Semiconductor device having an elevated active region formed from a thick polysilicon layer and method of manufacture thereof

Claim 2

A process of forming a semiconductor device, the process comprising: forming a gate electrode on a substrate; forming a nitride layer on a surface of the gate electrode; forming a spacer on sidewalls of the gate electrode and the nitride layer adjacent to an active region of the substrate to form a resultant structure; forming a polysilicon layer over the resultant structure; planarizing the polysilicon layer leaving a remaining portion of the polysilicon layer disposed on the active region of the substrate; doping the remaining portion of the polysilicon layer to form an elevated active layer above the active region of the substrate; removing the nitride layer; and forming a silicide layer on surfaces of the gate electrode and the elevated active layer.

Claim 3

A process as recited in claim 1, wherein forming the nitride layer includes forming the nitride layer to a thickness based on a thickness of the spacer.

Claim 4

A process as recited in claim 1, further comprising implanting dopants into the active region of the substrate prior to forming the polysilicon layer.

Claim 5

A process as recited in claim 1, wherein the doping of the remaining portion of the polysilicon layer includes diffusing a dopant into the substrate to form an active region in the substrate.

Claim 6

A process as recited in claim 1, wherein the planarizing of the polysilicon layer includes a chemical mechanical polishing (CMP) process using the nitride layer as a stop layer for the CMP process.

Claim 7

A process as recited in claim 1, wherein the planarizing of the polysilicon layer includes etching the polysilicon layer using the nitride layer as a stop layer for the etching.

Claim 8

A process as recited in claim 1, further comprising implanting a first dopant into the active region of the substrate prior to forming the spacer.

Claim 9

A process as recited in claim 7, further comprising implanting a second dopant into the active region of the substrate after forming the spacer and prior to forming the polysilicon layer.

Claim 10

A process as recited in claim 7, wherein the doping of the remaining portion of the polysilicon layer includes diffusing a dopant from the remaining portion of the polysilicon layer into the substrate to form an active region in the substrate.

Claim 11

A process as recited in claim 1, wherein forming the silicide layer includes forming a first silicide layer on the gate electrode and forming a second silicide layer on the elevated active layer, separated from the first silicide layer by the spacer.

Claim 12

A process of forming a semiconductor device, the process comprising: forming a gate oxide layer on a surface of a semiconductor substrate; forming a gate electrode layer on the gate oxide layer; forming a nitride layer on a surface of the gate electrode layer; etching the gate electrode layer and the nitride layer to form a plurality of gate electrode and nitride layer stacked structures, an active region of the substrate being defined by adjacent walls of the gate electrode and nitride layer stacked structures; forming spacers on the adjacent walls of the gate electrode and nitride layer structures; forming a polysilicon layer over the substrate after forming the spacers planarizing the polysilicon layer using the nitride layers as an etch stop layer leaving a portion of the polysilicon layer disposed on the active region of the substrate between the spacers; doping the portion of the polysilicon layer disposed on the active region of the substrate to form an elevated active layer above the active region of the substrate; and forming a silicide layer on a surface of the elevated active region.

Claim 13

A process of forming a semiconductor device, the process comprising: forming a gate oxide layer on a surface of a semiconductor substrate; forming a gate electrode layer on the gate oxide layer; forming a nitride layer on a surface of the gate electrode layer; etching the gate electrode layer and the nitride layer to form a plurality of gate electrode and nitride layer stacked structures, an active region of the substrate being defined by adjacent walls of the gate electrode and nitride layer stacked structures; forming spacers on the adjacent walls of the gate electrode and nitride layer structures; forming a polysilicon layer over the substrate after forming the spacers planarizing the polysilicon layer using the nitride layers as an etch stop layer leaving a portion of the polysilicon layer disposed on the active region of the substrate between the spacers; doping the portion of the polysilicon layer disposed on the active region of the substrate to form an elevated active layer above the active region of the substrate; and forming a silicide layer on a surface of the elevated active region.

Claim 14

The process as recited in claim 11, wherein forming the nitride layer includes forming the nitride layer to a thickness based on a thickness of the spacers.

Claim 15

A process as recited in claim 11, further including removing the nitride layer and forming silicide layers on surfaces of the gate electrode layer, the silicide layer on the elevated active region being separated from the silicide layers on the gate electrode layer by the spacers.

Claim 16

A process of forming a semiconductor device, comprising: depositing a gate electrode layer over a substrate; depositing a nitride layer on a surface of the gate electrode layer; removing portions of the gate electrode layer and the nitride layer to form at least two gate electrode and nitride layer stacked structures and to define an active region of the substrate between adjacent walls of the two gate electrode and nitride layer stacked structures; forming spacers on the adjacent walls of the two gate electrode and the nitride layer stacked structures; depositing a polysilicon layer over the substrate after forming the spacers; polishing the polysilicon layer to remove the polysilicon layer from over the two gate electrode and nitride layer stacked structures and leave a remaining portion of the polysilicon layer disposed on the active region of the substrate between the spacers; doping the remaining portion of the polysilicon layer to form an elevated active layer above the active region of the substrate; removing the nitride layer; and forming a first silicide layer on a surface of the elevated active region and second silicide layers on surfaces of the gate electrode layer, the second silicide layers being separated from the first silicide layer by the spacers.

Claim 17

A process of forming a semiconductor device, comprising: depositing a gate electrode layer over a substrate; depositing a nitride layer on a surface of the gate electrode layer; removing portions of the gate electrode layer and the nitride layer to form at least two gate electrode and nitride layer stacked structures and to define an active region of the substrate between adjacent walls of the two gate electrode and nitride layer stacked structures; forming spacers on the adjacent walls of the two gate electrode and the nitride layer stacked structures; depositing a polysilicon layer over the substrate after forming the spacers; polishing the polysilicon layer to remove the polysilicon layer from over the two gate electrode and nitride layer stacked structures and leave a remaining portion of the polysilicon layer disposed on the active region of the substrate between the spacers; doping the remaining portion of the polysilicon layer to form an elevated active layer above the active region of the substrate; removing the nitride layer; and forming a first silicide layer on a surface of the elevated active region and second silicide layers on surfaces of the gate electrode layer, the second silicide layers being separated from the first silicide layer by the spacers.