Patent US5864062A successfully refreshed from Google Patents.
US5864062A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor acceleration sensor
Assignee: Mitsubishi Electric Corp
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Filing: 1997-05-28
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Granted: 1999-01-26
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Expires: 2017-05-28
Abstract
Abstract A semiconductor acceleration sensor comprises a semiconductor sensor chip for detecting acceleration and an IC chip for processing the signal from this sensor chip, the IC chip is bonded to the sensor chip, the sensor chip is mounted to a die pad, electrical connection is established by lead wires connected to lead terminals, and a package is formed by molding with resin wherein the die pad is electrically connected to a particular lead terminal by a lead wire and is grounded by the particular lead terminal, and the die pad is positioned remote from the mounting surface of the package.
Inventors
- 👤 Teruaki Nagahara
- 👤 Hiroshi Otani
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:42
CPC Classifications
B; B81; B81C; B81C1/00; B81C1/00015; B81C1/00222; B81C1/0023; G; G01; G01P; G01P1/00; G01P1/02; G01P1/023; G01P15/00; G01P15/02; G01P15/08; G01P15/125; H; H10; H10W; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
105 words
A semiconductor acceleration sensor comprising: a semiconductor sensor chip for detecting acceleration; an IC chip bonded to said sensor chip for processing a signal from said sensor chip; a die pad on which said semiconductor sensor chip is mounted; and a package with a plurality of lead terminals for resin molding said semiconductor sensor chip, IC chip and die pad together with lead wires for connecting them, wherein said die pad is electrically connected with a lead wire to ground said die pad through one of said lead terminals and said die pad is positioned remote from a mounting plate of said semiconductor sensor chip.
Claim 2
Dependent Claim
105 words
A semiconductor acceleration sensor comprising: a semiconductor sensor chip for detecting acceleration; an IC chip bonded to said sensor chip for processing a signal from said sensor chip; a die pad on which said semiconductor sensor chip is mounted; and a package with a plurality of lead terminals for resin molding said semiconductor sensor chip, IC chip and die pad together with lead wires for connecting them, wherein said die pad is electrically connected with a lead wire to ground said die pad through one of said lead terminals and said die pad is positioned remote from a mounting plate of said semiconductor sensor chip.
Claim 3
Dependent Claim
47 words
The semiconductor acceleration sensor according to claim 1, wherein said semiconductor sensor chip detects acceleration and converts to a change in electrostatic capacity, and said IC chip converts the change in electrostatic capacity output from said semiconductor sensor chip to an electrical signal and applies processing thereto.
Claim 4
Dependent Claim
120 words
The semiconductor acceleration sensor according to claim 2, wherein said semiconductor sensor chip is formed by bonding a pair of opposing protective substrates with a sensor unit disposed therebetween, said sensor unit is formed on a silicon substrate for detecting acceleration from the electrostatic capacity between a fixed electrode and a moving electrode that is displaced by the force of inertia at acceleration, and has an external frame that defines the contour of the sensor unit and is formed to be insulated from the moving electrode and fixed electrode while enclosing the moving electrode and fixed electrode, where said external frame is electrically connected to a particular lead terminal by a lead wire, and is grounded by said lead terminal.
Claim 5
Dependent Claim
41 words
The semiconductor acceleration sensor according to claim 1, wherein said semiconductor sensor chip is covered completely with a conductive metal vapor deposition coating and is grounded by electrically connecting said coating to one of said plural lead terminals with lead wire.
Claim 6
Dependent Claim
98 words
The semiconductor acceleration sensor according to claim 4, wherein said semiconductor sensor chip is formed by bonding a pair of opposing protective substrates with a sensor unit disposed therebetween, where the sensor unit is formed on a silicon substrate for detecting acceleration from the electrostatic capacity between a fixed electrode and a moving electrode that is displaced by the force of inertia from acceleration, and has an external frame that defines the contour of the sensor unit and is formed to be insulated from the moving electrode and fixed electrode while enclosing the moving electrode and fixed electrode.
Claim 7
Dependent Claim
41 words
The semiconductor acceleration sensor according to claim 1, wherein said semiconductor acceleration sensor is mounted on a circuit board so that said semiconductor sensor chip and said IC chip are positioned over the ground wiring pattern formed on the circuit board.
Claim 8
Dependent Claim
24 words
The semiconductor acceleration sensor according to claim 1, wherein said lead terminal which grounds said die pad is further connected to a bypass capacitor.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-25 | 2002-07-27 | 2003-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-25 | 2006-07-27 | 2007-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-25 | 2010-07-27 | 2011-01-26 | $7700.00 | Window Closed / Lapsed |