US4810333A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electroplating process
Assignee: Shipley Co Inc
•
Filing: 1987-12-14
•
Granted: 1989-03-07
•
Expires: 2007-12-14
Abstract
Abstract A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
Inventors
- 👤 Michael Gulla
- 👤 Donald F. Foust
- 👤 George K. Philipose
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 04:20
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/188; C; C25; C25D; C25D5/00; C25D5/54; C25D5/56; H05K3/40; H05K3/42; H05K3/423; H05K3/424; H05K2203/00; H05K2203/07; H05K2203/0703; H05K2203/0716; H05K3/425; H05K3/427; Y; Y10; Y10S; Y10S205/00; Y10S205/92
Claims Analysis
Total Claims: 65
Claim 1
Independent Claim
68 words
A method for metal plating the surface of a nonconductor, said method comprising the step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal, one of said electrodes comprising said nonconductor to be plated, said nonconductor having a surface comprising areas of a metal sulfide conversion coating capable of direct electrolytic deposition of metal adjacent to and in contact with conductive areas.
Claim 2
Independent Claim
68 words
A method for metal plating the surface of a nonconductor, said method comprising the step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal, one of said electrodes comprising said nonconductor to be plated, said nonconductor having a surface comprising areas of a metal sulfide conversion coating capable of direct electrolytic deposition of metal adjacent to and in contact with conductive areas.
Claim 3
Dependent Claim
12 words
The method of claim 1 where the metal sulfide is a semiconductor.
Claim 4
Dependent Claim
18 words
The method of claim 1 where the conversion coating is a metal sulfide chemisorbed onto to the nonconductor.
Claim 5
Dependent Claim
30 words
The method of claim 1 where the metal sulfide is a sulfide of a Group I A, I B or Group VIII metal of the Periodic Chart of the Elements.
Claim 6
Dependent Claim
27 words
The method of claim 4 where the metal sulfide conversion coating is a sulfide of a member selected from the group of iron, cobalt, nickel and copper.
Claim 7
Dependent Claim
14 words
The method of claim 4 where the metal sulfide conversion coating is copper sulfide.
Claim 8
Dependent Claim
14 words
The method of claim 4 where the metal sulfide conversion coating is nickel sulfide.
Claim 9
Dependent Claim
23 words
The method of claim 1 where the electrolyte is a solution containing a dissolved metal selected from the group of copper and nickel.
Claim 10
Dependent Claim
11 words
The process of claim 8 where the dissolved metal is copper.
Claim 11
Dependent Claim
47 words
The method of claim 9 where the electrode comprising the nonconductor is a printed circuit board base material having copper cladding and the metal sulfide conversion coating is disposed over the surface of walls defining holes passing between the surfaces of said printed circuit board substrate material.
Claim 12
Independent Claim
65 words
A method for metal plating the surface of an article formed from an organic plastic, said method comprising the step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal, one of said electrodes comprising said article to be plated, said article having a surface comprising areas of a semiconductor conversion coating adjacent to and in contact with conductive areas.
Claim 13
Independent Claim
65 words
A method for metal plating the surface of an article formed from an organic plastic, said method comprising the step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal, one of said electrodes comprising said article to be plated, said article having a surface comprising areas of a semiconductor conversion coating adjacent to and in contact with conductive areas.
Claim 14
Dependent Claim
43 words
The method of claim 11 where the conversion coating is a metal sulfide chemically bonded to the nonconductor and comprises a metal sulfide of a metal selected from Group I A, I B or Group VIII of the Periodic Chart of the Elements.
Claim 15
Dependent Claim
24 words
The method of claim 11 where the conversion coating is a sulfide of a member selected from the group of cobalt, nickel and copper.
Claim 16
Dependent Claim
13 words
The method of claim 11 where the metal sulfide is a nickel sulfide.
Claim 17
Dependent Claim
15 words
The process of claim 11 where the article is a printed circuit board base material.
