Optoelectronic device receptacle and method of making same

Claim 2

An optoelectronic device interface system comprising: a) a receptacle body comprising a central cavity and a latch receiving structure; b) a first receptacle alignment block mounted in the central cavity of the receptacle body, wherein the alignment block comprises: an optical fiber mating surface having at least one groove therein for engaging an optical fiber, and at least one optical fiber disposed in the at least one groove, wherein the at least one optical fiber extends over the entire length of the alignment block, a cable mating surface at a first end of the optical fiber mating surface and generally normal thereto, wherein the cable mating surface comprises at least one receiving cavity; and an electronic device mating surface at a second end of the optical fiber mating surface and generally normal thereto; and c) an optical fiber cable assembly comprising: an optical fiber cable comprising a plurality of optical fibers mounted in a generally parallel arrangement, and a connector attached to at least one end of the optical fiber cable, wherein the connector comprises: an alignment block comprising an alignment device to engage the receiving cavity in the cable mating surface of the fiber receptacle alignment block, and a latching structure to engage the latch receiving structure in the receptacle body.

Claim 3

The receptacle of claim 1, further comprising securing means for securing the at least one optical fiber in the at least one groove.

Claim 4

The receptacle of claim 1, further comprising a second receptacle alignment block portion that mates with the first receptacle alignment block portion thereby securing the at least one optical fiber in the at least one groove therebetween.

Claim 5

The interface system of claim 3, further comprising a flexible circuit mounted to the mated first and second receptacle alignment block portions wherein an optoelectronic semiconductor component is mounted to the first receptacle alignment block portion via the flexible circuit.

Claim 6

The interface system of claim 3, further comprising a flexible circuit mounted to the mated first and second receptacle alignment block portions wherein an optoelectronic semiconductor component is mounted to the second receptacle alignment block portion via the flexible circuit.

Claim 7

The interface system of claim 3, further comprising a flexible circuit mounted to the mated first and second receptacle alignment block portions wherein an optoelectronic semiconductor component is mounted to both the first and second receptacle alignment block portions via the flexible circuit.

Claim 8

The interface system of claim 4, wherein the flexible electrical circuit comprises a polymer film having a plurality of electrical lines contained thereon, and wherein the flexible circuit has a plurality of electrically conductive pads thereon for electrically connected to the optoelectronic semiconductor component.

Claim 9

The interface system of claim 3, further comprising securing means for securing the first and second block portions.

Claim 10

The interface system of claim 8, wherein the securing means is an adhesive.

Claim 11

The interface system of claim 4, wherein the optoelectronic semiconductor component has an active area from which light is emitted and wherein the optoelectronic semiconductor component is mounted to the flexible circuit such that the active area is aligned with the optical fibers.

Claim 12

The interface system of claim 4, further comprising a protective coating encompassing the optoelectronic semiconductor component.

Claim 13

The interface system of claim 3, further comprising alignment means for aligning the alignment block portion with a connector.

Claim 14

The interface system of claim 3, wherein the first and second receptacle alignment block portions have optical semiconductor component coupling surfaces, the subassembly further comprising: a first electrical lead integrally formed in the first receptacle alignment block portion and extending to a point outside of the first receptacle alignment block portion; and a second electrical lead integrally formed in the second receptacle alignment block portion and extending to a point outside the second receptacle alignment block portion at least one electrical contact on the optical semiconductor component coupling surfaces of both the first and second receptacle alignment block portions, the at least one contact of the first receptacle alignment block portion being electrically connected to the first electrical lead, and the at least one contact of the second receptacle alignment block portion being electrically connected to the second electrical lead.

Claim 15

The interface system of claim 13, further comprising: a plurality of electrical leads integrally formed in at least one of the first and second receptacle alignment block portions and extending to a point outside the first and second alignment block portions; and a plurality of electrical contacts on the optical semiconductor component coupling surfaces connected to the plurality of electrical leads.

Claim 16

The interface system of claim 14, further comprising at least one electrical contact on the optical semiconductor component coupling surfaces of both the first and second receptacle alignment block portions, the at least one contact of the first receptacle alignment block portion being electrically connected to the first electrical lead, and the at least one contact of the second receptacle alignment block portion being electrically connected to the second electrical lead.

