Patent US5875507A successfully refreshed from Google Patents.
US5875507A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wafer cleaning apparatus
Assignee: Lam Research Corp
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Filing: 1996-07-15
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Granted: 1999-03-02
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Expires: 2016-07-15
Abstract
Abstract An apparatus for cleaning a wafer oriented vertically is provided. The apparatus includes a first brush and a second brush located horizontally from the first brush. During use, a wafer is orientated vertically between the first and second brushes. The brushes are brought into contact with the wafer and rotated thereby engaging the wafer with rollers. By rotating the rollers, the wafer is also rotated. Liquid is sprayed towards the brushes and wafer. By orienting the wafer vertically, liquid and particulates contained therein readily fall from the wafer due to gravity. This is particularly advantageous when cleaning larger diameter wafers in which particulates must be removed from a larger wafer surface area.
Inventors
- 👤 Donald Edgar Stephens
- 👤 Oliver David Jones
- 👤 Hugo John Miller, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 20:05
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406; H10P72/0411; H10P72/0414; H10P72/0412; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
187 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a first brush positioner which moves said first brush from a first position to a second position, wherein said first brush positioner comprises a first plate, said first brush mounted to a first shaft mounted to said first plates; and a second brush positioner which moves said second brush from a first position to a second position, a distance between said first brush and said second brush being greater when said first brush is in said first position and said second brush is in said first position than when said first brush is in said second position and said second brush is in said second position, wherein said second brush positioner comprises a second plate, said second brush mounted to a second shaft mounted to said second plate, said first plate being coupled to said second plate by a pivot.
Claim 2
Dependent Claim
187 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a first brush positioner which moves said first brush from a first position to a second position, wherein said first brush positioner comprises a first plate, said first brush mounted to a first shaft mounted to said first plates; and a second brush positioner which moves said second brush from a first position to a second position, a distance between said first brush and said second brush being greater when said first brush is in said first position and said second brush is in said first position than when said first brush is in said second position and said second brush is in said second position, wherein said second brush positioner comprises a second plate, said second brush mounted to a second shaft mounted to said second plate, said first plate being coupled to said second plate by a pivot.
Claim 3
Dependent Claim
39 words
The wafer cleaning apparatus of claim 1 further comprising an air cylinder having a piston, said piston coupled to said first plate and adapted to move said first plate and by said pivot adapted to move said second plate.
Claim 4
Dependent Claim
24 words
The wafer cleaning apparatus of claim 2 further comprising a pressure transducer, said piston being coupled to said first plate by said pressure transducer.
Claim 5
Dependent Claim
56 words
The wafer cleaning apparatus of claim 3 wherein said first brush and said second brush contact a wafer when in said second position, a perpendicular component of force exerted on said wafer by said first brush and said second brush being controlled by measuring and controlling the force exerted by said piston on said pressure transducer.
Claim 6
Dependent Claim
64 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a housing having a vertical slot therein; and a door which opens and closes said vertical slot.
Claim 7
Dependent Claim
64 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a housing having a vertical slot therein; and a door which opens and closes said vertical slot.
Claim 8
Dependent Claim
19 words
The wafer cleaning apparatus of claim 5 wherein each roller of said pair of rollers has a V-groove therein.
Claim 9
Dependent Claim
28 words
The wafer cleaning apparatus of claim 5 further comprising: a first shaft having said first brush mounted thereon; and a second shaft having said second brush mounted thereon.
Claim 10
Dependent Claim
28 words
The wafer cleaning apparatus of claim 7 further comprising: a first rotary union mounted to said first shaft; and a second rotary union mounted to said second shaft.
Claim 11
Dependent Claim
50 words
The wafer cleaning apparatus of claim 7 further comprising: a first motor connected to said first shaft capable of rotating said first shaft and thereby rotating said first brush; and a second motor connected to said second shaft capable of rotating said second shaft and thereby rotating said second brush.
Claim 12
Dependent Claim
35 words
The wafer cleaning apparatus of claim 5 wherein said first brush and said second brush are made from the group consisting of polyvinyl alcohol (PVA), nylon, mohair and polishing pad material mounted on a mandrel.
Claim 13
Dependent Claim
24 words
The wafer cleaning apparatus of claim 5 further comprising a motor coupled to said pair of rollers capable of rotating said pair of rollers.
Claim 14
Dependent Claim
117 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a first shaft having a first end with said first brush mounted thereon; and a second shaft having a first end with said second brush mounted thereon, wherein said first shaft has a cavity formed therein and has perforations in the region where said first brush is mounted and wherein said second shaft has a cavity formed therein and has perforations in the region where said second brush is mounted.
Claim 15
Dependent Claim
117 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a first shaft having a first end with said first brush mounted thereon; and a second shaft having a first end with said second brush mounted thereon, wherein said first shaft has a cavity formed therein and has perforations in the region where said first brush is mounted and wherein said second shaft has a cavity formed therein and has perforations in the region where said second brush is mounted.
Claim 16
Dependent Claim
112 words
A wafer cleaning apparatus comprising: a first brush, a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a first set of spray nozzles capable of spraying a first liquid towards said first brush; a second set of spray nozzles capable of spraying said first liquid towards said second brush; a third set of spray nozzles capable of spraying a second liquid towards said first brush; and a fourth set of spray nozzles capable of spraying said second liquid towards said second brush.
Claim 17
Dependent Claim
112 words
A wafer cleaning apparatus comprising: a first brush, a second brush located horizontally from said first brush, said first brush and said second brush defining a region in between; a pair of rollers located vertically below said region defined by said first brush and said second brush; a first set of spray nozzles capable of spraying a first liquid towards said first brush; a second set of spray nozzles capable of spraying said first liquid towards said second brush; a third set of spray nozzles capable of spraying a second liquid towards said first brush; and a fourth set of spray nozzles capable of spraying said second liquid towards said second brush.
Claim 18
Dependent Claim
14 words
The wafer cleaning apparatus of claim 13 wherein said first liquid is a surfactant.
Claim 19
Dependent Claim
109 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush; a first set of spray nozzles, wherein said first set of spray nozzles comprises a first nozzle capable of spraying a first liquid towards said first brush and a second nozzle capable of spraying a second liquid towards said first brush; and a second set of spray nozzles, wherein said second set of spray nozzles comprises a first nozzle capable of spraying said first liquid towards said second brush and a second nozzle capable of spraying said second liquid towards said second brush, said second liquid being different than said first liquid.
Claim 20
Dependent Claim
109 words
A wafer cleaning apparatus comprising: a first brush; a second brush located horizontally from said first brush; a first set of spray nozzles, wherein said first set of spray nozzles comprises a first nozzle capable of spraying a first liquid towards said first brush and a second nozzle capable of spraying a second liquid towards said first brush; and a second set of spray nozzles, wherein said second set of spray nozzles comprises a first nozzle capable of spraying said first liquid towards said second brush and a second nozzle capable of spraying said second liquid towards said second brush, said second liquid being different than said first liquid.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-01 | 2002-08-31 | 2003-03-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-01 | 2006-08-31 | 2007-03-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-01 | 2010-08-31 | 2011-03-02 | $7700.00 | Window Closed / Lapsed |