Claim 18
Independent Claim
78 words
A method for formation of a metal sulfide conversion coating over the surface of a nonconductor, said method comprising the steps of treating the surface of said nonconductive surface with an alkaline solution of a permanganate, treating the surface of the nonconductor with a solution containing a dissolved sulfide and treating said nonconductive surface with a solution of a dissolved metal ion capable of reacting with the so treated surface of the nonconductor to form an insoluble sulfide.
Claim 19
Independent Claim
78 words
A method for formation of a metal sulfide conversion coating over the surface of a nonconductor, said method comprising the steps of treating the surface of said nonconductive surface with an alkaline solution of a permanganate, treating the surface of the nonconductor with a solution containing a dissolved sulfide and treating said nonconductive surface with a solution of a dissolved metal ion capable of reacting with the so treated surface of the nonconductor to form an insoluble sulfide.
Claim 20
Independent Claim
105 words
A method for formation of a metal sulfide conversion coating over the surface of a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an alkaline solution of a permanganate, b. treating the surface of the nonconductor with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, and c. treating said nonconductor with a solution of a dissolved Group I B or Group VIII B metal ion capable of reacting with the manganese sulfide to form an insoluble sulfide of said Group I B or Group VIII B metal.
Claim 21
Independent Claim
105 words
A method for formation of a metal sulfide conversion coating over the surface of a nonconductor, said method comprising the steps of: a. treating the surface of said nonconductor with an alkaline solution of a permanganate, b. treating the surface of the nonconductor with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, and c. treating said nonconductor with a solution of a dissolved Group I B or Group VIII B metal ion capable of reacting with the manganese sulfide to form an insoluble sulfide of said Group I B or Group VIII B metal.
Claim 22
Dependent Claim
12 words
The method of claim 17 where the nonconductor is an organic polymer.
Claim 23
Dependent Claim
17 words
The method of claim 18 where the alkaline permanganate solution has a pH in excess of 10.
Claim 24
Dependent Claim
10 words
The method of claim 19 where the pH exceeds 13.
Claim 25
Dependent Claim
26 words
The method of claim 19 where the concentration of the permanganate in the alkaline permanganate solution varies between 10 and 100 grams per liter of solution.
Claim 26
Dependent Claim
15 words
The method of claim 19 where the permanganate solution is a solution of potassium permanganate.
Claim 27
Dependent Claim
24 words
The method of claim 18 where the solution used to form the manganese sulfide is a solution of an aqueous soluble metal sulfide salt.
Claim 28
Dependent Claim
38 words
The method of claim 18 where the solution used to form the manganese sulfide is a solution of an alkali or alkaline earth metal sulfide in a concentration of from 1 to 50 grams per liter of solution.
Claim 29
Dependent Claim
25 words
The method of claim 18 where the solution used to form the manganese sulfide is a solution of an alkali or alkaline earth metal sulfide.
Claim 30
Dependent Claim
34 words
The method of claim 18 where the solution used to form the sulfide is a solution of a Group I A, I B or Group VIII metal of the Periodic Chart of the Elements.
Claim 31
Dependent Claim
24 words
The method of claim 18 where the solution used to form the sulfide is a solution of an iron, cobalt, nickel or copper salt.
Claim 32
Dependent Claim
22 words
The method of claim 18 where the solution used to form the sulfide is a solution that forms a semiconductor metal sulfide.
Claim 33
Independent Claim
134 words
A method for electroplating an article of manufacture comprising an electrically nonconductive body portion having a surface comprising metallic areas and non metallic polymeric areas adjacent to and in contact with each other, said method comprising the steps of: a. treating the surface of said article with an alkaline solution of a permanganate, b. treating the surface of the article with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, c. treating said article with a solution of a dissolved metal capable of reacting with the manganese sulfide to form an insoluble semiconductor sulfide of said metal; and d. metal plating the surface of the article by passing a current between said article and an electrode immersed in an electrolyte containing dissolved plating metal.
