US4224504A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for practicing temperature gradient zone melting
Assignee: General Electric Co
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Filing: 1978-06-21
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Granted: 1980-09-23
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Expires: 1998-06-21
Abstract
Abstract An apparatus for practicing temperature gradient zone melting simultaneously on a plurality of semiconductor bodies comprises a closable work chamber for receiving the bodies for processing; a heat source disposed in the work chamber and comprising a first closure member thereof; a heat sink disposed in the work chamber and comprising a second closure member thereof and means for transferring one or more bodies of semiconductor material to the work chamber for processing and from the work chamber subsequent to processing. The transferring means comprises manipulative means for selectively engaging the semiconductor bodies and supporting the bodies in transit and drive means for moving the manipulative means toward and away from the work chamber and orienting the manipulative means with respect to the semiconductor bodies.
Inventors
- 👤 Carl A. Erikson
- 👤 Thomas R. Anthony
- 👤 Harvey E. Cline
- 👤 Siegwalt Ludke
- 👤 John O. Fielding
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 03:04
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0436; C; C30; C30B; C30B13/00; C30B13/005; C30B13/02
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
378 words
An apparatus for the simultaneous processing of one or more bodies of semiconductor material by temperature gradient zone melting, said apparatus comprising: a closable work chamber for receiving said semiconductor bodies for processing and including a first closure member and a second closure member; said first closure member having a radiative heating element heat source facing internally of said work chamber for heating said semiconductor bodies; said second closure member including a heat sink facing internally of said chamber and located opposite to said heat source, said heat sink cooperating with said heat source to produce a relatively uniform temperature gradient within said bodies of semiconductor material; said closure members defining at least in part said work chamber and at least one of said closure members being movable to allow access to the interior of said work chamber; means disposed in said work chamber for supporting said bodies of semiconductor material during processing; first means for storing bodies of semiconductor material prior to processing in said closable work chamber; second means for storing bodies of semiconductor material after processing in said closable work chamber; a first actuation means for providing relative movement between said first and said second closure members to effect the opening and closing of said work chamber; means for transferring one or more bodies of semiconductor material from said first storage means to said closable work chamber, for disposing said one or more bodies on said supporting means, and for transferring said one or more bodies from said supporting means to said second storage means; manipulative means for selectively engaging and supporting said bodies of semiconductor material during a transferring sequence, said manipulative means comprising (1) means for selectively attaching to said bodies of semiconductor material, and (2) a second actuation means for placing said attaining means in contact with said bodies of semiconductor material; drive means for moving said manipulative means toward and away from a plurality of stations including the interior of said closable work chamber, said first storage means, and said second storage means, said drive means comprising (1) means including a third actuation means for propelling said manipulative means in a rectilinear direction, and (2) means including a fourth actuation means for pivotally propelling said manipulative means in an arcuate direction.
Claim 2
Independent Claim
378 words
An apparatus for the simultaneous processing of one or more bodies of semiconductor material by temperature gradient zone melting, said apparatus comprising: a closable work chamber for receiving said semiconductor bodies for processing and including a first closure member and a second closure member; said first closure member having a radiative heating element heat source facing internally of said work chamber for heating said semiconductor bodies; said second closure member including a heat sink facing internally of said chamber and located opposite to said heat source, said heat sink cooperating with said heat source to produce a relatively uniform temperature gradient within said bodies of semiconductor material; said closure members defining at least in part said work chamber and at least one of said closure members being movable to allow access to the interior of said work chamber; means disposed in said work chamber for supporting said bodies of semiconductor material during processing; first means for storing bodies of semiconductor material prior to processing in said closable work chamber; second means for storing bodies of semiconductor material after processing in said closable work chamber; a first actuation means for providing relative movement between said first and said second closure members to effect the opening and closing of said work chamber; means for transferring one or more bodies of semiconductor material from said first storage means to said closable work chamber, for disposing said one or more bodies on said supporting means, and for transferring said one or more bodies from said supporting means to said second storage means; manipulative means for selectively engaging and supporting said bodies of semiconductor material during a transferring sequence, said manipulative means comprising (1) means for selectively attaching to said bodies of semiconductor material, and (2) a second actuation means for placing said attaining means in contact with said bodies of semiconductor material; drive means for moving said manipulative means toward and away from a plurality of stations including the interior of said closable work chamber, said first storage means, and said second storage means, said drive means comprising (1) means including a third actuation means for propelling said manipulative means in a rectilinear direction, and (2) means including a fourth actuation means for pivotally propelling said manipulative means in an arcuate direction.
