US5863375A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and methods for wafer debonding using a liquid jet
Assignee: Fairchild Korea Semiconductor Ltd
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Filing: 1998-04-28
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Granted: 1999-01-26
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Expires: 2018-04-28
Abstract
Abstract Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers.
Inventors
- 👤 Gi-ho Cha
- 👤 Byoung-hun Lee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 19:06
CPC Classifications
B; B32; B32B; B32B43/00; B32B43/006; H; H10; H10P; H10P14/00; H10P14/20; B26; B26D; B26D3/00; B26D3/28; B26F; B26F3/00; B26F3/004; H10P72/00; H10P72/04; H10P72/0428; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/07331; H10W72/07337; H10W72/30; Y; Y10; Y10S; Y10S134/00; Y10S134/902; Y10S156/00; Y10S156/934; Y10S156/941; Y10T; Y10T156/00; Y10T156/11; Y10T156/1126; Y10T156/19; Y10T29/00; Y10T29/49; Y10T29/49815; Y10T29/49819; Y10T29/49822; Y10T29/53; Y10T29/53683
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
64 words
A wafer debonder which separates a bonded silicon-on-insulator wafer having a first wafer and a second wafer bonded to said first wafer at an interface therebetween comprising: a wafer loader which positions said bonded silicon-on-insulator wafer; and, a liquid jetting nozzle positioned adjacent said wafer loader to direct a jet of liquid at said interface to separate said first wafer from said second wafer.
Claim 2
Dependent Claim
64 words
A wafer debonder which separates a bonded silicon-on-insulator wafer having a first wafer and a second wafer bonded to said first wafer at an interface therebetween comprising: a wafer loader which positions said bonded silicon-on-insulator wafer; and, a liquid jetting nozzle positioned adjacent said wafer loader to direct a jet of liquid at said interface to separate said first wafer from said second wafer.
Claim 3
Dependent Claim
34 words
The wafer debonder of claim 1 further comprising supply means for supplying a jet of liquid from said liquid jetting nozzle at a pressure sufficient to separate said first wafer from said second wafer.
Claim 4
Dependent Claim
80 words
The wafer debonder of claim 1 wherein said wafer loader comprises: a first stand having a surface for positioning said bonded silicon-on-insulator wafer; and, a second stand having a surface positioned adjacent said surface of said first stand and extending at a predetermined angle relative to said surface of said first stand, said liquid jetting nozzle being positioned so as to direct a jet of liquid between said surface of said first stand and said surface of said second stand.
Claim 5
Dependent Claim
43 words
A wafer debonding method for separating a bonded silicon-on-insulator wafer having a first wafer and a second wafer bonded to said first wafer at an interface therebetween, said method comprising the steps of: jetting a liquid toward the interface to separate the wafers.
Claim 6
Dependent Claim
43 words
A wafer debonding method for separating a bonded silicon-on-insulator wafer having a first wafer and a second wafer bonded to said first wafer at an interface therebetween, said method comprising the steps of: jetting a liquid toward the interface to separate the wafers.
Claim 7
Dependent Claim
48 words
The wafer debonding method of claim 4 wherein said step of jetting a liquid comprises the step of jetting a liquid toward the interface at a jetting pressure which is at least twice the bonding strength between the first wafer and the second wafer to separate the wafers.
Claim 8
Dependent Claim
45 words
The wafer debonding method of claim 4 wherein said step of jetting a liquid comprises the step of jetting deionized water toward the interface at a jetting pressure greater than the bonding strength between the first wafer and the second wafer to separate the wafers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-25 | 2002-07-27 | 2003-01-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-25 | 2006-07-27 | 2007-01-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-25 | 2010-07-27 | 2011-01-26 | $7700.00 | Window Closed / Lapsed |