Patent US5847455A successfully refreshed from Google Patents.
US5847455A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Molded leadframe ball grid array
Assignee: Callahan Cellular LLC
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Filing: 1995-11-07
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Granted: 1998-12-08
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Expires: 2015-11-07
Abstract
Abstract A ball grid array (BGA) package configuration for packaging an integrated-circuit die includes a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located die-attach pad. The bonding fingers are disposed peripherally surrounding the die-attach pad. An integrated-circuit die is mounted on the die-attach pad. Bonding fingers are interconnected between the bonding pads on the integrated-circuit die and the plurality of bonding fingers. A plastic material is molded over the top of the lead frame and the die while still providing an exposed bottom surface of the bonding fingers on the lead frame. A solder mask is disposed over the bottom of the lead frame so as to form selective solder areas. Solder balls are attached to the selective solder areas.
Inventors
- 👤 Kamran Manteghi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:19
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
128 words
A ball grid array package configuration having no substrate for packaging an integrated-circuit die comprising: a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located die-attach pad, said bonding fingers being disposed peripherally surrounding said die-attach pad; an integrated-circuit die being directly mounted on said die-attach pad; bonding wires interconnected between bonding pads on said integrated-circuit die and said plurality of bonding fingers; a plastic material being encapsulated over the top of said lead frame and said die while still providing an exposed bottom surface of said bonding fingers on said lead frame; a solder mask layer being disposed over the exposed bottom surface of said lead frame so as to form selective solderable areas; and solder balls being attached to said selective solderable areas.
Claim 2
Dependent Claim
128 words
A ball grid array package configuration having no substrate for packaging an integrated-circuit die comprising: a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located die-attach pad, said bonding fingers being disposed peripherally surrounding said die-attach pad; an integrated-circuit die being directly mounted on said die-attach pad; bonding wires interconnected between bonding pads on said integrated-circuit die and said plurality of bonding fingers; a plastic material being encapsulated over the top of said lead frame and said die while still providing an exposed bottom surface of said bonding fingers on said lead frame; a solder mask layer being disposed over the exposed bottom surface of said lead frame so as to form selective solderable areas; and solder balls being attached to said selective solderable areas.
Claim 3
Dependent Claim
27 words
A ball grid array package configuration as claimed in claim 1, wherein said lead frame is stamped or chemically etched from a sheet of lead frame material.
Claim 4
Dependent Claim
19 words
A ball grid array package configuration as claimed in claim 2, wherein said lead frame material is a metal.
Claim 5
Dependent Claim
28 words
A ball grid array package configuration as claimed in claim 3, wherein said metal is selected from the group consisting of copper, iron, nickel, aluminum, and alloys thereof.
Claim 6
Dependent Claim
22 words
A ball grid array package configuration as claimed in claim 4, wherein said bonding fingers are plated with a highly conductive metal.
Claim 7
Dependent Claim
26 words
A ball grid array package configuration as claimed in claim 5, wherein said highly conductive metal is selected from the group consisting of silver and gold.
Claim 8
Dependent Claim
19 words
A ball grid array package configuration as claimed in claim 1, wherein said plastic material is an epoxy encapsulant.
Claim 9
Dependent Claim
22 words
A ball grid array package configuration as claimed in claim 1, wherein said solder mask is applied by a screen printing process.
Claim 10
Dependent Claim
22 words
A ball grid array package configuration as claimed in claim 1, wherein said solder balls are comprised of lead-tin derivative solder bumps.
Claim 11
Dependent Claim
21 words
A ball grid array package configuration as claimed in claim 9, wherein said solder bumps are comprised of Sn and Pb.
References Cited (Backward Citations)
US5341980A
Cited
US5147084A
Cited
US5137845A
Cited
US5172214A
Cited
US5433822A
Cited
US5337219A
Cited
US5133495A
Cited
US5261155A
Cited
US5276964A
Cited
US5608265A
Cited
US5668405A
Cited
US5663594A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-12-07 | 2002-06-08 | 2002-12-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-12-07 | 2006-06-08 | 2006-12-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-12-07 | 2010-06-08 | 2010-12-08 | $7700.00 | Window Closed / Lapsed |