US5545912A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device enclosure including a conductive cap and substrate
Assignee: NXP USA Inc
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Filing: 1994-10-27
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Granted: 1996-08-13
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Expires: 2014-10-27
Abstract
Abstract An enclosure (8) for an electronic device (26) such as, for example, an accelerometer. The enclosure (8) includes a conductive semiconductor substrate (12) underlying the electronic device (26), a conductive cap (16) overlying the electronic device (26), and a power supply (25) having one or more outputs (27, 29) each with a substantially fixed potential wherein one output is electrically coupled to the conductive semiconductor substrate (12) and another output to the conductive cap (16). In a preferred embodiment, substrate ( 12 ) and cap (16) are coupled to the same power supply output (27). This coupling substantially eliminates the adverse effects of parasitic capacitances of the substrate (12) and cap (16) to reduce measurement error and EMI when a capacitive accelerometer is used as the electronic device (26).
Inventors
- 👤 Ljubisa Ristic
- 👤 Daniel N. Koury
- 👤 John E. Schmiesing
- 👤 Ronald J. Gutteridge
- 👤 Henry G. Hughes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:30
CPC Classifications
G; G01; G01P; G01P1/00; G01P1/02; G01P1/023; H; H10; H10W; H10W76/00; H10W76/10; G01P15/00; G01P15/02; G01P15/08; G01P15/125; H10W72/00; H10W72/50; H10W72/531; H10W72/5366
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
66 words
An enclosure for an electronic device comprising: a conductive semiconductor substrate underlying said electronic device; a dielectric layer on said substrate; a conductive cap overlying said electronic device and bonded to said dielectric layer using a bonding layer; and a power supply output having a substantially fixed potential, wherein said power supply output is electrically coupled to said conductive semiconductor substrate and to said conductive cap.
Claim 2
Dependent Claim
66 words
An enclosure for an electronic device comprising: a conductive semiconductor substrate underlying said electronic device; a dielectric layer on said substrate; a conductive cap overlying said electronic device and bonded to said dielectric layer using a bonding layer; and a power supply output having a substantially fixed potential, wherein said power supply output is electrically coupled to said conductive semiconductor substrate and to said conductive cap.
Claim 3
Dependent Claim
27 words
The enclosure of claim 1 further comprising a metal layer disposed on said conductive cap, wherein said metal layer is electrically connected to said power supply output.
Claim 4
Dependent Claim
48 words
The enclosure of claim 1 wherein said electronic device is a capacitive accelerometer having a bottom plate disposed overlying said conductive semiconductor substrate, having a middle plate overlying said bottom plate and movable in response to an acceleration force, and having a top plate overlying said middle plate.
Claim 5
Dependent Claim
21 words
The enclosure of claim 3 wherein said substantially fixed potential is substantially equal to a potential applied to said middle plate.
Claim 6
Dependent Claim
15 words
The enclosure of claim 3 wherein said bottom plate is directly on said dielectric layer.
Claim 7
Dependent Claim
18 words
The enclosure of claim 1 wherein said power supply output is provided by a bandgap regulator power supply.
Claim 8
Dependent Claim
41 words
The enclosure of claim 1 wherein: said conductive semiconductor substrate has a dopant concentration greater than about 10 18 atoms/cm 3 ; and said conductive cap is a semiconductor having a dopant concentration greater than about 10 18 atoms/cm 3 .
Claim 9
Dependent Claim
19 words
The enclosure of claim 1 wherein said bonding layer further provides a hermetically sealed environment for said electronic device.
Claim 10
Dependent Claim
25 words
The enclosure of claim 1 wherein said bonding layer has been patterned to provide a cavity and said electronic device is sealed in said cavity.
Claim 11
Dependent Claim
20 words
The enclosure of claim 1 wherein: said conductive semiconductor substrate is n-type silicon; and said conductive cap is n-type silicon.
Claim 12
Dependent Claim
17 words
The enclosure of claim 10 wherein said bonding layer has a thickness less than about 50 microns.
Claim 13
Dependent Claim
16 words
The enclosure of claim 1 wherein at least a portion of said bonding layer is conductive.
Claim 14
Dependent Claim
13 words
The enclosure of claim 1 wherein said bonding layer is an insulating layer.
Claim 15
Dependent Claim
71 words
An enclosure for an electronic device comprising: a conductive semiconductor substrate underlying said electronic device; a conductive cap overlying said electronic device; a power supply output having a substantially fixed potential, wherein said power supply output is electrically coupled to said conductive semiconductor substrate and to said conductive cap; and a bonding pad disposed on said conductive semiconductor substrate, wherein said bonding pad is electrically connected to said power supply output.
Claim 16
Dependent Claim
71 words
An enclosure for an electronic device comprising: a conductive semiconductor substrate underlying said electronic device; a conductive cap overlying said electronic device; a power supply output having a substantially fixed potential, wherein said power supply output is electrically coupled to said conductive semiconductor substrate and to said conductive cap; and a bonding pad disposed on said conductive semiconductor substrate, wherein said bonding pad is electrically connected to said power supply output.
Claim 17
Dependent Claim
29 words
The enclosure of claim 14 further comprising a metal layer disposed on said conductive cap, wherein said bonding pad is connected to said metal layer by an electrical conductor.
Claim 18
Dependent Claim
86 words
An enclosure for an electronic device comprising: a conductive semiconductor substrate underlying said electronic device; a dielectric layer on said substrate; a conductive cap overlying said electronic device and bonded to said dielectric layer using a bonding layer; a first power supply output having a substantially fixed potential, wherein said first power supply output is electrically coupled to said conductive semiconductor substrate; and a second power supply output having a substantially fixed potential, wherein said second power supply output is electrically coupled to said conductive cap.
Claim 19
Dependent Claim
86 words
An enclosure for an electronic device comprising: a conductive semiconductor substrate underlying said electronic device; a dielectric layer on said substrate; a conductive cap overlying said electronic device and bonded to said dielectric layer using a bonding layer; a first power supply output having a substantially fixed potential, wherein said first power supply output is electrically coupled to said conductive semiconductor substrate; and a second power supply output having a substantially fixed potential, wherein said second power supply output is electrically coupled to said conductive cap.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-08-13 | 2000-02-12 | 2000-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-08-13 | 2004-02-12 | 2004-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-08-13 | 2008-02-12 | 2008-08-13 | $7700.00 | Window Closed / Lapsed |