US5709960A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mold compound
Assignee: NXP USA Inc
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Filing: 1996-06-21
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Granted: 1998-01-20
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Expires: 2016-06-21
Abstract
Abstract An electronic component has a body (11) that is formed from a mold compound that includes a thermoplastic material (31), a first filler (32) comprised of an electrically insulative material wherein the first filler (32) is more thermally conductive than the thermoplastic material (31), and a second filler (33) comprised of an electrically conductive material wherein the second filler (33) is more thermally conductive than the thermoplastic material (31).
Inventors
- 👤 Lonne L. Mays
- 👤 Mark D. Mosher
- 👤 Alexandra Hubenko
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:30
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/25; H10W40/257
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
81 words
An electronic component comprising: a semiconductor substrate; a semiconductor device in the semiconductor substrate; a lead electrically coupled to the semiconductor device; and an encapsulant overlying the semiconductor device wherein the encapsulant is electrically insulative, the encapsulant comprising: a plurality of electrically conductive fibers having a first thermal conductivity; a plurality of electrically insulative particles having a second thermal conductivity; and a thermoplastic polymer having a third thermal conductivity, the third thermal conductivity less than the first and second thermal conductivities.
Claim 2
Dependent Claim
81 words
An electronic component comprising: a semiconductor substrate; a semiconductor device in the semiconductor substrate; a lead electrically coupled to the semiconductor device; and an encapsulant overlying the semiconductor device wherein the encapsulant is electrically insulative, the encapsulant comprising: a plurality of electrically conductive fibers having a first thermal conductivity; a plurality of electrically insulative particles having a second thermal conductivity; and a thermoplastic polymer having a third thermal conductivity, the third thermal conductivity less than the first and second thermal conductivities.
Claim 3
Dependent Claim
39 words
The electronic component of claim 1 wherein a weight percent of the thermoplastic polymer and a weight percent of the plurality of electrically insulative particles are each greater than a weight percent of the plurality of electrically conductive fibers.
Claim 4
Dependent Claim
23 words
The electronic component of claim 2 wherein the weight percent of the plurality of electrically conductive fibers is less than approximately ten percent.
Claim 5
Dependent Claim
33 words
The electronic component of claim 1 wherein the encapsulant is further comprised of a homogenous mixture of the thermoplastic polymer, the plurality of electrically insulative particles, and the plurality of electrically conductive fibers.
Claim 6
Dependent Claim
22 words
The electronic component of claim 1 wherein the encapsulant surrounds the semiconductor substrate, the semiconductor device, and a portion of the lead.
Claim 7
Dependent Claim
18 words
The electronic component of claim 1 wherein the encapsulant forms a heat sink having a plurality of fins.
Claim 8
Dependent Claim
65 words
An electronic component comprising: a semiconductor device; and a mold compound covering the semiconductor device, the mold compound comprising: a thermoplastic material; a first filler comprised of an electrically insulative material wherein the first filler is more thermally conductive than the thermoplastic material; and a second filler comprised of an electrically conductive material wherein the second filler is more thermally conductive than the thermoplastic material.
Claim 9
Dependent Claim
65 words
An electronic component comprising: a semiconductor device; and a mold compound covering the semiconductor device, the mold compound comprising: a thermoplastic material; a first filler comprised of an electrically insulative material wherein the first filler is more thermally conductive than the thermoplastic material; and a second filler comprised of an electrically conductive material wherein the second filler is more thermally conductive than the thermoplastic material.
Claim 10
Dependent Claim
33 words
The electronic component of claim 7 wherein the mold compound is electrically insulative and wherein the mold compound is a homogenous mixture of the thermoplastic material, the first filler, and the second filler.
Claim 11
Dependent Claim
28 words
The electronic component of claim 7 wherein the first filler is comprised of a material selected from the group consisting of silicon, aluminum nitride, or a metal oxide.
Claim 12
Dependent Claim
14 words
The electronic component of claim 7 wherein the first filler has a granular shape.
Claim 13
Dependent Claim
24 words
The electronic component of claim 4 wherein a weight percent of the first filler is greater than a weight percent of the second filler.
Claim 14
Dependent Claim
18 words
The electronic component of claim 7 wherein the second filler is more thermally conductive than the first filler.
Claim 15
Dependent Claim
14 words
The electronic component of claim 7 wherein the second filler is comprised of carbon.
Claim 16
Dependent Claim
14 words
The electronic component of claim 7 wherein the second filler is comprised of graphite.
Claim 17
Dependent Claim
14 words
The electronic component of claim 7 wherein the second filler has a filament shape.
Claim 18
Dependent Claim
86 words
An electronic component comprising: a semiconductor device; and an electrically insulative mold compound overlying at least a portion of the semiconductor device, the electrically insulative mold compound having a plurality of fillers wherein a first one of the plurality of fillers is electrically insulative and wherein a second one of the plurality of fillers is electrically conductive and wherein a weight percent of the first one of the plurality of fillers is greater than a weight percent of the second one of the plurality of fillers.
Claim 19
Dependent Claim
86 words
An electronic component comprising: a semiconductor device; and an electrically insulative mold compound overlying at least a portion of the semiconductor device, the electrically insulative mold compound having a plurality of fillers wherein a first one of the plurality of fillers is electrically insulative and wherein a second one of the plurality of fillers is electrically conductive and wherein a weight percent of the first one of the plurality of fillers is greater than a weight percent of the second one of the plurality of fillers.
Claim 20
Dependent Claim
70 words
The electronic component of claim 16 wherein the electrically insulative mold compound further comprises an electrically insulative thermoplastic material wherein a weight percent of the electrically insulative thermoplastic material is less than the weight percent of the first one of the plurality of fillers and wherein the weight percent of the electrically insulative thermoplastic material is greater than the weight percent of the second one of the plurality of fillers.
Claim 21
Dependent Claim
53 words
The electronic component of claim 17 wherein the second one of the plurality of fillers is more thermally conductive than the electrically insulative thermoplastic material and first one of the plurality of fillers and wherein the first one of the plurality of fillers is more thermally conductive than the electrically insulative thermoplastic material.
Claim 22
Dependent Claim
27 words
The electronic component of claim 16 wherein the first one of the plurality of fillers and the second one of the plurality of fillers have different shapes.
Claim 23
Dependent Claim
19 words
The electronic component of claim 16 wherein the electrically insulative mold compound is molded into a plurality of fins.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-01-19 | 2001-07-21 | 2002-01-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-01-19 | 2005-07-21 | 2006-01-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-01-19 | 2009-07-21 | 2010-01-20 | $7700.00 | Window Closed / Lapsed |