Claim 17

The interface system of claim 1, wherein the optoelectronic device receptacle further comprises an optoelectronic semiconductor component selected from the group consisting of one or more of: laser arrays, edge-emitting lasers, super luminescence diodes, vertical cavity surface emitting lasers, light emitting diodes or optical detectors.

Claim 18

An optoelectronic device interface system comprising: a) a receptacle body comprising a central cavity and an arrangement of receiving slots; b) a first and a second receptacle alignment block mounted in the central cavity of the receptacle body, wherein each of the first and second alignment blocks comprises: an optical fiber mating surface having at least one groove therein for engaging an optical fiber, a cable mating surface at a first end of the optical fiber mating surface and generally normal thereto, wherein the cable mating surface comprises at least one receiving cavity; and an electronic device mating surface at a second end of the optical fiber mating surface and generally normal thereto; wherein the optical fiber mating surface of the first receptacle alignment block mates with the optical fiber mating surface of the second receptacle alignment block, and wherein at least one optical fiber is disposed between the first and second receptacle alignment blocks and in the at least one groove, and extends over the entire length of the alignment block; c) securing means for securing the first and second receptacle alignment blocks together; d) an optical fiber cable assembly comprising: an optical fiber cable comprising a plurality of optical fibers mounted in a generally parallel arrangement, and a connector attached to at least one end of the optical fiber cable, wherein the connector comprises: an alignment block comprising an alignment device to engage the receiving cavity in the cable mating surface of the fiber receptacle alignment block, and a latching structure comprising first and second latching arms to engage the receiving slots in the receptacle body; and e) a flexible electrical circuit mounted to the electronic device mating surfaces of the first and second receptacle alignment blocks.

Claim 19

An optoelectronic device interface system comprising: a) a receptacle body comprising a central cavity and an arrangement of receiving slots; b) a first and a second receptacle alignment block mounted in the central cavity of the receptacle body, wherein each of the first and second alignment blocks comprises: an optical fiber mating surface having at least one groove therein for engaging an optical fiber, a cable mating surface at a first end of the optical fiber mating surface and generally normal thereto, wherein the cable mating surface comprises at least one receiving cavity; and an electronic device mating surface at a second end of the optical fiber mating surface and generally normal thereto; wherein the optical fiber mating surface of the first receptacle alignment block mates with the optical fiber mating surface of the second receptacle alignment block, and wherein at least one optical fiber is disposed between the first and second receptacle alignment blocks and in the at least one groove, and extends over the entire length of the alignment block; c) securing means for securing the first and second receptacle alignment blocks together; d) an optical fiber cable assembly comprising: an optical fiber cable comprising a plurality of optical fibers mounted in a generally parallel arrangement, and a connector attached to at least one end of the optical fiber cable, wherein the connector comprises: an alignment block comprising an alignment device to engage the receiving cavity in the cable mating surface of the fiber receptacle alignment block, and a latching structure comprising first and second latching arms to engage the receiving slots in the receptacle body; and e) a flexible electrical circuit mounted to the electronic device mating surfaces of the first and second receptacle alignment blocks.

Claim 20

The interface system of claim 17, wherein the securing means is an adhesive.

Claim 21

The interface system of claim 17, wherein the flexible electrical circuit comprises a polymer film having a plurality of electrical lines contained thereon, and wherein the flexible circuit has a plurality of electrically conductive pads thereon for electrically connecting to a desired optoelectronic semiconductor component.

Claim 22

The interface system claim 17, further comprising an optoelectronic semiconductor component mounted to the flexible electrical circuit.

Claim 23

The interface system of claim 20, wherein the optoelectronic semiconductor component has an active area and wherein the optoelectronic semiconductor component is mounted to the flexible circuit such that the active area is aligned with the optical fibers.

Claim 24

The interface system of claim 20, wherein the optoelectronic semiconductor component is selected from the group consisting of one or more of: laser arrays, edge-emitting lasers, super luminescence diodes, vertical cavity surface emitting lasers, light emitting diodes, or optical detectors.

Claim 27

The method of claim 23, further including the step of providing alignment means for the pair of connector alignment blocks and the at least one optoelectronic device receptacle.

Claim 28

The method of claim 24, including the additional step of polishing the ends of the cut fibers as necessary.

Claim 29

The method of claim 24, including the additional step of mounting an optoelectronic semiconductor device to the at least one optoelectronic device receptacle block.