Patent US5801452A successfully refreshed from Google Patents.
US5801452A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi chip module including semiconductor wafer or dice, interconnect substrate, and alignment member
Assignee: Micron Technology Inc
•
Filing: 1996-10-25
•
Granted: 1998-09-01
•
Expires: 2016-10-25
Abstract
Abstract An improved multi chip module (MCM) and a method for forming the multi chip module are provided. The multi chip module includes a semiconductor wafer and an interconnect substrate having contact members adapted to establish electrical communication with dice contained on the wafer. The contact members can be formed as etched pillars with penetrating projections or as microbumps on a flexible tape. An alignment plate associated with the interconnect substrate includes an alignment opening adapted to mechanically align bond pads, or other contact locations, on the wafer with the contact members on the interconnect substrate. The multi chip module also includes a force applying member in the form of a compressible bladder or elastomeric member, adapted to press the wafer against the interconnect substrate. In an alternate embodiment, the multi chip module includes tested singulated dice and the alignment plate includes multiple alignment openings.
Inventors
- 👤 Warren M. Farnworth
- 👤 Salman Akram
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 06:04
CPC Classifications
H; H10; H10W; H10W90/00; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00
Claims Analysis
Total Claims: 49
Claim 1
Independent Claim
60 words
A multi chip module comprising: a semiconductor wafer; a substrate having a plurality of contact members; a silicon alignment plate with an etched opening configured to align the wafer with the substrate; and a force applying member for biasing the wafer against the substrate with the contact members on the substrate in electrical communication with contact locations on the wafer.
Claim 2
Dependent Claim
60 words
A multi chip module comprising: a semiconductor wafer; a substrate having a plurality of contact members; a silicon alignment plate with an etched opening configured to align the wafer with the substrate; and a force applying member for biasing the wafer against the substrate with the contact members on the substrate in electrical communication with contact locations on the wafer.
Claim 3
Dependent Claim
25 words
The module as claimed in claim 1 further comprising a housing for retaining the wafer, the substrate, the alignment plate and the force applying member.
Claim 4
Dependent Claim
54 words
A multi chip module comprising: a semiconductor wafer; a substrate having a plurality of contact members; an alignment plate configured to align the wafer with the substrate; and a compressible bladder for biasing the wafer against the substrate with the contact members on the substrate in electrical communication with contact locations on the wafer.
Claim 5
Dependent Claim
54 words
A multi chip module comprising: a semiconductor wafer; a substrate having a plurality of contact members; an alignment plate configured to align the wafer with the substrate; and a compressible bladder for biasing the wafer against the substrate with the contact members on the substrate in electrical communication with contact locations on the wafer.
Claim 6
Dependent Claim
69 words
A multi chip module comprising: a semiconductor wafer having a plurality of contact locations thereon; a substrate having a plurality of contact members thereon, each contact member comprising at least one projection adapted to penetrate a respective contact location to a limited penetration depth; an alignment plate configured to align the contact members with the contact locations; and a force applying member for biasing the wafer against the substrate.
Claim 7
Dependent Claim
69 words
A multi chip module comprising: a semiconductor wafer having a plurality of contact locations thereon; a substrate having a plurality of contact members thereon, each contact member comprising at least one projection adapted to penetrate a respective contact location to a limited penetration depth; an alignment plate configured to align the contact members with the contact locations; and a force applying member for biasing the wafer against the substrate.
Claim 8
Dependent Claim
19 words
The module as claimed in claim 4 wherein the contact members comprise conductive layers bonded to the contact locations.
Claim 9
Dependent Claim
23 words
The module as claimed in claim 4 further comprising a plurality of conductive adhesive layers formed between the contact members and contact locations.
Claim 10
Dependent Claim
29 words
The module as claimed in claim 4 further comprising a housing configured to retain the wafer and substrate, the housing comprising terminals in electrical communication with the contact members.
Claim 11
Dependent Claim
86 words
A multi chip module comprising: a plurality of semiconductor dice having a plurality of contact locations thereon; a substrate comprising a plurality of contact members configured to establish electrical communication with the contact locations on the dice; a plurality of conductive adhesive layers bonding and electrically connecting the contact members to the contact locations; an alignment plate including a plurality of alignment openings with the dice placed therein in alignment with the contact members; and a force applying member for biasing the dice against the substrate.
Claim 12
Dependent Claim
86 words
A multi chip module comprising: a plurality of semiconductor dice having a plurality of contact locations thereon; a substrate comprising a plurality of contact members configured to establish electrical communication with the contact locations on the dice; a plurality of conductive adhesive layers bonding and electrically connecting the contact members to the contact locations; an alignment plate including a plurality of alignment openings with the dice placed therein in alignment with the contact members; and a force applying member for biasing the dice against the substrate.
Claim 13
Dependent Claim
26 words
The module as claimed in claim 8 further comprising a sealed housing for containing the dice, the substrate, the alignment plate and the force applying member.
Claim 14
Dependent Claim
14 words
The module as claimed in claim 8 wherein the dice comprise chip scale packages.
