Method of manufacturing passive elements using conductive polypyrrole formulations

Claim 1

A method of forming an electronically conducting polymer resistor comprising the steps of: (a) applying a film of a formulation comprising pyrrole monomer and a salt onto a surface, wherein the salt consists of an electron acceptor containing Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 2

A method of forming an electronically conducting polymer resistor comprising the steps of: (a) applying a film of a formulation comprising pyrrole monomer and a salt onto a surface, wherein the salt consists of an electron acceptor containing Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 26

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, aniline, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, and mixtures thereof, wherein the formulation has a pyrrole:aniline molar ratio between about 1 and about 100; and (b) photopolymerizing the film over a portion of the surface to form the resistor.

Claim 27

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, aniline, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, and mixtures thereof, wherein the formulation has a pyrrole:aniline molar ratio between about 1 and about 100; and (b) photopolymerizing the film over a portion of the surface to form the resistor.

Claim 29

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing the film over a portion of the surface to form the resistor; and (c) heating the resistor to provide a post-thermal cure at a temperature of between about 25 and about 100 degrees Celsius for between about 0.1 and about 3 hours.

Claim 30

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing the film over a portion of the surface to form the resistor; and (c) heating the resistor to provide a post-thermal cure at a temperature of between about 25 and about 100 degrees Celsius for between about 0.1 and about 3 hours.

Claim 31

A method of forming an electronically conducting polymer resistor comprising the steps of: (a) applying a film of a formulation comprising pyrrole monomer and a salt onto a substrate surface, the salt consisting essentially of Ag + cations and dopant anions selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 32

A method of forming an electronically conducting polymer resistor comprising the steps of: (a) applying a film of a formulation comprising pyrrole monomer and a salt onto a substrate surface, the salt consisting essentially of Ag + cations and dopant anions selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 34

A method of forming a plurality of electronically conducting polymer resistors having different electrical resistances on a common substrate surface, the method comprising the steps of: (a) preparing a plurality of formulations comprising a monomer and a salt, wherein the salt consists of Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof, and wherein each of the formulations has a different molar concentration of salt for forming resistors having resistances within a given range; (b) applying a film of a formulation onto the substrate surface; (c) photopolymerizing a portion of the film to form a resistor, wherein the resistor extends between two contact points and has sufficient thickness and width so that the overall electrical resistance between the two contact points is somewhat less than a resistance specified for that resistor; (d) removing the formulation adjacent the resistor; (e) repeating steps (b) through (d) for each of the plurality of formulations; (f) heating the resistors to provide a thermal cure; (g) measuring the overall resistance of the resistor; (h) increasing the overall resistance of the resistor up to a specified resistance by trimming the resistor with a laser; and (i) repeating steps (g) and (h) until each resistor has an overall resistance near the resistance specified for that resistor.

Claim 35

A method of forming a plurality of electronically conducting polymer resistors having different electrical resistances on a common substrate surface, the method comprising the steps of: (a) preparing a plurality of formulations comprising a monomer and a salt, wherein the salt consists of Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof, and wherein each of the formulations has a different molar concentration of salt for forming resistors having resistances within a given range; (b) applying a film of a formulation onto the substrate surface; (c) photopolymerizing a portion of the film to form a resistor, wherein the resistor extends between two contact points and has sufficient thickness and width so that the overall electrical resistance between the two contact points is somewhat less than a resistance specified for that resistor; (d) removing the formulation adjacent the resistor; (e) repeating steps (b) through (d) for each of the plurality of formulations; (f) heating the resistors to provide a thermal cure; (g) measuring the overall resistance of the resistor; (h) increasing the overall resistance of the resistor up to a specified resistance by trimming the resistor with a laser; and (i) repeating steps (g) and (h) until each resistor has an overall resistance near the resistance specified for that resistor.

Claim 37

A method of forming an electronically conducting polymer inductor on a nonconducting substrate surface comprising the steps of: (a) preparing a formulation; (b) applying a first film of the formulation onto the substrate surface; (c) photopolymerizing a plurality of lower lines in the film; (d) removing the formulation adjacent the lines; (e) depositing a layer of dielectric material over the lower lines, wherein the layer forms a top surface; (f) forming holes through the layer of dielectric material and into communication with ends of at least two lower lines; (g) applying the formulation to the holes and top surfaces of the dielectric material to form a second film over the top surface; and (h) selectively photopolymerizing the second film to form vertical vias and upper lines, wherein ends of each upper line connect with the vertical vias, and wherein the upper lines, lower lines and vertical vias are electronically conducting and cooperate to form the inductor.