Claim 3
Dependent Claim
35 words
The apparatus of claim 1 wherein said first closure member is stationary, and said second closure member is movable by said first actuation means into and out of closing engagement with said first closure member.
Claim 4
Dependent Claim
39 words
The apparatus of claim 1 wherein said first, said second, said third and said fourth actuation means includes an actuator which is one selected from the group consisting of a hydraulic actuator, a pnuematic actuator, and a hydraulic-pneumatic actuator.
Claim 5
Dependent Claim
20 words
The apparatus of claim 1 wherein said radiative heating element emits radiation of a temperature as high as 3000° C.
Claim 6
Dependent Claim
16 words
The apparatus of claim 4 wherein said radiative heating element comprises a plurality of infrared lamps.
Claim 7
Dependent Claim
23 words
The apparatus of claim 5 wherein said radiative heating element is cooled by a flow of coolant fluid over and about said lamps.
Claim 8
Dependent Claim
11 words
The apparatus of claim 6 wherein said coolant fluid comprises air.
Claim 9
Dependent Claim
22 words
The apparatus of claim 1 wherein said heat sink comprises a substantially flat plate cooled by a flow of liquid coolant therethrough.
Claim 10
Dependent Claim
65 words
The apparatus of claim 1 wherein said attaching means comprises at least one vacuum line adapted for communication with a vacuum source, and a single one of said semiconductor bodies being engageable and supportable by said vacuum line at one end thereof by differential pressure means, and each of said vacuum lines terminates in a vacuum cup at said end engageable with said semiconductor bodies.
Claim 11
Dependent Claim
80 words
The apparatus of claim 9 wherein each of said vacuum lines comprises a flexible portion in communication with said vacuum source and a rigid end portion slidably received within a vacuum line guide, said vacuum line guides being movable by said second actuator, and each of said vacuum cups being fixed to and communicating with said rigid end portion and biased toward a position occupied by a corresponding body of semiconductor material prior to its engagement with said vacuum cup.
Claim 12
Dependent Claim
17 words
The apparatus of claim 9 wherein each of said vacuum cups is biased downwardly by a weight.
Claim 13
Dependent Claim
31 words
The apparatus of claim 10 and further including a manifold adapted for applying a vacuum to said vacuum lines, each of said vacuum lines being in fluid communication with said manifold.
Claim 14
Dependent Claim
25 words
The apparatus of claim 12 wherein said manifold is fixed to a manifold support movable with said vacuum line guide by said second actuation means.
Claim 15
Dependent Claim
23 words
The apparatus of claim 1 wherein said second actuation means comprises an actuator including a piston shaft operatively connected to said attaching means.
Claim 16
Dependent Claim
41 words
The apparatus of claim 1 wherein said first storage means includes at least one supporting base having a plurality of guides extending from a major surface thereof, and said guides serving to maintain the alignment of a stack of semiconductor bodies.
Claim 17
Dependent Claim
17 words
The apparatus of claim 15 wherein said supporting base is biased toward said bodies of semiconductor material.
Claim 18
Dependent Claim
43 words
The apparatus of claim 15 and further including means for separating said semiconductor bodies from each other, said separating means ensuring that said transferring means removes only a single semiconductor body at a time from each of said stacks to said work chamber.
Claim 19
Dependent Claim
69 words
The apparatus of claim 17 wherein said separating means comprises at least one gas nozzle disposed in proximity to each of said stacks of semiconductor bodies and adapted for communication with a source of pressurized gas, and said air nozzles being further adapted for directing a jet of gas at two or more bodies of semiconductor material moved from a single stack through said jet by said transferring means.
Claim 20
Dependent Claim
35 words
The apparatus of claim 1 wherein said second storage means comprises a supporting base having a plurality of guides disposed thereon and, said guides serving to maintain the alignment of a stack of semiconductor bodies.
Claim 21
Dependent Claim
23 words
The apparatus of claim 1 wherein said third actuation means comprises an actuator having a piston shaft operatively connected to said attaching means.
Claim 22
Dependent Claim
31 words
The apparatus of claim 1 wherein said third actuation means is operatively connected to said second actuation means and is selectively movable with said attaching means by said second actuation means.
Claim 23
Dependent Claim
23 words
The apparatus of claim 1 wherein said fourth actuation means comprises an actuator having a piston rod operatively connected to said attaching means.
Claim 24
Dependent Claim
20 words
The apparatus of claim 22 wherein said piston rod is connected to said attaching means through said third actuation means.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1983-09-23 | 1984-03-24 | 1984-09-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1987-09-23 | 1988-03-24 | 1988-09-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1991-09-23 | 1992-03-24 | 1992-09-23 | $7700.00 | Window Closed / Lapsed |