Claim 15
Dependent Claim
18 words
The module as claimed in claim 8 wherein the contact members comprise etched pillars covered with conductive layers.
Claim 16
Dependent Claim
67 words
A multi chip module comprising: a plurality of semiconductor dice comprising a plurality of contact locations; a substrate comprising a plurality of contact members configured to establish electrical communication with the contact locations on the dice; an alignment plate comprising a plurality of alignment openings with the dice placed therein in alignment with the contact members; and a compressible bladder for biasing the dice against the substrate.
Claim 17
Dependent Claim
67 words
A multi chip module comprising: a plurality of semiconductor dice comprising a plurality of contact locations; a substrate comprising a plurality of contact members configured to establish electrical communication with the contact locations on the dice; an alignment plate comprising a plurality of alignment openings with the dice placed therein in alignment with the contact members; and a compressible bladder for biasing the dice against the substrate.
Claim 18
Dependent Claim
20 words
The module as claimed in claim 12 wherein the contact members comprise bumps formed on tape attached to the substrate.
Claim 19
Dependent Claim
88 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing comprising a plurality of contact members in electrical communication with the terminals, the contact members comprising microbumps mounted to a flexible tape attached to the substrate; an alignment plate attached to the housing in alignment with the substrate and including an alignment opening; a semiconductor wafer placed through the opening against the substrate with contact locations on the wafer in electrical communication with the contact members on the substrate.
Claim 20
Dependent Claim
88 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing comprising a plurality of contact members in electrical communication with the terminals, the contact members comprising microbumps mounted to a flexible tape attached to the substrate; an alignment plate attached to the housing in alignment with the substrate and including an alignment opening; a semiconductor wafer placed through the opening against the substrate with contact locations on the wafer in electrical communication with the contact members on the substrate.
Claim 21
Dependent Claim
20 words
The module as claimed in claim 14 further comprising a force applying member for biasing the wafer against the substrate.
Claim 22
Dependent Claim
17 words
The module as claimed in claim 14 wherein the contact members are bonded to the contact locations.
Claim 23
Dependent Claim
77 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals: a substrate mounted to the housing, the substrate comprising a plurality of contact members in electrical communication with the terminals; an alignment plate on the housing and including an alignment opening; and a semiconductor wafer comprising a plurality of contact locations, the wafer placed through the opening and against the substrate with the contact members bonded to the contact locations with a conductive adhesive.
Claim 24
Dependent Claim
77 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals: a substrate mounted to the housing, the substrate comprising a plurality of contact members in electrical communication with the terminals; an alignment plate on the housing and including an alignment opening; and a semiconductor wafer comprising a plurality of contact locations, the wafer placed through the opening and against the substrate with the contact members bonded to the contact locations with a conductive adhesive.
Claim 25
Dependent Claim
85 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing, the substrate comprising a plurality of contact members in electrical communication with the terminals, the contact members comprising etched members covered with conductive layers; an alignment plate on the housing and including an alignment opening; and a semiconductor wafer comprising a plurality of contact locations, the wafer placed through the opening and against the substrate with the contact members in electrical communication with the contact locations.
Claim 26
Dependent Claim
85 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing, the substrate comprising a plurality of contact members in electrical communication with the terminals, the contact members comprising etched members covered with conductive layers; an alignment plate on the housing and including an alignment opening; and a semiconductor wafer comprising a plurality of contact locations, the wafer placed through the opening and against the substrate with the contact members in electrical communication with the contact locations.
Claim 27
Dependent Claim
13 words
The module as claimed in claim 18 wherein the alignment plate comprises silicon.
Claim 28
Dependent Claim
21 words
The module as claimed in claim 18 wherein the contact members are bonded to the contact locations with conductive adhesive layers.
Claim 29
Dependent Claim
107 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing comprising a plurality of contact members in electrical communication with the terminals; an alignment plate mounted to the housing in alignment with the substrate and including a plurality of alignment openings; a plurality of semiconductor dice placed through the openings such that contact locations on the dice are in electrical communication with the contact members on the substrate; and a force applying member for biasing the dice against the substrate, the force applying member comprising a material selected from the group consisting of silicone, butyl rubber, and fluorosilicone.
Claim 30
Dependent Claim
107 words
A multi chip module comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing comprising a plurality of contact members in electrical communication with the terminals; an alignment plate mounted to the housing in alignment with the substrate and including a plurality of alignment openings; a plurality of semiconductor dice placed through the openings such that contact locations on the dice are in electrical communication with the contact members on the substrate; and a force applying member for biasing the dice against the substrate, the force applying member comprising a material selected from the group consisting of silicone, butyl rubber, and fluorosilicone.
Claim 31
Dependent Claim
14 words
The module as claimed in claim 21 wherein the dice comprise known good dice.
Claim 32
Dependent Claim
14 words
The module as claimed in claim 21 wherein the dice comprise chip scale packages.
Claim 33
Dependent Claim
17 words
The module as claimed in claim 21 wherein the contact members are bonded to the contact locations.
