Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
152 words
An apparatus for protecting a semiconductor device from excessive charge, the device including an interface pad selected from the group including an input pad, an output pad, and an input/output pad, comprising: an SCR circuit configured to transfer charge from an electrostatic discharge (ESD) bus to a negative bus of a power supply; a field effect transistor (FET) coupled to said SCR circuit; a first impedance element connected between the ESD bus and a common node; a second impedance element connected between the common node and said SCR circuit; and a first diode for coupling said interface pad to said ESD bus, said first diode having an anode and a cathode, wherein said interface pad is connected to said anode; said FET being further coupled to said common node and configured to activate transfer of charge by said SCR circuit when a voltage on the ESD bus reaches a predetermined threshold level.
Claim 2
Independent Claim
152 words
An apparatus for protecting a semiconductor device from excessive charge, the device including an interface pad selected from the group including an input pad, an output pad, and an input/output pad, comprising: an SCR circuit configured to transfer charge from an electrostatic discharge (ESD) bus to a negative bus of a power supply; a field effect transistor (FET) coupled to said SCR circuit; a first impedance element connected between the ESD bus and a common node; a second impedance element connected between the common node and said SCR circuit; and a first diode for coupling said interface pad to said ESD bus, said first diode having an anode and a cathode, wherein said interface pad is connected to said anode; said FET being further coupled to said common node and configured to activate transfer of charge by said SCR circuit when a voltage on the ESD bus reaches a predetermined threshold level.
Claim 3
Dependent Claim
18 words
The apparatus of claim 1 wherein said first impedance element and said second impedance element comprise semiconductor material.
Claim 4
Dependent Claim
22 words
The apparatus of claim 2 wherein said semiconductor material comprises n-type conductivity semiconductor material which forms an N-well structure in said apparatus.
Claim 5
Dependent Claim
28 words
The apparatus of claim 1 wherein the device further includes at least one further interface pad which is coupled through a further first diode to said ESD bus.
Claim 6
Dependent Claim
27 words
The apparatus of claim 1 further including a second diode disposed between said negative power supply bus (Vss) and said interface pad for transferring negative ESD charge.
Claim 7
Dependent Claim
74 words
The apparatus of claim 1 wherein said first impedance element includes a first resistive element and said second impedance element includes a second resistive element connected in series with said first resistive element at a common node, and wherein said FET includes a drain terminal, a source terminal, and a gate terminal, said source terminal and said gate terminal being connected to said negative bus, said drain terminal being connected to said common node.
Claim 8
Dependent Claim
22 words
The apparatus of claim 1 further comprising a circuit for maintaining a voltage of said ESD bus at a predetermined minimum level.
Claim 9
Dependent Claim
22 words
The apparatus of claim 7 further comprising a circuit for limiting a voltage on said ESD bus to a maximum predetermined level.
Claim 10
Dependent Claim
37 words
The apparatus of claim 8, wherein said circuit for limiting a maximum voltage of said ESD bus comprises a diode and a resistor coupled in series between ESD bus and a positive bus of said power supply.
Claim 11
Dependent Claim
39 words
The apparatus of claim 7, wherein said circuit for maintaining said voltage on the ESD bus comprises a charge pump coupled to (i) said negative bus of said power supply and (ii) a positive bus of said power supply.
Claim 12
Dependent Claim
36 words
The apparatus of claim 7, wherein said circuit for maintaining said voltage on ESD bus comprises a diode and a resistor coupled in series between a positive bus of said power supply and said ESD bus.
Claim 13
Dependent Claim
22 words
The apparatus of claim 1 further comprising a circuit for limiting a voltage on said ESD bus to a maximum predetermined level.
Claim 14
Dependent Claim
38 words
The apparatus of claim 12, where in said circuit for limiting a maximum voltage of said ESD bus comprises a diode and a resistor coupled in series between ESD bus and a positive bus of said power supply.
