Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
218 words
A method for making a superconducting field-effect device with a grain boundary channel, the method comprising the steps of: preparing an oxide crystal substrate; depositing a first superconducting thin film on a main surface of the oxide crystal substrate; patterning the first superconducting thin film so as to form a patterned super conducting thin film having an opening; depositing a template layer thereon; selectively etching back the template layer to form an exposed portion of the oxide crystal substrate where the template layer is removed and a grown portion where the template layer is deposited; growing a second superconducting thin film to form a grain boundary between the exposed portion and the patterned template layer in accordance with orientation thereof; depositing an insulating layer on the second superconducting thin film so as to protect the second superconducting thin film from degrading in property in the air; selectively etching back the insulating layer to form a patterned insulating layer having a deposited portion formed over the opening; forming a gate insulating layer on the patterned insulating layer; and coating metal electrodes thereon, source/drain electrodes being formed respectively on the second superconducting thin film where the insulating layer is etched, and a gate electrode being formed on the deposited portion of the gate insulating layer directly above the grain boundary.
Claim 2
Independent Claim
218 words
A method for making a superconducting field-effect device with a grain boundary channel, the method comprising the steps of: preparing an oxide crystal substrate; depositing a first superconducting thin film on a main surface of the oxide crystal substrate; patterning the first superconducting thin film so as to form a patterned super conducting thin film having an opening; depositing a template layer thereon; selectively etching back the template layer to form an exposed portion of the oxide crystal substrate where the template layer is removed and a grown portion where the template layer is deposited; growing a second superconducting thin film to form a grain boundary between the exposed portion and the patterned template layer in accordance with orientation thereof; depositing an insulating layer on the second superconducting thin film so as to protect the second superconducting thin film from degrading in property in the air; selectively etching back the insulating layer to form a patterned insulating layer having a deposited portion formed over the opening; forming a gate insulating layer on the patterned insulating layer; and coating metal electrodes thereon, source/drain electrodes being formed respectively on the second superconducting thin film where the insulating layer is etched, and a gate electrode being formed on the deposited portion of the gate insulating layer directly above the grain boundary.
Claim 3
Dependent Claim
24 words
The method as defined in claim 1, wherein the oxide crystal substrate is composed of one of materials of an oxide class of superconductors.
Claim 4
Dependent Claim
31 words
The method as defined in claim 2, wherein the oxide class of superconductors comprises a (100)-oriented insulating substrate of SrTiO 3 , or a (100)-orientation insulating substrate of LaSrGaO 4 .
Claim 5
Dependent Claim
52 words
The method as defined in claim 1, wherein the step of depositing the first superconducting thin film is carried out at a substrate temperature of from 750° C. to 800° C., and under oxygen pressure of about 100 mTorr so as to form the template layer having a thickness of 100 nm.
Claim 6
Dependent Claim
21 words
The method as defined in claim 1, wherein the template layer is composed of PrBa 2 Cu 3 O 7-x (0≦x≦7).
Claim 7
Dependent Claim
50 words
The method as defined in claim 1, wherein the step of depositing the template layer is carried out at a substrate temperature of from 600° C. to 650° C., and under oxygen pressure of about 100 mTorr so as to form the template layer having a thickness of 200 nm.
Claim 8
Dependent Claim
54 words
The method as defined in claim 1, wherein the step of growing the second superconducting thin film is carried out at a substrate temperature of from 750° C. to 800° C., and under oxygen pressure of about 100 mTorr so as to form the second superconducting thin film having a thickness of 100 nm.
Claim 9
Dependent Claim
69 words
The method as defined in claim 1, wherein the second superconducting thin film has a first portion in which a superconducting material is vertically oriented in c-axis on the exposed portion of the template layer, a second portion in which the high-temperature superconducting material is horizontally oriented in a c-axis on the grown portion of the template layer, and a grain boundary formed between the first and second portions.
Claim 10
Dependent Claim
67 words
The method as defined in claim 1, wherein the step of growing the second superconducting thin film comprises depositing a superconducting material having a c-axis vertical orientation on the exposed portion of the template layer, and depositing a superconducting material having a c-axis horizontal orientation on the grown portion of the template layer, thereby enabling the grain boundary to be formed between the materials having vertical-horizontal orientation.
Claim 11
Dependent Claim
23 words
The method as defined in claim 1, wherein the second superconducting thin film is composed of YBa 2 Cu 3 O 7-x (0≦x≦7).
Claim 12
Dependent Claim
50 words
The method as defined in claim 1, wherein the step of depositing the insulating layer is carried out at a substrate temperature of from 650° C. to 700° C., and under oxygen pressure of about 100 mTorr so as to form the insulating layer having a thickness of 10 nm.
Claim 13
Dependent Claim
17 words
The method as defined in claim 11, wherein the insulating layer is composed of SrTiO 3 .
Claim 14
Dependent Claim
18 words
The method as defined in claim 11, wherein the gate insulating layer is composed of SrTiO 3 .
Claim 15
Dependent Claim
52 words
The method as defined in claim 1, wherein the step of depositing the gate insulating layer is carried out at a substrate temperature of from 650° C. to 700° C., and under oxygen pressure of about 100 mTorr so as to form the gate insulating layer having a thickness of 100 nm.
Claim 16
Dependent Claim
26 words
The method as defined in claim 1, wherein each of the metal electrodes has a thickness of 100 nm and is composed of Ag or Au.