Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
162 words
A method for manufacturing a polysilicon with a relatively small line width, formed on an insulator formed on a substrate, comprising steps of: (a) forming a first layer of photoresist with a line pattern having a first line interval and a first line width over said polysilicon; (b) etching a portion of said polysilicon for forming a first polysilicon with a second line interval and a second line width respectively equal to said first line interval and said first line width; (c) forming a second layer of photoresist with a third line interval and a third lie width over said first polysilicon; (d) etching a portion of said first polysilicon to form a fourth line interval which is equal to said third line interval, and a fourth line width; (e) depositing a polysilicon film over said first polysilicon; and (f) etching a portion of said polysilicon film to form sidewalls of said polysilicon for adjusting said fourth line width of said polysilicon.
Claim 2
Independent Claim
162 words
A method for manufacturing a polysilicon with a relatively small line width, formed on an insulator formed on a substrate, comprising steps of: (a) forming a first layer of photoresist with a line pattern having a first line interval and a first line width over said polysilicon; (b) etching a portion of said polysilicon for forming a first polysilicon with a second line interval and a second line width respectively equal to said first line interval and said first line width; (c) forming a second layer of photoresist with a third line interval and a third lie width over said first polysilicon; (d) etching a portion of said first polysilicon to form a fourth line interval which is equal to said third line interval, and a fourth line width; (e) depositing a polysilicon film over said first polysilicon; and (f) etching a portion of said polysilicon film to form sidewalls of said polysilicon for adjusting said fourth line width of said polysilicon.
Claim 3
Dependent Claim
17 words
A method according to claim 1 wherein said insulator is made of one of oxide and nitride.
Claim 4
Dependent Claim
12 words
A method according to claim 1 wherein said polysilicon is a polycide.
Claim 5
Dependent Claim
16 words
A method according to claim 3 wherein said polycide is formed by chemical vapor deposition (CVD).
Claim 6
Dependent Claim
16 words
A method according to claim 3 wherein said polycide is formed by physical vapor deposition (PVD).
Claim 7
Dependent Claim
16 words
A method according to claim 1 wherein said first layer of photoresist is formed by photolithography.
Claim 8
Dependent Claim
27 words
A method according to claim 6 wherein a light source used for photolithography is one selected from a group consisting of G-line, I-line, Deep UV, and X-ray.
Claim 9
Dependent Claim
19 words
A method according to claim 1 wherein said second layer of photoresist is formed by photolithography using a mask.
Claim 10
Dependent Claim
35 words
A method according to claim 8 wherein said third line interval and said third line width of said second layer of photoresist are equal to said first line interval and said first line width respectively.
Claim 11
Dependent Claim
47 words
A method according to claim 9 wherein said second layer of photoresist with said third line interval and said third line width is formed after horizontally shifting said mask by a distance (x+y)/2, wherein x is said second line interval and y is said second line width.
Claim 12
Dependent Claim
33 words
A method according to claim 10, wherein said fourth line interval and said fourth line width of said polysilicon are equal to said second line interval x and a line width (y-x)/2 respectively.
Claim 13
Dependent Claim
23 words
A method according to claim 1 wherein said relatively small line width of said polysilicon is ranged from 0.08 μm to 0.5 μm.
Claim 14
Dependent Claim
20 words
A method according to claim 1 wherein said polysilicon film has a thickness ranged from 50 Å to 1000 Å.
Claim 15
Dependent Claim
17 words
A method according to claim 1, wherein said sidewalls of said polysilicon is formed by anisotropic etch.