Claim 15
Dependent Claim
31 words
The apparatus of claim 13, wherein said resistor is directly coupled to said ESD bus, and said diode is coupled between said resistor and said positive bus of said power supply.
Claim 16
Dependent Claim
49 words
The apparatus of claim 1, wherein said SCR circuit comprises (i) a first transistor coupled to said ESD bus and (ii) a second transistor coupled to said negative bus of said power supply, at least one of said first and second transistors being coupled to said second impedance element.
Claim 17
Dependent Claim
16 words
The apparatus of claim 15, wherein said first and second transistors each comprise a bipolar transistor.
Claim 18
Dependent Claim
30 words
The apparatus of claim 16, wherein each of said first and second transistors have a base receiving current from a collector of the other of said first and second transistors.
Claim 19
Dependent Claim
29 words
The apparatus of claim 17, wherein said second impedance element is directly coupled to (i) said base of said first transistor and (ii) said collector of said second transistor.
Claim 20
Independent Claim
302 words
A device for electrostatic discharge (ESD) protection comprising: a silicon controlled rectifier (SCR) device configured to transfer charge from a first node to a second node; a trigger device configured to activate transfer of charge by said SCR device when a voltage on the first node reaches a predetermined threshold level; said SCR device including, (i) a substrate of a first conductivity type; and, (ii) a well region of a second conductivity type opposite said first conductivity type formed in said substrate, said well region including a first ohmic contact region of said second conductivity type formed in said well, a second ohmic contact region of said second conductivity type formed in said well region spaced from said first ohmic contact region, and a junction region of said first conductivity type formed in said well; a third ohmic contact region of said first conductivity type formed in said substrate; a drain region of said second conductivity type opposite said first conductivity type formed in said substrate, a source region of said second conductivity type formed in said substrate, said source and drain regions being spaced apart to define a channel region therebetween; a gate dielectric region of dielectric material overlying said channel region; a control gate formed over said gate dielectric region; said third ohmic contact, said control gate, and said source region being connected to a negative power supply bus (Vss); an ESD bus connected to said junction region and said first ohmic contact region; said drain region being connected to said second ohmic contact region wherein a resistive element formed by a portion of said well region is electrically interposed between said ESD bus and said drain region; and a first diode having an anode coupled to one of the interface pads and a cathode coupled to said ESD bus.
Claim 21
Independent Claim
302 words
A device for electrostatic discharge (ESD) protection comprising: a silicon controlled rectifier (SCR) device configured to transfer charge from a first node to a second node; a trigger device configured to activate transfer of charge by said SCR device when a voltage on the first node reaches a predetermined threshold level; said SCR device including, (i) a substrate of a first conductivity type; and, (ii) a well region of a second conductivity type opposite said first conductivity type formed in said substrate, said well region including a first ohmic contact region of said second conductivity type formed in said well, a second ohmic contact region of said second conductivity type formed in said well region spaced from said first ohmic contact region, and a junction region of said first conductivity type formed in said well; a third ohmic contact region of said first conductivity type formed in said substrate; a drain region of said second conductivity type opposite said first conductivity type formed in said substrate, a source region of said second conductivity type formed in said substrate, said source and drain regions being spaced apart to define a channel region therebetween; a gate dielectric region of dielectric material overlying said channel region; a control gate formed over said gate dielectric region; said third ohmic contact, said control gate, and said source region being connected to a negative power supply bus (Vss); an ESD bus connected to said junction region and said first ohmic contact region; said drain region being connected to said second ohmic contact region wherein a resistive element formed by a portion of said well region is electrically interposed between said ESD bus and said drain region; and a first diode having an anode coupled to one of the interface pads and a cathode coupled to said ESD bus.
Claim 22
Dependent Claim
32 words
The structure of claim 19 further including a second diode having an anode coupled to said negative power supply bus (V ss ) and a cathode coupled to said one input pad.
Claim 23
Dependent Claim
19 words
The structure of claim 20 wherein said first conductivity type is p-type and said second conductivity type is n-type.