Claim 38

A method of forming an electronically conducting polymer inductor on a nonconducting substrate surface comprising the steps of: (a) preparing a formulation; (b) applying a first film of the formulation onto the substrate surface; (c) photopolymerizing a plurality of lower lines in the film; (d) removing the formulation adjacent the lines; (e) depositing a layer of dielectric material over the lower lines, wherein the layer forms a top surface; (f) forming holes through the layer of dielectric material and into communication with ends of at least two lower lines; (g) applying the formulation to the holes and top surfaces of the dielectric material to form a second film over the top surface; and (h) selectively photopolymerizing the second film to form vertical vias and upper lines, wherein ends of each upper line connect with the vertical vias, and wherein the upper lines, lower lines and vertical vias are electronically conducting and cooperate to form the inductor.

Claim 42

A method of forming a solid state electrolytic capacitor in which a conducting polymer is applied as an electrolyte comprising the steps of: (a) applying a film of a formulation on a dielectric layer; (b) photopolymerizing a portion of the film to form a polymer; (c) removing the formulation adjacent the polymer; (d) depositing a layer of palladium onto the polymer by immersion in a solution consisting of a palladium containing salt; and (e) electrodepositing a layer of a metal conductor to form the capacitor.

Claim 43

A method of forming a solid state electrolytic capacitor in which a conducting polymer is applied as an electrolyte comprising the steps of: (a) applying a film of a formulation on a dielectric layer; (b) photopolymerizing a portion of the film to form a polymer; (c) removing the formulation adjacent the polymer; (d) depositing a layer of palladium onto the polymer by immersion in a solution consisting of a palladium containing salt; and (e) electrodepositing a layer of a metal conductor to form the capacitor.

Claim 47

A method of forming a plurality of passive elements on a common nonconducting substrate surface comprising the steps of: (a) preparing a formulation comprising a monomer and a salt, wherein the salt consists of an electron acceptor consisting of Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) forming an electronically conducting polymer resistor on the surface comprising the steps of: (i) applying a film of the formulation onto the substrate surface; (ii) photopolymerizing a first portion of the film to form a resistor; and (iii) removing the formulation adjacent the resistor; (c) forming a solid state electrolytic capacitor on the surface wherein a conducting polymer is applied as an electrolyte comprising the steps of: (i) applying a film of the formulation on a dielectric layer; (ii) photopolymerizing a second portion of the film to form a polymer; (iii) removing the formulation adjacent the polymer; (iv) depositing a layer of palladium onto the surface of the polymer by immersion in a palladium salt solution; and (v) electrodepositing a layer of a metal conductor; and (d) forming an electronically conducting polymer inductor on the nonconducting substrate surface comprising the steps of: (i) applying a film of the formulation onto the substrate surface; (ii) photopolymerizing a plurality of lower lines in the film; (iii) removing the formulation adjacent the lines; (iv) depositing a layer of dielectric material over the lower lines, wherein the layer forms a top surface; (v) forming holes through the layer of dielectric material and into communication with ends of at least two lower lines; (vi) applying the formulation to the holes and top surface of the dielectric material to form a second film over the top surface; and (vii) selectively photopolymerizing the second film to form vertical vias and upper lines, wherein ends of each upper line connect with the vertical vias, and wherein the upper lines, lower lines and vertical vias are electronically conducting and cooperate to form the inductor.

Claim 48

A method of forming a plurality of passive elements on a common nonconducting substrate surface comprising the steps of: (a) preparing a formulation comprising a monomer and a salt, wherein the salt consists of an electron acceptor consisting of Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) forming an electronically conducting polymer resistor on the surface comprising the steps of: (i) applying a film of the formulation onto the substrate surface; (ii) photopolymerizing a first portion of the film to form a resistor; and (iii) removing the formulation adjacent the resistor; (c) forming a solid state electrolytic capacitor on the surface wherein a conducting polymer is applied as an electrolyte comprising the steps of: (i) applying a film of the formulation on a dielectric layer; (ii) photopolymerizing a second portion of the film to form a polymer; (iii) removing the formulation adjacent the polymer; (iv) depositing a layer of palladium onto the surface of the polymer by immersion in a palladium salt solution; and (v) electrodepositing a layer of a metal conductor; and (d) forming an electronically conducting polymer inductor on the nonconducting substrate surface comprising the steps of: (i) applying a film of the formulation onto the substrate surface; (ii) photopolymerizing a plurality of lower lines in the film; (iii) removing the formulation adjacent the lines; (iv) depositing a layer of dielectric material over the lower lines, wherein the layer forms a top surface; (v) forming holes through the layer of dielectric material and into communication with ends of at least two lower lines; (vi) applying the formulation to the holes and top surface of the dielectric material to form a second film over the top surface; and (vii) selectively photopolymerizing the second film to form vertical vias and upper lines, wherein ends of each upper line connect with the vertical vias, and wherein the upper lines, lower lines and vertical vias are electronically conducting and cooperate to form the inductor.

