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US5793089A Expired / Lapsed US ⏱️ 0.0 years remaining

Graded MOS transistor junction formed by aligning a sequence of implants to a selectively removable polysilicon sidewall space and oxide thermally grown thereon

Assignee: GlobalFoundries Inc
•
Filing: 1997-01-10
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Granted: 1998-08-11
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Expires: 2017-01-10
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Abstract

Abstract A transistor and transistor fabrication method are presented where a sequence of layers are formed and either entirely or partially removed upon sidewall surfaces of a gate conductor. The formation and removal of layers produces a lateral surface to which various implants can be aligned. Those implants, placed in succession produce a highly graded junction having a relatively smooth doping profile. Preferably, the multi-layer spacer structure comprises a polysilicon spacer interposed between a grown oxide and an etch stop. The oxide is grown upon the polysilicon to align a source/drain implant. Either before the source/drain implant or after the source/drain implant, the oxide and polysilicon partially consumed by the oxide is removed to provide a lateral surface to which an MDD implant aligns. A combination of etch stop, polysilicon spacer and grown possibly sacrificial oxide allows a greater ease by which multiple implants can be forwarded into junctions of either an NMOS or PMOS transistor.

Inventors

  • 👤 H. Jim Fulford, Jr.
  • 👤 Mark I. Gardner
  • 👤 Fred N. Hause

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 11:31
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/01; H10D64/015; H10D30/00; H10D30/01; H10D30/021; H10D30/0223; H10D30/0227; H10D30/60; H10D30/601; H10D64/021; Y; Y10; Y10S; Y10S257/00; Y10S257/90

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 138 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said gate conductor sidewall surfaces, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.
Claim 2
Dependent Claim 138 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said gate conductor sidewall surfaces, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.
Claim 3
Dependent Claim 30 words
The integrated circuit as recited in claim 1, wherein at least one of said plurality of implant areas is in lateral alignment with an outer edge of said polysilicon spacer.
Claim 4
Dependent Claim 23 words
The integrated circuit as recited in claim 1, wherein said oxide, said polysilicon spacer and said etch stop layer have dissimilar etch characteristics.
Claim 5
Dependent Claim 30 words
The integrated circuit as recited in claim 1, wherein at least one of said plurality of implant areas is in lateral alignment with an edge of said gate conductor sidewall.
Claim 6
Dependent Claim 29 words
The integrated circuit as recited in claim 1, wherein at least one of said plurality of implant areas is in lateral alignment with an outer edge of said oxide.
Claim 7
Dependent Claim 136 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said etch stop, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.
Claim 8
Dependent Claim 136 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said etch stop, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.

References Cited (Backward Citations)

US4672419A Cited
US4868617A Cited
US4949136A Cited
US4994404A Cited
US5274261A Cited
US5091763A Cited
US5386133A Cited
US5473184A Cited
US5663586A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-08-10 2002-02-09 2002-08-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-08-10 2006-02-09 2006-08-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-08-10 2010-02-09 2010-08-11 $7700.00 Window Closed / Lapsed

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