
Dependent Claim
28 words
The integrated circuit package of claim 1, further comprising the coefficient of thermal expansion of the matrix in the substantially parallel direction being between 8 and 12 ppm/°C.
Claim 4
Dependent Claim
27 words
The integrated circuit package of claim 1, further comprising the coefficient of thermal expansion of the matrix in the normal direction being between 20 and 30 ppm/°C.
Claim 5
Dependent Claim
24 words
The integrated circuit package of claim 1, further comprising the matrix having a moisture absorption rate of less than 0.1% at 85° C./85% RH.
Claim 6
Dependent Claim
20 words
The integrated circuit package of claim 1, wherein the matrix is a thermoplastic film operable to be reworked upon reheating.
Claim 7
Dependent Claim
36 words
The integrated circuit package of claim 1, the connector further comprising a conducting bump bonded to a chip bonding pad electrically coupled to the chip and to a substrate bonding pad electrically coupled to the substrate.
Claim 8
Dependent Claim
15 words
The integrated circuit package of claim 6, wherein the conducting bump comprises a solder ball.
Claim 9
Dependent Claim
39 words
The integrated circuit package of claim 1, the connector further comprising at least one conducting bump press fit against a chip bonding pad electrically coupled to the chip and against a substrate bonding pad electrically coupled to the substrate.
Claim 10
Dependent Claim
17 words
The integrated circuit package of claim 8, wherein the conducting bump comprises a metal coated plastic sphere.
Claim 11
Dependent Claim
22 words
The integrated circuit package of claim 8, wherein the conducting bump comprises metallic micro filaments perpendicular to the chip and the substrate.
Claim 12
Dependent Claim
66 words
A preformed film for packaging integrated circuit chips, comprising: a matrix comprising a blend of liquid crystal polymer and thermoplastic polymer; the matrix having a coefficient of thermal expansion in a plane of the film of between 8 and 12 ppm/°C.; and the matrix having a coefficient of thermal expansion in a direction normal to the plane of the film of between 20 and 30 ppm/°C.
Claim 13
Dependent Claim
66 words
A preformed film for packaging integrated circuit chips, comprising: a matrix comprising a blend of liquid crystal polymer and thermoplastic polymer; the matrix having a coefficient of thermal expansion in a plane of the film of between 8 and 12 ppm/°C.; and the matrix having a coefficient of thermal expansion in a direction normal to the plane of the film of between 20 and 30 ppm/°C.
Claim 14
Dependent Claim
22 words
The preformed film of claim 11, further comprising the matrix having a moisture absorption rate of less than 0.1% at 85° C./85%RH.
Claim 15
Dependent Claim
19 words
The preformed film of claim 11, wherein the matrix is a thermoplastic film operable to be reworked upon reheating.
References Cited (Backward Citations)
US4825284A
Cited
EP0315852A2
Cited
US4886686A
Cited
EP0340492A2
Cited
EP0520679A2
Cited
US5553769A
Cited
JPH08293579A
Cited
US5659203A
Cited
US5709960A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-12 | 2002-10-12 | 2003-04-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-12 | 2006-10-12 | 2007-04-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-12 | 2010-10-12 | 2011-04-13 | $7700.00 | Window Closed / Lapsed |