Patent US5786238A successfully refreshed from Google Patents.
US5786238A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Laminated multilayer substrates
Assignee: General Dynamics Information Systems Inc
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Filing: 1997-02-13
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Granted: 1998-07-28
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Expires: 2017-02-13
Abstract
Abstract A process of laminating a large-layer-count (LLC) substrates includes formation of first and second vias through respective substrates. A conductive path is formed through each of the respective vias, and posts are formed on the respective vias, electrically connected to the respective conductive path. A non-flowable adhesive layer having an aperture is provided between the LLC substrates so that the posts confront each other through the aperture. The LLC substrates are pressed together through the non-flowable adhesive layer to mechanically bond them together, and so that the posts abut each other. Simultaneously, the posts are electrically bonded to each other in the aperture.
Inventors
- 👤 Deepak K. Pai
- 👤 Ronald R. Denny
- 👤 Jeanne M. Chevalier
- 👤 George F. Schwartz, III
- 👤 Clark F. Webster
- 👤 Robert M. Lufkin
- 👤 Terrance A. Krinke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 04:58
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H10; H10D; H10D64/00; H10D64/01; H10D64/011; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/0959; H05K2201/096; H05K2203/00; H05K2203/06; H05K2203/063; H05K2203/15; H05K2203/1572; H05K3/0094; H05K3/4623; H05K3/4644; H05K3/4647; H10W; H10W80/00; H10W80/301
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
227 words
A process of interconnecting large-layer-count (LLC) substrates, comprising: providing first and second LLC substrates, each having a top surface and a bottom surface; forming a first via in the first LLC substrate and a second via in the second LLC substrate, the first and second vias extending through the respective first and second LLC substrates between the respective top and bottom surfaces; forming a conductive path through each of the first and second vias between the respective top and bottom surfaces; forming a first post on the top surface of the first LLC substrate over the first via and electrically connected to the conductive path formed through the first via, and a second post on the top surface of the second LLC substrate over the second via and electrically connected to the conductive path formed through the second via; providing a non-flowable adhesive layer having an aperture; positioning the non-flowable adhesive layer between the first and second LLC substrates so that the first and second posts confront each other through the aperture in the non-flowable film adhesive layer; and simultaneously: pressing the first and second LLC substrates together through the non-flowable adhesive layer so that the non-flowable film adhesive layer is adhesively bonded to the first and second LLC substrates and the first and second posts abut each other; and bonding the posts to each other electrically.
Claim 2
Dependent Claim
227 words
A process of interconnecting large-layer-count (LLC) substrates, comprising: providing first and second LLC substrates, each having a top surface and a bottom surface; forming a first via in the first LLC substrate and a second via in the second LLC substrate, the first and second vias extending through the respective first and second LLC substrates between the respective top and bottom surfaces; forming a conductive path through each of the first and second vias between the respective top and bottom surfaces; forming a first post on the top surface of the first LLC substrate over the first via and electrically connected to the conductive path formed through the first via, and a second post on the top surface of the second LLC substrate over the second via and electrically connected to the conductive path formed through the second via; providing a non-flowable adhesive layer having an aperture; positioning the non-flowable adhesive layer between the first and second LLC substrates so that the first and second posts confront each other through the aperture in the non-flowable film adhesive layer; and simultaneously: pressing the first and second LLC substrates together through the non-flowable adhesive layer so that the non-flowable film adhesive layer is adhesively bonded to the first and second LLC substrates and the first and second posts abut each other; and bonding the posts to each other electrically.
Claim 3
Dependent Claim
13 words
The process of claim 1, wherein the non-flowable adhesive layer comprises B-stage material.
Claim 4
Dependent Claim
27 words
The process of claim 2, wherein the aperture in the non-flowable adhesive layer is laser drilled to cure the B-stage material along a perimeter of the aperture.
Claim 5
Dependent Claim
17 words
The process of claim 1, wherein the first and second posts each include a layer of solder.
Claim 6
Dependent Claim
23 words
The process of claim 4, wherein bonding the posts to each other electrically comprises heating the posts to reflow the layers of solder.
Claim 7
Dependent Claim
19 words
The process of claim 1, wherein the first and second posts each include a layer of a metal alloy.
Claim 8
Dependent Claim
23 words
The process of claim 6, wherein the step of bonding the posts to each other electrically comprises diffusing the layers of metal alloy.
Claim 9
Dependent Claim
18 words
The process of claim 1, including plating the top surface of the substrates with a layer of copper.
Claim 10
Dependent Claim
43 words
The process of claim 8, wherein the step of providing a conductive path through each of the first and second vias comprises plating side walls of the vias with copper to contact the copper layer plated on the top surface of the substrates.
Claim 11
Dependent Claim
25 words
The process of claim 9, further comprising filling the first and second vias with an epoxy material after plating the side walls of the vias.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-27 | 2002-01-26 | 2002-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-27 | 2006-01-26 | 2006-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-27 | 2010-01-26 | 2010-07-28 | $7700.00 | Window Closed / Lapsed |