US5772451A — Sockets for electronic components and methods of …

Claim 1

Independent Claim 77 words

Socket for releasably connecting a first electronic component to a second electronic component, comprising: a plurality of resilient contact structures extending upward from a top surface of a support substrate; and a plurality of contact structures disposed on a bottom surface of the support substrate, selected ones of the contact structures are connected through the support substrate to selected ones of the resilient contact structures; wherein: at least a portion of the contact structures are solder balls.

Claim 2

Dependent Claim 77 words

Socket for releasably connecting a first electronic component to a second electronic component, comprising: a plurality of resilient contact structures extending upward from a top surface of a support substrate; and a plurality of contact structures disposed on a bottom surface of the support substrate, selected ones of the contact structures are connected through the support substrate to selected ones of the resilient contact structures; wherein: at least a portion of the contact structures are solder balls.

Claim 3

Dependent Claim 14 words

Socket, according to claim 1, wherein: the second electronic component is a circuit board.

Claim 4

Dependent Claim 19 words

Socket, according to claim 1, wherein: at least a portion of the resilient contact structures are composite interconnection elements.

Claim 5

Dependent Claim 19 words

Socket, according to claim 1, wherein: at least-a portion of the resilient contact structures are formed as cantilever beams.

Claim 6

Dependent Claim 19 words

Socket, according to claim 1, further comprising: a frame element disposed around a peripheral edge of the support substrate.

Claim 7

Dependent Claim 23 words

Socket, according to claim 5, further comprising: means for aligning the frame element in a prescribed positional relationship to the second electronic component.

Claim 8

Dependent Claim 33 words

Socket, according to claim 6, wherein: the second electronic component is a circuit board; and the means for aligning includes pins extending from the frame element and corresponding holes in the circuit board.

Claim 9

Dependent Claim 43 words

Socket, according to claim 1, wherein: each of the resilient contact structures has a tip; and further comprising: a stiffener element disposed above the support substrate having holes through which the tips of at least a portion of the resilient contact structures extend.

Claim 10

Dependent Claim 39 words

Socket, according to claim 1, wherein: each of the resilient contact structures has a tip; and further comprising: means for urging the first electronic component down onto the tips of at least a portion of the resilient contact structures.

Claim 11

Dependent Claim 24 words

Socket, according to claim 9, wherein the means for urging comprises a spring clip which extends across a top surface of the frame element.

Claim 12

Dependent Claim 52 words

Socket, according to claim 1, wherein: each of the resilient contact structures has a tip; and further comprising: means for urging selected ones of the tips against selected ones of a plurality of terminals of the electronic component in a direction which is generally normal to the top surface of the substrate.

Claim 13

Dependent Claim 106 words

Socket, according to claim 1, wherein: each of the resilient contact structures has a tip; and further comprising: means for urging selected ones of the tips against selected ones of a plurality of terminals of the electronic component in a first direction which is generally normal to the top surface of the support substrate, in response to which at least a portion of the tips deflect in the first direction to effect a pressure connection between the tips and the terminals and move in a second direction which is generally parallel to the top surface of the support substrate so as to wipe across the terminals.

Claim 14

Dependent Claim 52 words

Socket, according to claim 1, wherein: each of the resilient contact structures has a tip; and further comprising: means for urging selected ones of the tips against selected ones of a plurality of terminals of the electronic component in a direction which is generally parallel to the top surface of the substrate.

Claim 15

Dependent Claim 59 words

Socket, according to claim 23, further comprising: means for receiving the first electronic component on an upper surface thereof, and for permitting the resilient contact structures to make pressure contact with external connection points of the first electronic component, said means for receiving the first electronic component having a lower surface opposing the top surface of the support substrate.

Claim 16

Dependent Claim 18 words

Socket, according to claim 14, wherein: the means for receiving the first electronic component is a planar element.

Claim 17

Dependent Claim 25 words

Socket, according to claim 15, further comprising: a plurality of holes extending through the planar element, from the upper surface to the lower surface thereof.

Claim 18

Dependent Claim 35 words

Socket, according to claim 16, wherein: said holes are tapered and have a smaller dimension at the upper surface of the planar element and a larger dimension at the lower surface of the planar element.

Claim 19

Dependent Claim 41 words

Socket, according to claim 15, further comprising: means for moving the planar element in a direction parallel to the top surface of the support substrate to provide an effective pressure contact between the external connection points and the resilient contact structures.

Claim 20

Dependent Claim 23 words

Socket, according to claim 15, further comprising: means disposed on the upper surface of the planar element for retaining the first electronic component.

Claim 21

Dependent Claim 25 words

Socket, according to claim 19, wherein: the means for retaining comprises at least three pawls extending upward from the upper surface of the planar element.

Claim 22

Dependent Claim 74 words

Socket, according to claim 1, further comprising: a frame element disposed around the support substrate; a planar element disposed above the support substrate, and having at least one hole permitting tips of at least a portion of the resilient contact structures to pass through the planar element; a cam lever extending from a cavity in the frame element; and an offset portion of the cam lever extending through a hole in the planar element.