Claim 34
Independent Claim
134 words
A method for electroplating an article of manufacture comprising an electrically nonconductive body portion having a surface comprising metallic areas and non metallic polymeric areas adjacent to and in contact with each other, said method comprising the steps of: a. treating the surface of said article with an alkaline solution of a permanganate, b. treating the surface of the article with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, c. treating said article with a solution of a dissolved metal capable of reacting with the manganese sulfide to form an insoluble semiconductor sulfide of said metal; and d. metal plating the surface of the article by passing a current between said article and an electrode immersed in an electrolyte containing dissolved plating metal.
Claim 35
Dependent Claim
17 words
The method of claim 29 where the alkaline permanganate solution has a pH in excess of 10.
Claim 36
Dependent Claim
15 words
The method of claim 29 where the permanganate solution is a solution of potassium permanganate.
Claim 37
Dependent Claim
24 words
The method of claim 28 where the solution used to form the manganese sulfide is a solution of an aqueous soluble metal sulfide salt.
Claim 38
Dependent Claim
38 words
The method of claim 28 where the solution used to form the manganese sulfide is a solution of an alkali or alkaline earth metal sulfide in a concentration of from 1 to 15 grams per liter of solution.
Claim 39
Dependent Claim
34 words
The method of claim 28 where the solution used to form the sulfide is a solution of a Group I A, I B or Group VIII metal of the Periodic Chart of the Elements.
Claim 40
Dependent Claim
25 words
The method of claim 28 where the solution used to form the metal sulfide is a solution of an iron, cobalt, nickel or copper salt.
Claim 41
Dependent Claim
20 words
The method of claim 28 where the solution used to form the sulfide is a solution of a copper salt.
Claim 42
Dependent Claim
12 words
The method of claim 28 where the article is plated with copper.
Claim 43
Independent Claim
157 words
A method for manufacture of a printed circuit board starting from a printed circuit board base material comprising a copper clad phenolic or epoxy sheet having holes passing through the sheet at selected locations, said method comprising the steps of: a. treating the surface of said printed circuit board base material with an alkaline solution of a permanganate, b. treating the surface of said printed circuit board base material with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, c. treating the surface of said printed circuit board base material with a solution of a dissolved metal ion capable of reacting with the manganese sulfide to form an insoluble semiconductor sulfide of said metal; and d. metal plating the surface of said printed circuit board base material by passing a current between said circuit board base material and an electrode immersed in an electrolyte containing dissolved copper.
Claim 44
Independent Claim
157 words
A method for manufacture of a printed circuit board starting from a printed circuit board base material comprising a copper clad phenolic or epoxy sheet having holes passing through the sheet at selected locations, said method comprising the steps of: a. treating the surface of said printed circuit board base material with an alkaline solution of a permanganate, b. treating the surface of said printed circuit board base material with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, c. treating the surface of said printed circuit board base material with a solution of a dissolved metal ion capable of reacting with the manganese sulfide to form an insoluble semiconductor sulfide of said metal; and d. metal plating the surface of said printed circuit board base material by passing a current between said circuit board base material and an electrode immersed in an electrolyte containing dissolved copper.
Claim 45
Dependent Claim
17 words
The method of claim 38 where the alkaline permanganate solution has a pH in excess of 10.
Claim 46
Dependent Claim
10 words
The method of claim 39 where the pH exceeds 13.
Claim 47
Dependent Claim
15 words
The method of claim 39 where the permanganate solution is a solution of potassium permanganate.
Claim 48
Dependent Claim
24 words
The method of claim 38 where the solution used to form the manganese sulfide is a solution of an aqueous soluble metal sulfide salt.
Claim 49
Dependent Claim
38 words
The method of claim 38 where the solution used to form the manganese sulfide is a solution of an alkali or alkaline earth metal sulfide in a concentration of from 1 to 15 grams per liter of solution.
Claim 50
Dependent Claim
34 words
The method of claim 38 where the solution used to form the sulfide is a solution of a Group I A, I B or Group VIII metal of the Periodic Chart of the Elements.
