US5866950A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package and fabrication method
Assignee: Toshiba Corp
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Filing: 1996-11-14
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Granted: 1999-02-02
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Expires: 2016-11-14
Abstract
Abstract A semiconductor package comprises a circuit board having a wiring circuit including at least a connecting portion, the wiring circuit being formed on a first main surface of the circuit board, a semiconductor chip mounted on the first main surface of the circuit board on face-down basis, an insulation resin layer filled in a space between the semiconductor chip and the circuit board, and a flat-type external connecting terminal electrically connected to the semiconductor chip and formed and exposed to a second main surface of the circuit board.
Inventors
- 👤 Hiroshi Iwasaki
- 👤 Hideo Aoki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:28
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/15; H10W72/071; H10W72/072; H10W72/07231; H10W72/07232; H10W72/07233; H10W72/07236; H10W72/073; H10W72/07331; H10W72/07337; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
183 words
A thin-type semiconductor package comprising: a circuit board having a wiring circuit on a first main surface of the circuit board and a connecting portion on and raised above the wiring circuit, and the connecting portion made of a first metal; an electronic device including a semiconductor chip mounted in face-down relation on the first main surface, the chip having an electrode terminal portion on and protruding below a face of the chip, wherein the connecting portion has a raised shape corresponding to the electrode terminal portion so that at least a portion of the electrode terminal portion is buried into the connecting portion, and the electrode terminal portion made of a second metal; a flat-type external connecting terminal electrically connected to said electronic device and disposed on and exposed at a second main surface of the circuit board; and an insulating resin layer sealing the first main surface of said circuit board including said electronic device, wherein the connecting portion and the electrode terminal portion of the electronic device have a solid-phase diffused zone of the first metal and the second metal.
Claim 2
Dependent Claim
183 words
A thin-type semiconductor package comprising: a circuit board having a wiring circuit on a first main surface of the circuit board and a connecting portion on and raised above the wiring circuit, and the connecting portion made of a first metal; an electronic device including a semiconductor chip mounted in face-down relation on the first main surface, the chip having an electrode terminal portion on and protruding below a face of the chip, wherein the connecting portion has a raised shape corresponding to the electrode terminal portion so that at least a portion of the electrode terminal portion is buried into the connecting portion, and the electrode terminal portion made of a second metal; a flat-type external connecting terminal electrically connected to said electronic device and disposed on and exposed at a second main surface of the circuit board; and an insulating resin layer sealing the first main surface of said circuit board including said electronic device, wherein the connecting portion and the electrode terminal portion of the electronic device have a solid-phase diffused zone of the first metal and the second metal.
Claim 3
Dependent Claim
20 words
The semiconductor package as set forth in claim 1, wherein the insulating resin layer is formed of an epoxy resin.
Claim 4
Dependent Claim
25 words
The semiconductor package as set forth in claim 1, wherein a thickness of the circuit board is in the range from 0.2 to 0.5 mm.
Claim 5
Dependent Claim
25 words
The semiconductor package as set forth in claim 1, wherein a thickness of the semiconductor chip is in the range from 0.2 to 0.5 mm.
Claim 6
Dependent Claim
25 words
The semiconductor package as set forth in claims 1, 2, 3, or 4, wherein a thickness of the semiconductor package is 1 mm or less.
Claim 7
Dependent Claim
21 words
The semiconductor package as set forth in claim 5, wherein the thickness of the semiconductor package is 0.6 mm or less.
Claim 8
Dependent Claim
22 words
The semiconductor package as set forth in claim 1, wherein the insulating resin layer is formed by a liquid transfer molding method.
Claim 9
Dependent Claim
31 words
A thin-type semiconductor package as set forth in claim 10, wherein the circuit board has a supporting cured resin layer so that the wiring circuit and the connecting portion are exposed.
References Cited (Backward Citations)
US3495133A
Cited
US3887760A
Cited
US3923231A
Cited
GB2081974A
Cited
GB2204182A
Cited
EP0231937A2
Cited
US4961105A
Cited
US4962415A
Cited
EP0321239A2
Cited
JPH027180A
Cited
EP0388011A2
Cited
JPH032099A
Cited
JPH0451532A
Cited
JPH04352439A
Cited
US5350947A
Cited
US5203076A
Cited
US5407864A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-02-01 | 2002-08-03 | 2003-02-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-02-01 | 2006-08-03 | 2007-02-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-02-01 | 2010-08-03 | 2011-02-02 | $7700.00 | Window Closed / Lapsed |