Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
138 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said gate conductor sidewall surfaces, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.
Claim 2
Dependent Claim
138 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said gate conductor sidewall surfaces, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.
Claim 3
Dependent Claim
30 words
The integrated circuit as recited in claim 1, wherein at least one of said plurality of implant areas is in lateral alignment with an outer edge of said polysilicon spacer.
Claim 4
Dependent Claim
23 words
The integrated circuit as recited in claim 1, wherein said oxide, said polysilicon spacer and said etch stop layer have dissimilar etch characteristics.
Claim 5
Dependent Claim
30 words
The integrated circuit as recited in claim 1, wherein at least one of said plurality of implant areas is in lateral alignment with an edge of said gate conductor sidewall.
Claim 6
Dependent Claim
29 words
The integrated circuit as recited in claim 1, wherein at least one of said plurality of implant areas is in lateral alignment with an outer edge of said oxide.
Claim 7
Dependent Claim
136 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said etch stop, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.
Claim 8
Dependent Claim
136 words
An integrated circuit, comprising: a transistor having a gate conductor dielectrically spaced over a channel area interposed between a pair of junction areas; an etch stop layer formed upon opposed sidewall surfaces of said gate conductor and upon a portion of said pair of junction areas, wherein the etch stop layer comprises a silicon nitride layer overlying an oxide layer; a polysilicon spacer formed upon said etch stop layer proximate to said opposed sidewall surfaces; an oxide grown upon and partially into exposed surfaces of said polysilicon spacer; and at least three differing concentration implant areas in each of said pair of junction areas in approximate lateral alignment with said etch stop, said polysilicon spacer and said oxide; wherein said implant areas increase in depth as the implant position is spaced further from said channel area.