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US5854500A Expired / Lapsed US ⏱️ 0.0 years remaining

DRAM cell array with dynamic gain memory cells

Assignee: Polaris Innovations Ltd
•
Filing: 1996-09-26
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Granted: 1998-12-29
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Expires: 2016-09-26
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Abstract

Abstract A dynamic gain memory cell of a DRAM cell array includes a planar MOS transistor as a selection transistor and a vertical MOS transistor as a memory transistor, which are connected to one another via a common source/drain region. The memory transistor has a gate electrode of doped silicon, which is disposed along at least one side of a trench. In the trench, an oppositely doped silicon structure is provided, which with the gate electrode of the memory transistor forms a diode, which is connected to the common source/drain region via a contact.

Inventors

  • 👤 Wolfgang Krautschneider

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 14:16
CPC Classifications
H; H10; H10B; H10B12/00; H10D; H10D84/00; H10D84/80; H10D84/811

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 187 words
A DRAM cell array, comprising: a plurality of dynamic gain memory cells, integrated in a substrate; a selection transistor included in each memory cell formed as a planar MOS transistor, and a memory transistor formed as a vertical MOS transistor; a common source/drain region connecting the selection transistor and the memory transistor to one another; a source/drain region of the memory transistor being connected to a supply voltage line; a source/drain region of the selection transistor being connected to a bit line; a gate electrode of the selection transistor being connected to a word line; a gate electrode of doped silicon in the memory transistor disposed along at least one side of a longitudinal trench; and a silicon structure being doped with the opposite conductivity type of said gate electrode and being disposed in the trench, said silicon structure together with said gate electrode of the memory transistor forming a diode and being connected to said common source/drain region via a contact, and wherein said gate electrode of the memory transistor and said silicon structure are each formed as spacers, which line the sides of said trench.
Claim 2
Dependent Claim 187 words
A DRAM cell array, comprising: a plurality of dynamic gain memory cells, integrated in a substrate; a selection transistor included in each memory cell formed as a planar MOS transistor, and a memory transistor formed as a vertical MOS transistor; a common source/drain region connecting the selection transistor and the memory transistor to one another; a source/drain region of the memory transistor being connected to a supply voltage line; a source/drain region of the selection transistor being connected to a bit line; a gate electrode of the selection transistor being connected to a word line; a gate electrode of doped silicon in the memory transistor disposed along at least one side of a longitudinal trench; and a silicon structure being doped with the opposite conductivity type of said gate electrode and being disposed in the trench, said silicon structure together with said gate electrode of the memory transistor forming a diode and being connected to said common source/drain region via a contact, and wherein said gate electrode of the memory transistor and said silicon structure are each formed as spacers, which line the sides of said trench.
Claim 3
Dependent Claim 25 words
The DRAM cell array according to claim 1, having a dielectric layer disposed between said gate electrode of the memory transistor and said silicon structure.
Claim 4
Dependent Claim 98 words
The DRAM cell array according to claim 1, having a plurality of mutually parallel longitudinal trenches disposed in the substrate; wherein said memory cells are arranged in a matrix such that each memory transistor of adjacent memory cells border on opposite sides of the longitudinal trenches, each memory transistor of adjacent memory cells being connected to one another via a common source/drain region, said source/drain region being connected to a common bit line; and a plurality of insulation trenches disposed perpendicular to the longitudinal trenches for insulating adjacent memory cells, disposed along a longitudinal trench, from one another.
Claim 5
Dependent Claim 42 words
The DRAM cell array according to claim 1, including a contact disposed between said silicon structure and said source/drain region common to said selection transistor and said memory transistor, said contact formed as a contact hole filled with a high- melting-point metal.
Claim 6
Dependent Claim 38 words
The DRAM cell array according to claim 1, including a contact disposed between said silicon structure and said source/drain region common to said selection transistor and said memory transistor, said contact including a structure formed of metal silicide.

References Cited (Backward Citations)

US5113235A Cited
WO1992001287A1 Cited
US5327374A Cited
EP0537203B1 Cited
US5559357A Cited
US5308783A Cited
DE4417150A1 Cited
US5661322A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-12-28 2002-06-29 2002-12-29 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-12-28 2006-06-29 2006-12-29 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-12-28 2010-06-29 2010-12-29 $7700.00 Window Closed / Lapsed

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