Claim 51
Dependent Claim
24 words
The method of claim 38 where the solution used to form the sulfide is a solution of an iron, cobalt, nickel or copper salt.
Claim 52
Dependent Claim
20 words
The method of claim 38 where the solution used to form the sulfide is a solution of a copper salt.
Claim 53
Dependent Claim
12 words
The method of claim 38 where the article is plated with copper.
Claim 54
Independent Claim
189 words
A method for manufacture of a printed circuit board starting from a printed circuit board base material comprising a copper clad phenolic or epoxy sheet having holes passing through the sheet at selected locations, said method comprising the steps of: a. treating the surface of said printed circuit board base material with an alkaline solution of a permanganate, b. treating the surface of said printed circuit board base material with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, c. treating the surface of said printed circuit board base material with a solution of a dissolved Group I A, I B or Group VIII metal ion capable of reacting with the manganese sulfide to form a semiconductor sulfide of said metal; d. applying a photoresist over the surface of the copper cladding and exposing and developing said photoresist to form a pattern over said copper cladding; and e. metal plating the surface of said printed circuit board base material by passing a current between said circuit board base material and an electrode immersed in an electrolyte containing dissolved copper.
Claim 55
Independent Claim
189 words
A method for manufacture of a printed circuit board starting from a printed circuit board base material comprising a copper clad phenolic or epoxy sheet having holes passing through the sheet at selected locations, said method comprising the steps of: a. treating the surface of said printed circuit board base material with an alkaline solution of a permanganate, b. treating the surface of said printed circuit board base material with a solution containing a dissolved sulfide capable of reacting with the permanganate treated surface to form a manganese sulfide, c. treating the surface of said printed circuit board base material with a solution of a dissolved Group I A, I B or Group VIII metal ion capable of reacting with the manganese sulfide to form a semiconductor sulfide of said metal; d. applying a photoresist over the surface of the copper cladding and exposing and developing said photoresist to form a pattern over said copper cladding; and e. metal plating the surface of said printed circuit board base material by passing a current between said circuit board base material and an electrode immersed in an electrolyte containing dissolved copper.
Claim 56
Dependent Claim
17 words
The method of claim 48 where the alkaline permanganate solution has a pH in excess of 10.
Claim 57
Dependent Claim
21 words
The method of claim 39 where the alkaline permanganate solution is a potassium permanganate solution having a pH that exceeds 13.
Claim 58
Dependent Claim
24 words
The method of claim 48 where the solution used to form the manganese sulfide is a solution of an aqueous soluble metal sulfide salt.
Claim 59
Dependent Claim
38 words
The method of claim 48 where the solution used to form the manganese sulfide is a solution of an alkali or alkaline earth metal sulfide in a concentration of from 1 to 100 grams per liter of solution.
Claim 60
Dependent Claim
35 words
The method of claim 48 where the solution used to form the sulfide is a solution of a Group I A, I B or Group VIII B metal of the Periodic Chart of the Elements.
Claim 61
Dependent Claim
24 words
The method of claim 48 where the solution used to form the sulfide is a solution of an iron, cobalt, nickel or copper salt.
Claim 62
Dependent Claim
20 words
The method of claim 48 where the solution used to form the sulfide is a solution of a copper salt.
Claim 63
Dependent Claim
12 words
The method of claim 48 where the article is plated with copper.
Claim 64
Dependent Claim
16 words
The method of claim 48 including a step of coating electroplated copper with an etch resist.
Claim 65
Dependent Claim
30 words
The method of claim 57 including the steps of stripping the photoresist from the copper and etching said circuit board to remove copper cladding exposed by removal of said photoresist.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-03-06 | 1992-09-05 | 1993-03-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-03-06 | 1996-09-05 | 1997-03-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-03-06 | 2000-09-05 | 2001-03-07 | $7700.00 | Window Closed / Lapsed |