Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
193 words
A method for forming a field oxide in the surface of a silicon substrate comprising the steps of: (a) providing a silicon substrate; (b) forming a pad oxide over said silicon substrate; (c) forming a first silicon nitride layer on said pad oxide; (d) forming an auxiliary layer on said first silicon nitride layer; (e) forming a second silicon nitride layer on said auxiliary layer; (f) depositing a photoresist layer on said second silicon nitride layer; (g) forming a pattern in said photoresist layer to define an opening for said field oxide; (h) etching said second silicon nitride layer and said auxiliary layer with an anisotropic etching technique; (i) forming a lateral cavity in said auxiliary layer thereby forming an overhand of said second silicon nitride layer; (j) etching said first silicon nitride layer with an anisotropic etching technique; and (k) forming a field oxide by subjecting said silicon substrate to thermal oxidation whereupon an edge portion of said first silicon nitride layer under said overhang undergoes a deflection toward said overhang causing said edge portion to eventually strike said overhang and, as oxidation proceeds, said deflection is increasingly restrained by said overhang.
Claim 2
Independent Claim
193 words
A method for forming a field oxide in the surface of a silicon substrate comprising the steps of: (a) providing a silicon substrate; (b) forming a pad oxide over said silicon substrate; (c) forming a first silicon nitride layer on said pad oxide; (d) forming an auxiliary layer on said first silicon nitride layer; (e) forming a second silicon nitride layer on said auxiliary layer; (f) depositing a photoresist layer on said second silicon nitride layer; (g) forming a pattern in said photoresist layer to define an opening for said field oxide; (h) etching said second silicon nitride layer and said auxiliary layer with an anisotropic etching technique; (i) forming a lateral cavity in said auxiliary layer thereby forming an overhand of said second silicon nitride layer; (j) etching said first silicon nitride layer with an anisotropic etching technique; and (k) forming a field oxide by subjecting said silicon substrate to thermal oxidation whereupon an edge portion of said first silicon nitride layer under said overhang undergoes a deflection toward said overhang causing said edge portion to eventually strike said overhang and, as oxidation proceeds, said deflection is increasingly restrained by said overhang.
Claim 3
Dependent Claim
31 words
The method of claim 1 wherein said pattern is biased, photolithographically towards said field oxide by a bias of between about 50 and 100 nm. to compensate for birds beak encroachment.
Claim 4
Dependent Claim
19 words
The method of claim 1 wherein said first silicon nitride layer is between about 30 and 100 nm. thick.
Claim 5
Dependent Claim
17 words
The method of claim 1 wherein said auxiliary layer is between about 10 and 100 nm. thick.
Claim 6
Dependent Claim
19 words
The method of claim 1 wherein said second silicon nitride layer is between about 100 and 200 nm. thick.
Claim 7
Dependent Claim
17 words
The method of claim 1 wherein said field oxide is between about 300 and 500 nm. thick.
Claim 8
Dependent Claim
16 words
The method of claim 1 wherein said opening is between about 350 and 600 nm. wide.
Claim 9
Dependent Claim
12 words
The method of claim 1 wherein said auxiliary layer is silicon oxide.
Claim 10
Dependent Claim
18 words
The method of claim 8 wherein said lateral cavity is formed using a calibrated wet etchant containing HF.
Claim 11
Dependent Claim
11 words
The method of claim 1 wherein said auxiliary layer is polysilicon.
Claim 12
Dependent Claim
16 words
The method of claim 10 wherein said lateral cavity is formed using a calibrated wet etchant.