Claim 34
Dependent Claim
22 words
The module as claimed in claim 21 wherein the contact members comprise microbumps mounted to a flexible tape attached to the substrate.
Claim 35
Dependent Claim
84 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a silicon substrate mounted to the housing and having a plurality of contact members comprising etched pillars covered with conductive layers in electrical communication with the terminals, an alignment plate placed on the substrate having an alignment opening formed therethrough; a semiconductor wafer placed through the alignment opening so that the contact members establish electrical communication with contact locations on the wafer; a force applying member for biasing the wafer against the substrate.
Claim 36
Dependent Claim
84 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a silicon substrate mounted to the housing and having a plurality of contact members comprising etched pillars covered with conductive layers in electrical communication with the terminals, an alignment plate placed on the substrate having an alignment opening formed therethrough; a semiconductor wafer placed through the alignment opening so that the contact members establish electrical communication with contact locations on the wafer; a force applying member for biasing the wafer against the substrate.
Claim 37
Dependent Claim
20 words
The module as claimed in claim 26 wherein the wafer is thinned prior to being placed in the alignment opening.
Claim 38
Dependent Claim
16 words
The assembly as claimed in claim 26 further comprising a cover sealingly attached to the housing.
Claim 39
Dependent Claim
17 words
The assembly as claimed in claim 26 wherein the conductive layer is bonded to the contact locations.
Claim 40
Dependent Claim
90 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing and having a plurality of contact members in electrical communication with the terminals, the contact members comprising microbumps mounted to a flexible tape attached to the substrate; an alignment plate placed on the substrate having an alignment opening formed therethrough; a semiconductor wafer placed through the alignment opening so that the contact members establish electrical communication with contact locations on the wafer; a force applying member for biasing the wafer against the substrate.
Claim 41
Dependent Claim
90 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing and having a plurality of contact members in electrical communication with the terminals, the contact members comprising microbumps mounted to a flexible tape attached to the substrate; an alignment plate placed on the substrate having an alignment opening formed therethrough; a semiconductor wafer placed through the alignment opening so that the contact members establish electrical communication with contact locations on the wafer; a force applying member for biasing the wafer against the substrate.
Claim 42
Dependent Claim
21 words
The assembly as claimed in claim 30 wherein the contact members are attached to the contact locations using a conductive adhesive.
Claim 43
Dependent Claim
89 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing and having a plurality of contact members in electrical communication with the terminals; an alignment plate placed on the substrate having an alignment opening formed therethrough; a semiconductor wafer placed through the alignment opening so that the contact members establish electrical communication with contact locations on the wafer; a force applying member for biasing the wafer against the substrate; and an underfill layer formed in a gap between the substrate and wafer.
Claim 44
Dependent Claim
89 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing and having a plurality of contact members in electrical communication with the terminals; an alignment plate placed on the substrate having an alignment opening formed therethrough; a semiconductor wafer placed through the alignment opening so that the contact members establish electrical communication with contact locations on the wafer; a force applying member for biasing the wafer against the substrate; and an underfill layer formed in a gap between the substrate and wafer.
Claim 45
Dependent Claim
100 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing, the housing comprising a plurality of contact members in electrical communication with the terminals, an alignment plate placed on the substrate having an a plurality of alignment openings formed therethrough; a plurality of semiconductor dice placed through the alignment openings, each die comprising a plurality of contact locations; a plurality of conductive adhesive layers bonding and electrically connecting the contact members on the substrate with the contact locations on the dice; and a force applying member for biasing the wafer against the substrate.
Claim 46
Dependent Claim
100 words
An assembly comprising: a housing comprising a plurality of input/output terminals; a substrate mounted to the housing, the housing comprising a plurality of contact members in electrical communication with the terminals, an alignment plate placed on the substrate having an a plurality of alignment openings formed therethrough; a plurality of semiconductor dice placed through the alignment openings, each die comprising a plurality of contact locations; a plurality of conductive adhesive layers bonding and electrically connecting the contact members on the substrate with the contact locations on the dice; and a force applying member for biasing the wafer against the substrate.
Claim 47
Dependent Claim
15 words
The assembly as claimed in claim 33 wherein the dice comprise tested known good dice.
Claim 48
Dependent Claim
13 words
The assembly as claimed in claim 33 wherein the dice comprise bare dice.
Claim 49
Dependent Claim
14 words
The assembly as claimed in claim 33 wherein the dice comprise chip scale packages.
References Cited (Backward Citations)
US4000509A
Cited
US5539324A
Cited
US5189505A
Cited
US5182632A
Cited
US5123850A
Cited
US5140405A
Cited
US5155661A
Cited
US5541525A
Cited
US5519332A
Cited
US5408190A
Cited
US5559444A
Cited
US5634267A
Cited
US5440241A
Cited
US5578526A
Cited
US5483741A
Cited
US5371652A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-08-31 | 2002-03-02 | 2002-09-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-08-31 | 2006-03-02 | 2006-09-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-08-31 | 2010-03-02 | 2010-09-01 | $7700.00 | Window Closed / Lapsed |