Claim 23

Dependent Claim 23 words

Socket, according to claim 21, further comprising: means for aligning the frame element in a prescribed positional relationship to the second electronic component.

Claim 24

Dependent Claim 33 words

Socket, according to claim 22, wherein: the second electronic component is a circuit board; and the means for aligning includes pins extending from the frame element and corresponding holes in the circuit board.

Claim 25

Dependent Claim 24 words

Socket, according to claim 21, further comprising: at least one recess on an inner surface of the frame element, slidably receiving the planar element.

Claim 26

Dependent Claim 19 words

Socket, according to claim 21, wherein: at least a portion of the resilient contact structures are composite interconnection elements.

Claim 27

Dependent Claim 27 words

Socket, according to claim 1, wherein: the first electronic component is selected from the group consisting of LGA-type semiconductor package, BGA-type semiconductor package and bare semiconductor die.

Claim 28

Dependent Claim 27 words

Socket, according to claim 1, wherein: the second electronic component is selected from the group consisting of LGA-type semiconductor package, BGA-type semiconductor package and bare semiconductor die.

Claim 29

Dependent Claim 193 words

Solder-down socket for releasably connecting an electronic component to a circuit board, comprising: a support substrate; a plurality of resilient contact structures extending upward from a top surface of the support substrate; and a plurality of solderable raised contact structures disposed on a bottom surface of the substrate, selected ones of said solderable raised contact structures being electrically connected to selected ones of the resilient contact structures; wherein: the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; selected ones of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the solderable raised contact structures are mounted to selected ones of the bottom contact areas; and interconnections between selected ones of the resilient contact structures and selected ones of the solderable raised contact structures comprise selected ones of the plated through holes.

Claim 30

Dependent Claim 193 words

Solder-down socket for releasably connecting an electronic component to a circuit board, comprising: a support substrate; a plurality of resilient contact structures extending upward from a top surface of the support substrate; and a plurality of solderable raised contact structures disposed on a bottom surface of the substrate, selected ones of said solderable raised contact structures being electrically connected to selected ones of the resilient contact structures; wherein: the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; selected ones of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the solderable raised contact structures are mounted to selected ones of the bottom contact areas; and interconnections between selected ones of the resilient contact structures and selected ones of the solderable raised contact structures comprise selected ones of the plated through holes.

Claim 31

Dependent Claim 25 words

Socket, according to claim 28, further comprising: means for urging an electronic component against tips of at least a portion of the resilient contact structures.

Claim 32

Dependent Claim 26 words

Socket, according to claim 29, wherein: the electronic component is selected from the group consisting of LGA-type semiconductor package, BGA-type semiconductor package and bare semiconductor die.

Claim 33

Dependent Claim 25 words

Socket, according to claim 28, wherein: at least a portion of the resilient contact structures are mounted to the top surface of the support substrate.

Claim 34

Dependent Claim 25 words

Socket, according to claim 28, wherein: end portions of at least a portion of the resilient contact structures extend at least into the support substrate.

Claim 35

Dependent Claim 24 words

Socket, according to claim 32, wherein: the end portions of at least a portion of the resilient contact structures extend through the support substrate.

Claim 36

Dependent Claim 24 words

Socket, according to claim 32, wherein: selected ones of the solderable raised contact structures are directly connected to ends of the resilient contact structures.

Claim 37

Dependent Claim 39 words

Socket, according to claim 32, further comprising: a plurality of plated through holes extending through the support substrate; wherein the end portions of selected ones of the resilient contact structures extend into selected ones of the plated through holes.

Claim 38

Dependent Claim 19 words

Solder-down socket, according to claim 28, wherein: at least a portion of the solderable contact structures are solder balls.

Claim 39

Dependent Claim 130 words

Solder-down socket, according to claim 28, wherein selected ones of the resilient contact structures each comprise: a core element of a material selected from the group consisting of gold, aluminum, copper, and their alloys; silver, palladium, platinum; metals of the platinum group of elements and their alloys; and solder constituted from lead, tin, indium, bismuth, cadmium, antimony, and their alloys; and the core element is overcoated with a shell having at least one layer of a material selected from the group consisting of nickel, and its alloys; copper, cobalt, iron, and their alloys; gold (especially hard gold); silver; elements of the platinum group; noble metals; semi-noble metals and their alloys, particularly elements of the platinum group and their alloys; tungsten and molybdenum; and tin, lead, bismuth, indium and their alloys.

Claim 40

Dependent Claim 37 words

Solder-down socket, according to claim 28, wherein: selected ones of the resilient contact structures each comprise a core of a material having a relatively low yield strength overcoated by a material having a relatively high yield strength.

Claim 41

Dependent Claim 180 words

Socket for releasably connecting an electronic component to a circuit board, comprising: a plurality of resilient contact structures extending upward from a top surface of a support substrate; a plurality of contact structures disposed on a bottom surface of the support substrate and connected through the support substrate to selected ones of the resilient contact structures; wherein: the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; at least a portion of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the contact structures are mounted to selected ones of the bottom contact areas; and at least a portion of the connections between the resilient contact structure and the contact structure comprises a portion of the plated through holes.

