US5624501A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for cleaning semiconductor wafers
Assignee: Individual
•
Filing: 1995-09-26
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Granted: 1997-04-29
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Expires: 2015-09-26
Abstract
Abstract Opposed, conically shaped brushes are utilized to mechanically and chemically removed foreign material from the surfaces of a semiconductor wafer. The brushes are be readily accessed for cleaning and contact a relatively large surface area of the wafer.
Inventors
- 👤 Gerald L. Gill, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 18:13
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406; H10P72/0411; H10P72/0414; B; B08; B08B; B08B1/00; B08B1/30; B08B1/32; B08B1/36; H10P72/0412; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
273 words
Apparatus for cleaning work surfaces (102, 103) of a wafer, comprising (a) a first cleaning assembly including a first conical cleaning surface (10A, 60) extending around a first axis such that a line perpendicular to said first axis passes through a pair of separate points on said first conical cleaning surface which are each generally equidistant from said first axis; (b) a second cleaning assembly including a second conical cleaning surface opposed to said first conical cleaning surface, said second conical cleaning surface (10B, 60) extending around a second axis such that a line perpendicular to said second axis passes through a pair of separate points on said second conical cleaning surface which are each generally equidistant from said second axis, said first and second conical cleaning surfaces being canted with respect to one another and said first and second axes being canted with respect to one another such that a radial contact portion of said first conical cleaning surface is substantially parallel and opposed to a radial contact portion of said second conical cleaning surface; (c) support means for supporting the wafer such that the work surfaces (102, 103) are each intermediate and contact a different one of said parallel radial contact portions of said first and second conical cleaning surfaces; and, (d) motive power means for moving at least one of the surfaces in the group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, to cause relative movement between said work surface of said wafer and at least one of said first and second conical cleaning surfaces.
Claim 2
Dependent Claim
273 words
Apparatus for cleaning work surfaces (102, 103) of a wafer, comprising (a) a first cleaning assembly including a first conical cleaning surface (10A, 60) extending around a first axis such that a line perpendicular to said first axis passes through a pair of separate points on said first conical cleaning surface which are each generally equidistant from said first axis; (b) a second cleaning assembly including a second conical cleaning surface opposed to said first conical cleaning surface, said second conical cleaning surface (10B, 60) extending around a second axis such that a line perpendicular to said second axis passes through a pair of separate points on said second conical cleaning surface which are each generally equidistant from said second axis, said first and second conical cleaning surfaces being canted with respect to one another and said first and second axes being canted with respect to one another such that a radial contact portion of said first conical cleaning surface is substantially parallel and opposed to a radial contact portion of said second conical cleaning surface; (c) support means for supporting the wafer such that the work surfaces (102, 103) are each intermediate and contact a different one of said parallel radial contact portions of said first and second conical cleaning surfaces; and, (d) motive power means for moving at least one of the surfaces in the group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, to cause relative movement between said work surface of said wafer and at least one of said first and second conical cleaning surfaces.
Claim 3
Independent Claim
269 words
A method of cleaning opposed work surfaces of a wafer, comprising the steps of (a) providing cleaning apparatus including (i) a first cleaning assembly including a first conical cleaning surface extending around a first axis such that a line perpendicular to said first axis passes through a pair of separate points on said first conical cleaning surface which are each generally equidistant from said first axis, (ii) a second cleaning assembly including a second conical cleaning surface said second conical cleaning surface extending around a second axis such that a line perpendicular to said second axis passes through a pair of separate points on said second conical cleaning surface which are each generally equidistant from said second axis, said first and second conical cleaning surfaces being canted with respect to one another and said first and second axes being canted with respect to one another such that a radial contact portion of said first conical cleaning surface is substantially parallel and opposed to a radial contact portion of said second conical cleaning surface; (b) positioning the wafer intermediate said first and second conical cleaning surfaces such that each of said work surfaces contacts a different one of said radial contact portions of said first and second conical cleaning surfaces; and, (c) moving at least one of the surfaces in the group consisting of (i) said work surfaces of the wafer, (ii) said first conical surface, and (iii) said second conical cleaning surface, to cause relative movement between said wafer and at least one of said first and second conical cleaning surfaces to clean said work surfaces of the wafer.
Claim 4
Independent Claim
269 words
A method of cleaning opposed work surfaces of a wafer, comprising the steps of (a) providing cleaning apparatus including (i) a first cleaning assembly including a first conical cleaning surface extending around a first axis such that a line perpendicular to said first axis passes through a pair of separate points on said first conical cleaning surface which are each generally equidistant from said first axis, (ii) a second cleaning assembly including a second conical cleaning surface said second conical cleaning surface extending around a second axis such that a line perpendicular to said second axis passes through a pair of separate points on said second conical cleaning surface which are each generally equidistant from said second axis, said first and second conical cleaning surfaces being canted with respect to one another and said first and second axes being canted with respect to one another such that a radial contact portion of said first conical cleaning surface is substantially parallel and opposed to a radial contact portion of said second conical cleaning surface; (b) positioning the wafer intermediate said first and second conical cleaning surfaces such that each of said work surfaces contacts a different one of said radial contact portions of said first and second conical cleaning surfaces; and, (c) moving at least one of the surfaces in the group consisting of (i) said work surfaces of the wafer, (ii) said first conical surface, and (iii) said second conical cleaning surface, to cause relative movement between said wafer and at least one of said first and second conical cleaning surfaces to clean said work surfaces of the wafer.
