Semiconductor device having voltage distribution ring(s) and method for making the same

Claim 2

A semiconductor device comprising: a semiconductor die having a periphery, a surface, and a plurality of bond pads on the surface and along the periphery; a single layer metal lead frame having a plurality of substantially co-planar leads offset from and surrounding the die periphery and electrically coupled to the plurality of bond pads; a voltage distribution ring offset from and surrounding the periphery of the die, the ring being an insulative polymer-based tape having a single metallized surface and being adhesively bonded to the plurality of leads to aid in maintaining lead planarity; and means for electrically coupling the metallized surface of the ring to a selected bond pad of the die.

Claim 3

The device of claim 1 wherein the means comprises a wire bond electrically coupling the selected bond pad to the metallized surface.

Claim 4

The device of claim 2 wherein a first lead lies beneath the metallized surface, such that the first lead supports the ring and the wire bond to the metallized surface.

Claim 5

The device of claim 1 further comprising means for electrically coupling the metallized surface of the ring to a selected lead of the plurality of leads.

Claim 6

The device of claim 4 wherein the means for electrically coupling the metallized surface of the ring to selected leads comprises a means selected from a group consisting of wire bonds, conductive polymers, and conductive paste.

Claim 7

The device of claim 4 wherein the means for electrically coupling the metallized surface of the ring to a selected bond pad comprises a first wire bond electrically coupling the metallized surface to the selected lead and a second wire bond electrically coupling the selected lead to the selected bond pad.

Claim 8

The device of claim 1 wherein the metallized surface is sub-divided into two annular segments.

Claim 9

The device of claim 7 wherein one segment serves as a first voltage distribution ring for use as a ground bus and the other segment serves as a second voltage distribution ring for use as a power bus.

Claim 10

The device of claim 8 wherein the segment serving as the ground bus is closer to the die periphery than the segment serving as the power bus.

Claim 11

The device of claim 7 wherein each segment has a comb-like configuration with a plurality of fingers, and wherein the fingers of the two segments are interdigitated with one another.

Claim 12

The device of claim 10 wherein one segment serves as a first voltage distribution ring for use as a ground bus and the other segment serves as a second voltage distribution ring for use as a power bus, wherein the first voltage distribution ring is closer to the die periphery than the second voltage distribution ring.

Claim 13

A semiconductor device comprising: a semiconductor die having a periphery and an active surface, the active surface having a plurality of signal bond pads and a plurality of voltage bond pads, both pluralities of bond pads being formed along the die periphery; a single layer metal lead frame comprising: a plurality of signal leads adjacent the periphery of the die; a plurality of voltage leads adjacent the periphery of the die and interspersed with the plurality of signal leads; and a voltage distribution ring comprised of a polyimide tape having a conductive surface on a single side of the tape, the ring being adhesively attached to the pluralities of signal and voltage leads to keep all leads substantially co-planar, and the ring surrounding and being offset from the die periphery; a plurality of wire bonds electrically coupling the plurality of signal leads to the plurality of signal bond pads; means for electrically coupling the voltage bond pads to the conductive surface of the ring; and means for electrically coupling the plurality of voltage leads to the conductive surface of the ring.

Claim 14

A semiconductor device comprising: a semiconductor die having a periphery and an active surface, the active surface having a plurality of signal bond pads and a plurality of voltage bond pads, both pluralities of bond pads being formed along the die periphery; a single layer metal lead frame comprising: a plurality of signal leads adjacent the periphery of the die; a plurality of voltage leads adjacent the periphery of the die and interspersed with the plurality of signal leads; and a voltage distribution ring comprised of a polyimide tape having a conductive surface on a single side of the tape, the ring being adhesively attached to the pluralities of signal and voltage leads to keep all leads substantially co-planar, and the ring surrounding and being offset from the die periphery; a plurality of wire bonds electrically coupling the plurality of signal leads to the plurality of signal bond pads; means for electrically coupling the voltage bond pads to the conductive surface of the ring; and means for electrically coupling the plurality of voltage leads to the conductive surface of the ring.

Claim 15

The device of claim 12 wherein the plurality of voltage leads is closer to the die periphery than the plurality of signal leads.

Claim 16

The device of claim 12 wherein the plurality of signal leads is closer to the die periphery than the plurality of voltage leads.

Claim 17

The device of claim 14 wherein a portion of the voltage distribution ring is closer to the die periphery than any lead of the plurality of signal leads.

Claim 18

The device of claim 12 wherein the polyimide tape has a slot which exposes portions of the signal leads, and wherein the exposed portions of the signal leads are wire bonded to the signal bond pads of the die.

Claim 19

The device of claim 16 wherein a portion of the voltage distribution ring is closer to the die periphery than any lead of the plurality of signal leads.

Claim 20

The device of claim 12 wherein the polyimide tape has a slot which exposes portions of the voltage leads, and wherein the exposed portions of the voltage leads are wire bonded to the conductive surface of the voltage distribution ring.

Claim 21

The device of claim 12 wherein the number of voltage bond pads on the die is greater than the number of voltage leads in the device.

Claim 22

The device of claim 12 wherein the voltage distribution ring comprises an inner ring and outer ring, wherein the inner ring is closer to the die periphery than the outer ring.

Claim 23

The device of claim 20 wherein the plurality of voltage pads comprises a plurality of ground pads and a plurality of power pads, and wherein the plurality of ground pads is electrically coupled to the inner ring and the plurality of power pads is electrically coupled to the outer ring.

Claim 24

The device of claim 20 wherein the inner ring and outer ring are interdigitated with one another.

Claim 27

The method of claim 23 wherein the step of electrically coupling comprises: wire bonding the selected bond pads to selected leads; and wire bonding the selected leads to the metal layer of the ring.

Claim 28

The method of claim 23 wherein the step of electrically coupling comprises wire bonding the selected bond pads directly to the metal layer of the ring.

Claim 29

The device of claim 1 wherein each lead of the plurality of leads has an inner lead tip located adjacent the die periphery, and wherein the voltage distribution ring is offset from each of the inner lead tips.

Claim 30

The device of claim 12 wherein each lead of the plurality of signal leads and the plurity of voltage leads has an inner lead tip located adjacent the die periphery, and wherein the voltage distribution ring is offset from each of the inner lead tips.