US4886686A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Circuit board substrates of improved thermal conductivity
Assignee: BASF SE
•
Filing: 1988-11-04
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Granted: 1989-12-12
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Expires: 2008-11-04
Abstract
Abstract A circuit board substrate of good thermal conductivity comprises a composite formed from (A) an electrically and thermally insulating plastic and (B) a plastic incorporating a thermally highly conductive filler.
Inventors
- 👤 Helmut Muenstedt
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 20:59
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K1/0201; H05K1/0203; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0129; H05K2201/0137; H05K2201/0141; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/0215; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24479; Y10T428/24521; Y10T428/24802; Y10T428/24917; Y10T428/25; Y10T428/256; Y10T428/29; Y10T428/2982; Y10T428/31504; Y10T428/31511; Y10T428/31533; Y10T428/31721; Y10T428/31942
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
60 words
A circuit board substrate of good thermoconductivity, comprising a composite formed from (A) an electrically and thermally insulating plastic and (B) a plastic filled with a thermally highly conductive metallic filler, wherein the plastic is an epoxy resin or a highly heat-resistant thermoplastic from the group of the polyaryl ether sulfones, polyaryl ether ketones, polyether imides or thermotropic liquid-crystalline polymers.
Claim 2
Dependent Claim
60 words
A circuit board substrate of good thermoconductivity, comprising a composite formed from (A) an electrically and thermally insulating plastic and (B) a plastic filled with a thermally highly conductive metallic filler, wherein the plastic is an epoxy resin or a highly heat-resistant thermoplastic from the group of the polyaryl ether sulfones, polyaryl ether ketones, polyether imides or thermotropic liquid-crystalline polymers.
Claim 3
Dependent Claim
19 words
A circuit board substrate as claimed in claim 1, wherein the metallic filler is aluminum leaf or aluminium flake.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-12-11 | 1993-06-12 | 1993-12-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-12-11 | 1997-06-12 | 1997-12-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-12-11 | 2001-06-12 | 2001-12-12 | $7700.00 | Window Closed / Lapsed |