Claim 5
Dependent Claim
24 words
The apparatus of claim 1 wherein at least a portion of said support means is positioned intermediate said first and second conical cleaning surfaces.
Claim 6
Dependent Claim
11 words
The apparatus of claim 1 wherein said support means free wheels.
Claim 7
Dependent Claim
11 words
The apparatus of claim 1 wherein said support means is driven.
Claim 8
Dependent Claim
18 words
The apparatus of claim 1 wherein said support means includes disk means for contacting and supporting the wafer.
Claim 9
Dependent Claim
28 words
The apparatus of claim 6 wherein (a) the wafer includes a peripheral edge; and, (b) said disk means includes a groove in which said peripheral edge is seated.
Claim 10
Dependent Claim
82 words
The apparatus of claim 1 wherein (a) said first and second conical cleaning surfaces each have a center and a peripheral edge; and, (b) the wafer is shaped and dimensioned and positioned to (i) lie substantially entirely intermediate said center and said peripheral edge of at least one of said first and second conical cleaning surfaces; and, (ii) be centered on a single radial line extending from said center to said peripheral edge of at least one of said conical cleaning surfaces.
Claim 11
Dependent Claim
74 words
The apparatus of claim 1 wherein said canting of said first and second conical cleaning surfaces also, in addition to moving said radial contact portion of said first conical cleaning surface into substantially parallel relationship with said radial contact portion of said second conical cleaning surface, cants a portion of said first conical cleaning surface away from said second conical cleaning surface to facilitate the cleaning of said first and second conical cleaning surfaces.
Claim 12
Dependent Claim
74 words
The method of claim 2 wherein said canting of said first and second conical cleaning surfaces also, in addition to moving said radial contact portion of said first conical cleaning surface into substantially parallel relationship with said radial contact portion of said second conical cleaning surface, cants a portion of said first conical cleaning surface away from said second conical cleaning surface to facilitate the cleaning of said first and second conical cleaning surfaces.
Claim 13
Dependent Claim
54 words
The apparatus of claim 3 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to rotate between said first and second conical cleaning surfaces.
Claim 14
Dependent Claim
54 words
The apparatus of claim 4 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to mute between said first and second conical cleaning surfaces.
Claim 15
Dependent Claim
54 words
The apparatus of claim 5 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to rotate between said first and second conical cleaning surfaces.
Claim 16
Dependent Claim
54 words
The apparatus of claim 6 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to rotate between said first and second conical cleaning surfaces.
Claim 17
Dependent Claim
54 words
The apparatus of claim 7 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to rotate between said first and second conical cleaning surfaces.
Claim 18
Dependent Claim
54 words
The apparatus of claim 8 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to rotate between said first and second conical cleaning surfaces.
Claim 19
Dependent Claim
54 words
The apparatus of claim 9 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to rotate between said first and second conical cleaning surfaces.
Claim 20
Dependent Claim
54 words
The method of claim 10 wherein movement by said motive power means of at least one in said group consisting of (i) said work surfaces of the wafer, (ii) said first conical cleaning surface, and (iii) said second conical cleaning surface, causes said wafer to rotate between said first and second conical cleaning surfaces.
Claim 21
Dependent Claim
144 words
Apparatus for cleaning a work surface of a wafer, comprising (a) a cleaning assembly including a conical cleaning surface extending around an axis such that a line perpendicular to said axis passes through a pair of separate points on said conical cleaning surface which are each generally equidistant from said axis, said conical cleaning surface and said axis each being canted with respect said work surface such that a radial contact portion of said conical cleaning surface is substantially parallel to said work surface; (b) support means for supporting the wafer such that said work surface is adjacent and contacts said radial portion of said conical cleaning surface; (c) motive power means for moving at least one of the surfaces in the group consisting of (i) said work surface of the wafer, and (ii) said conical cleaning surface, to cause said wafer to rotate.
Claim 22
Dependent Claim
144 words
Apparatus for cleaning a work surface of a wafer, comprising (a) a cleaning assembly including a conical cleaning surface extending around an axis such that a line perpendicular to said axis passes through a pair of separate points on said conical cleaning surface which are each generally equidistant from said axis, said conical cleaning surface and said axis each being canted with respect said work surface such that a radial contact portion of said conical cleaning surface is substantially parallel to said work surface; (b) support means for supporting the wafer such that said work surface is adjacent and contacts said radial portion of said conical cleaning surface; (c) motive power means for moving at least one of the surfaces in the group consisting of (i) said work surface of the wafer, and (ii) said conical cleaning surface, to cause said wafer to rotate.
References Cited (Backward Citations)
US3970471A
Cited
US4344260A
Cited
US4662124A
Cited
US4811443A
Cited
US5351360A
Cited
US5375291A
Cited
US5311634A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-04-28 | 2000-10-28 | 2001-04-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-04-28 | 2004-10-28 | 2005-04-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-04-28 | 2008-10-28 | 2009-04-29 | $7700.00 | Window Closed / Lapsed |