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US5834793A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor devices

Assignee: Toshiba Corp
•
Filing: 1996-07-23
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Granted: 1998-11-10
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Expires: 2016-07-23
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Abstract

Abstract A semiconductor device has a semiconductor substrate, a source and a drain region, each formed at the surface of said semiconductor substrate, and each having a potential barrier with respect to the semiconductor substrate. A gate electrode is formed on the semiconductor substrate and positioned between the source and drain regions. The gate electrode controls the height of discrete energy levels of carriers of said semiconductor substrate, and provides a conduction state and a non-conduction state depending upon the existence or non-existence of resonant tunneling current flow.

Inventors

  • 👤 Tadashi Shibata

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 02:02
CPC Classifications
H; H10; H10D; H10D62/00; H10D62/10; H10D62/13; H10D62/149; H10D62/151; B; B82; B82Y; B82Y10/00; H10D30/00; H10D30/01; H10D30/021; H10D30/027; H10D30/0277; H10D30/031; H10D30/0321; H10D30/0323; H10D30/0327; H10D30/0411; H10D48/00; H10D48/01; H10D62/01; H10D62/021; H10D62/165; H10D64/00; H10D64/20; H10D64/23; H10D64/251; H10D64/258; H10D64/259; H10D64/60; H10D64/64; H10D64/647

