Lead frame with electrostatic discharge protection

Claim 2

A lead frame having protection against electrostatic discharge, comprising: a multiplicity of leads; and an electrostatic discharge protection device including a conductive layer and a protection layer formed from an electrostatic discharge protection material, the protection layer being arranged to contact the multiplicity of leads, wherein the electrostatic discharge protection material insulates the leads from the conductive layer at voltages below a predefined threshold voltage and establishes an electrical connection between the leads and the conductive layer at voltages above the threshold voltage.

Claim 3

A lead frame as recited in claim 1 wherein at least one of the multiplicity of leads is configured to function as a ground plane, the lead frame further comprising a grounding wire that electrically couples the conductive layer to the ground plane.

Claim 4

The lead frame of claim 1, wherein the electrostatic discharge protection device takes the form of a square ring shaped polymer tape.

Claim 5

The lead frame of claim 1, wherein the electrostatic discharge protection device takes the form of a strip of polymer tape.

Claim 6

The lead frame of claim 1, wherein the predefined threshold voltage is in a range between about 10 and about 500 volts.

Claim 7

The lead frame of claim 1, further comprising a silver plating overlying the conductive layer to facilitate electrically connecting a bonding wire to the conductive layer.

Claim 8

The lead frame of claim 1, wherein the electrostatic discharge protection device further comprises a spacer material disposed between the conductive layer and the protection layer.

Claim 9

The lead frame of claim 1, wherein the electrostatic discharge protection device further comprising: a conductive adhesive layer disposed between the conductive layer and the protection layer for securing the conductive layer to the protection layer; and an anisotropic adhesive layer disposed between the protection layer and a plurality of leads for securing the electrostatic discharge protection device to the plurality of leads.

Claim 10

The lead frame of claim 1, wherein the protection layer comprises a B-stageable polymer.

Claim 11

The lead frame of claim 8, wherein at least one of the protection layer, the conductive adhesive layer and the anisotropic adhesive layer comprises a B-stageable polymer.

Claim 12

The lead frame of claim 1, wherein the thickness of the protection layer ranges from between about 0.0002 to about 0.005 inches.

Claim 13

A packaged semiconductor device, comprising: the lead frame as recited in claim 1; a die having a plurality of bond pads; a plurality of bonding wires electrically connecting associated ones of the bond pads to associated ones of the leads; and an encapsulation material encapsulating a portion of the packaged semiconductor and leaving exposed a portion of the leads to facilitate electrical connection to external circuitry.

Claim 14

A packaged semiconductor device as recited in claim 12 that takes the form of a multi-chip module, the multi-chip module including a plurality of dies attached to the lead frame.

Claim 15

A packaged semiconductor device, comprising: a lead frame having protection against electrostatic discharge, including: a multiplicity of leads, wherein at least one of the multiplicity of leads is configured to function as a ground plane; an electrostatic discharge protection device including a spacer material being disposed between a conductive layer and a protection layer formed from an electrostatic discharge protection material, the protection layer being arranged to contact the multiplicity of leads, wherein the electrostatic discharge protection material insulates the leads from the conductive layer at voltages below a predefined threshold voltage and establishes an electrical connection between the leads and the conductive layer at voltages above the threshold voltage; and a grounding wire that electrically couples the conductive layer to the ground plane; a die having a plurality of bond pads; a plurality of bonding wires electrically connecting associated ones of the bond pads to associated ones of the leads; and an encapsulation material encapsulating a portion of the packaged semiconductor and leaving exposed a portion of the leads to facilitate electrical connection to external circuitry.

Claim 16

A packaged semiconductor device, comprising: a lead frame having protection against electrostatic discharge, including: a multiplicity of leads, wherein at least one of the multiplicity of leads is configured to function as a ground plane; an electrostatic discharge protection device including a spacer material being disposed between a conductive layer and a protection layer formed from an electrostatic discharge protection material, the protection layer being arranged to contact the multiplicity of leads, wherein the electrostatic discharge protection material insulates the leads from the conductive layer at voltages below a predefined threshold voltage and establishes an electrical connection between the leads and the conductive layer at voltages above the threshold voltage; and a grounding wire that electrically couples the conductive layer to the ground plane; a die having a plurality of bond pads; a plurality of bonding wires electrically connecting associated ones of the bond pads to associated ones of the leads; and an encapsulation material encapsulating a portion of the packaged semiconductor and leaving exposed a portion of the leads to facilitate electrical connection to external circuitry.

Claim 17

The packaged semiconductor device of claim 14, wherein the electrostatic discharge protection device takes the form of a square ring shaped polymer tape.

Claim 18

The packaged semiconductor device of claim 14, wherein the predefined threshold voltage is in a range between about 10 and about 500 volts.

Claim 19

The packaged semiconductor device of claim 14, further comprising a silver plating overlying the conductive layer to facilitate electrically connecting a bonding wire to the conductive layer.

Claim 20

The packaged semiconductor device of claim 14, wherein the electrostatic discharge protection device further comprising: a conductive adhesive layer disposed between the conductive layer and the protection layer for securing the conductive layer to the protection layer; and an anisotropic adhesive layer disposed between the protection layer and the plurality of leads for securing the electrostatic discharge protection device to the plurality of leads.

Claim 21

The packaged semiconductor device of claim 18, wherein at least one of the protection layer, the conductive adhesive layer and the anisotropic adhesive layer comprises a B-stageable polymer.

Claim 22

The packaged semiconductor device of claim 14, wherein the thickness of the protection layer ranges from between about 0.0002 to about 0.005 inches.