Claim 49

A method of making a resistor on a substrate surface, comprising the steps of: (a) forming an electronically conducting polymer resistor between two points on the substrate surface; and (b) trimming the polymer with a laser.

Claim 50

A method of making a resistor on a substrate surface, comprising the steps of: (a) forming an electronically conducting polymer resistor between two points on the substrate surface; and (b) trimming the polymer with a laser.

Claim 52

A method for selectively photopolymerizing a film of a photopolymerizable formulation comprising the steps of: (a) directing laser light on the film of the photopolymerizable formulation to form a polymer; (b) rastering the beam over a specified area of the film; and (c) removing the formulation adjacent the polymer.

Claim 53

A method for selectively photopolymerizing a film of a photopolymerizable formulation comprising the steps of: (a) directing laser light on the film of the photopolymerizable formulation to form a polymer; (b) rastering the beam over a specified area of the film; and (c) removing the formulation adjacent the polymer.

Claim 57

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting substrate surface comprising the steps of: (a) applying a film of a formulation comprising pyrrole monomer and a salt onto the substrate surface, the salt consisting essentially of Ag + cations and dopant anions selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 58

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting substrate surface comprising the steps of: (a) applying a film of a formulation comprising pyrrole monomer and a salt onto the substrate surface, the salt consisting essentially of Ag + cations and dopant anions selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 64

A method of forming a resistor comprising the steps of: (a) applying a film of a formulation comprising pyrrole and a silver salt onto a surface; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 65

A method of forming a resistor comprising the steps of: (a) applying a film of a formulation comprising pyrrole and a silver salt onto a surface; (b) photopolymerizing a portion of the film to form the resistor; and (c) removing the formulation adjacent the resistor.

Claim 66

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from the group consisting of NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; and (b) photopolymerizing a portion of the film to form the resistor; (c) increasing the resistance of the resistor by trimming the resistor.

Claim 67

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from the group consisting of NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; and (b) photopolymerizing a portion of the film to form the resistor; (c) increasing the resistance of the resistor by trimming the resistor.

Claim 71

A method of forming an electronically conducting polymer resistor on a surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing the film over a select area of the surface to form the resistor without forming deposits outside the select area; and (c) removing the formulation adjacent the resistor.

Claim 72

A method of forming an electronically conducting polymer resistor on a surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing the film over a select area of the surface to form the resistor without forming deposits outside the select area; and (c) removing the formulation adjacent the resistor.

Claim 73

A method of forming an electronically conducting polymer resistor on a nonsemiconducting surface comprising the steps of: (a) applying a film of a formulation onto the nonsemiconducting surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; and (b) photopolymerizing a portion of the film to form the resistor.

Claim 74

A method of forming an electronically conducting polymer resistor on a nonsemiconducting surface comprising the steps of: (a) applying a film of a formulation onto the nonsemiconducting surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; and (b) photopolymerizing a portion of the film to form the resistor.

Claim 75

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing the film over a portion of the surface to form the resistor without depositing silver on other portions of the surface; and (c) removing the formulation adjacent the resistor.

Claim 76

A method of forming an electronically conducting polymer resistor on a conducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) photopolymerizing the film over a portion of the surface to form the resistor without depositing silver on other portions of the surface; and (c) removing the formulation adjacent the resistor.

Claim 77

A method of forming an electronically conducting polymer resistor on a conducting, semiconducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) polymerizing a portion of the film to form the resistor, wherein the step of polymerizing consists of photopolymerizing; and (c) heating the resistor to provide a post-thermal cure.

Claim 78

A method of forming an electronically conducting polymer resistor on a conducting, semiconducting or nonconducting surface comprising the steps of: (a) applying a film of a formulation onto the surface, wherein the formulation comprises pyrrole, Ag + cations and a dopant anion selected from NO 3 - , NO 2 - , BF 4 - , ClO 4 - , tosylate, or mixtures thereof; (b) polymerizing a portion of the film to form the resistor, wherein the step of polymerizing consists of photopolymerizing; and (c) heating the resistor to provide a post-thermal cure.