Claims Analysis

Total Claims: 24
Claim 1
Independent Claim 195 words
A semiconductor device, comprising: a semiconductor substrate; a source region and drain region, each formed at the surface of said semiconductor substrate, said source and drain regions each having a potential barrier with respect to said semiconductor substrate; and a gate electrode formed on said semiconductor substrate positioned between said source and drain regions, a region between said source and drain regions having a sufficiently small channel length so as to permit a resonant tunneling current flow therethrough, said gate electrode controlling the height of discrete energy levels of carriers of said semiconductor substrate, wherein a conduction state and a non-conduction state of said device depends on the existence or non-existence of the resonant tunneling current flow between said source and drain regions as determined by said discrete energy levels, wherein said potential barriers are provided by tunneling insulating films formed between said source and drain regions and portions of said semiconductor substrate positioned between said source and drain regions, wherein the thickness of each of said tunneling insulating films is not larger than 40 Å and wherein said tunneling insulating films are selected from silicon oxide films, silicon nitride films and Aluminum oxide films.
Claim 2
Dependent Claim 195 words
A semiconductor device, comprising: a semiconductor substrate; a source region and drain region, each formed at the surface of said semiconductor substrate, said source and drain regions each having a potential barrier with respect to said semiconductor substrate; and a gate electrode formed on said semiconductor substrate positioned between said source and drain regions, a region between said source and drain regions having a sufficiently small channel length so as to permit a resonant tunneling current flow therethrough, said gate electrode controlling the height of discrete energy levels of carriers of said semiconductor substrate, wherein a conduction state and a non-conduction state of said device depends on the existence or non-existence of the resonant tunneling current flow between said source and drain regions as determined by said discrete energy levels, wherein said potential barriers are provided by tunneling insulating films formed between said source and drain regions and portions of said semiconductor substrate positioned between said source and drain regions, wherein the thickness of each of said tunneling insulating films is not larger than 40 Å and wherein said tunneling insulating films are selected from silicon oxide films, silicon nitride films and Aluminum oxide films.
Claim 3
Dependent Claim 23 words
A semiconductor device according to claim 1, wherein a voltage applied to said drain region is larger than that of said source region.
Claim 4
Dependent Claim 17 words
A semiconductor device according to claim 1, wherein the channel length is not larger than 0.1 μm.
Claim 5
Dependent Claim 18 words
A semiconductor device according to claim 1, further comprising a gate insulating film formed beneath said gate electrode.
Claim 6
Dependent Claim 23 words
A semiconductor device according to claim 1, wherein said tunneling insulating films extend only on side portions of said source and drain regions.
Claim 7
Dependent Claim 16 words
A semiconductor device according to claim 1, wherein said semiconductor substrate is a p-type Si substrate.
Claim 8
Dependent Claim 20 words
A semiconductor device according to claim 1, wherein said source and drain regions comprise n + -type poly Si regions.
Claim 9
Dependent Claim 30 words
A semiconductor device according to claim 7, wherein impurities of said n + -type poly Si regions are diffused into said semiconductor substrate, providing PN junctions in said semiconductor substrate.
Claim 10
Dependent Claim 24 words
A semiconductor device according to claim 1, further comprising a source electrode and a drain electrode electrically connected to said source and drain regions.
Claim 11
Dependent Claim 56 words
A semiconductor device according to claim 1, further comprising a resistor having a first and second terminal, said first terminal being connected to said drain region and said second terminal being connected to a voltage source, said gate electrode being supplied with an input signal, and said first terminal of said resistor providing an output signal.
Claim 12
Dependent Claim 32 words
A semiconductor device according to claim 1, wherein said tunneling insulating films extend from the surface of said semiconductor substrate to a depth deeper than that of said source and drain regions.
Claim 13
Dependent Claim 25 words
A semiconductor device according to claim 1, wherein said tunneling insulating films surround the side walls and bottom surface of said source and drain regions.
Claim 14
Dependent Claim 33 words
A semiconductor device according to claim 1, wherein said tunneling insulating films are formed on the surface of said semiconductor substrate, and said source and drain regions are formed on said insulating films.
Claim 15
Dependent Claim 25 words
A semiconductor device according to claim 13, wherein said source and drain regions contact said semiconductor substrate and form PN junctions with said semiconductor substrate.
Claim 16
Dependent Claim 29 words
A semiconductor device according to claim 13, further comprising thick insulating films, each formed on said substrate wherein said source and drain regions extend over said thick insulating films.
Claim 17
Dependent Claim 18 words
A semiconductor device according to claim 1, wherein said source and drain regions are made from conductive films.
Claim 18
Dependent Claim 26 words
A semiconductor device according to claim 16, further comprising: metal films formed on said source and drain regions; and Al electrodes formed on said metal electrodes.
Claim 19
Dependent Claim 31 words
A semiconductor device according to claim 16, further comprising an insulating film covering said gate electrode wherein said source and drain regions are made from conductive films adjacent said insulating films.
Claim 20
Dependent Claim 19 words
A semiconductor device according to claim 16, wherein said conductive films are selected from metal silicide or other metals.
Claim 21
Dependent Claim 19 words
A semiconductor device according to claim 1, further comprising an insulating base on which said semiconductor substrate is formed.
Claim 22
Dependent Claim 27 words
A semiconductor device according to claim 1, wherein said gate electrode comprises a floating gate, and a pair of control gate electrodes capacitance-coupled with said floating gate.
Claim 23
Dependent Claim 68 words
A semiconductor device according to claim 21, further comprising a resistor, one side of said resistor being connected to said drain region and the other side being connected to a voltage source having a higher voltage than that applied to said source region, said control gate electrodes having input signals independently applied thereto, and the connected point of said resistor and said drain region providing an output signal.
Claim 24
Dependent Claim 49 words
A semiconductor device according to claim 1, wherein said gate electrode comprises a floating gate and a control gate electrode capacitance-coupled with said floating gate, the capacitance between said control gate electrode and said floating gate being smaller than that between said floating gate electrode and said semiconductor substrate.

References Cited (Backward Citations)

US4096509A Cited
US4053917A Cited
US4503519A Cited
JPS593381A Cited
US4665414A Cited
JPS6079776A Cited
US4675711A Cited
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3.5 Years (Year 4) 2001-11-09 2002-05-11 2002-11-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-11-09 2006-05-11 2006-11-10 $3760.00 Window Closed / Lapsed
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