Claim 42

Dependent Claim 180 words

Socket for releasably connecting an electronic component to a circuit board, comprising: a plurality of resilient contact structures extending upward from a top surface of a support substrate; a plurality of contact structures disposed on a bottom surface of the support substrate and connected through the support substrate to selected ones of the resilient contact structures; wherein: the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; at least a portion of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the contact structures are mounted to selected ones of the bottom contact areas; and at least a portion of the connections between the resilient contact structure and the contact structure comprises a portion of the plated through holes.

Claim 43

Dependent Claim 14 words

Socket, according to claim 39, wherein: the resilient contact structures are composite interconnection elements.

Claim 44

Dependent Claim 19 words

Socket, according to claim 39, further comprising: a frame element disposed around a peripheral edge of the support substrate.

Claim 45

Dependent Claim 22 words

Socket, according to claim 41, further comprising: means for aligning the frame element in a prescribed positional relationship to the circuit board.

Claim 46

Dependent Claim 24 words

Socket, according to claim 42, wherein the means for aligning includes pins extending from the frame element and corresponding holes in the circuit board.

Claim 47

Dependent Claim 20 words

Socket, according to claim 39, wherein: at least a portion of the resilient contact structures are formed as cantilever beams.

Claim 48

Dependent Claim 17 words

Socket, according to claim 39, wherein: at least a portion of the contact structures are solder balls.

Claim 49

Dependent Claim 43 words

Socket, according to claim 39, wherein: each of the resilient contact structures has a tip; and further comprising: a stiffener element disposed above the support substrate having holes through which the tips of at least a portion of the resilient contact structures extend.

Claim 50

Dependent Claim 27 words

Socket, according to claim 39, further comprising: means for urging the electronic component down onto the tips of at least a portion of the resilient contact structures.

Claim 51

Dependent Claim 24 words

Socket, according to claim 47, wherein the means for urging includes a spring clip which extends across a top surface of the frame element.

Claim 52

Dependent Claim 52 words

Socket, according to claim 39, wherein: each of the resilient contact structures has a tip; and further comprising: means for urging selected ones of the tips against selected ones of a plurality of terminals of the electronic component in a direction which is generally normal to the top surface of the substrate.

Claim 53

Dependent Claim 106 words

Socket, according to claim 39, wherein: each of the resilient contact structures has a tip; and further comprising: means for urging selected ones of the tips against selected ones of a plurality of terminals of the electronic component in a first direction which is generally normal to the top surface of the support substrate, in response to which at least a portion of the tips deflect in the first direction to effect a pressure connection between the tips and the terminals and move in a second direction which is generally parallel to the top surface of the support substrate so as to wipe across the terminals.

Claim 54

Dependent Claim 52 words

Socket, according to claim 39, wherein: each of the resilient contact structures has a tip; and further comprising: means for urging selected ones of the tips against selected ones of a plurality of terminals of the electronic component in a direction which is generally parallel to the top surface of the substrate.

Claim 55

Dependent Claim 57 words

Socket, according to claim 39, further comprising: means for receiving the electronic component on an upper surface thereof, and for permitting the resilient contact structures to make pressure contact with the external connection points of the electronic component, said means for receiving the electronic component having a lower surface opposing the top surface of the support substrate.

Claim 56

Dependent Claim 17 words

Socket, according to claim 52, wherein the means for receiving the electronic component is a planar element.

Claim 57

Dependent Claim 25 words

Socket, according to claim 53, further comprising: a plurality of holes extending through the planar element, from the upper surface to the lower surface thereof.

Claim 58

Dependent Claim 35 words

Socket, according to claim 54, wherein: said holes are tapered and have a smaller dimension at the upper surface of the planar element and a larger dimension at the lower surface of the planar element.

Claim 59

Dependent Claim 41 words

Socket, according to claim 53, further comprising: means for moving the planar element in a direction parallel to the top surface of the support substrate to provide an effective pressure contact between the external connection points and the resilient contact structures.

Claim 60

Dependent Claim 22 words

Socket, according to claim 52, further comprising: means disposed on the upper surface of the planar element for retaining the electronic component.

Claim 61

Dependent Claim 25 words

Socket, according to claim 57, wherein: the means for retaining is at least three pawls extending upward from the upper surface of the planar element.

Claim 62

Dependent Claim 76 words

Socket, according to claim 39, further comprising: a frame element disposed around the support substrate; a planar element disposed above the support substrate, and having at least one hole permitting the tips of at least a portion of the resilient contact structures to pass through the planar element; and a cam lever extending from a cavity in the frame element; and an offset portion of the cam lever extending through a hole in the planar element.

Claim 63

Dependent Claim 24 words

Socket, according to claim 59, further comprising: at least one recess on an inner surface of the frame element, slidably receiving the planar element.

Claim 64

Dependent Claim 14 words

Socket, according to claim 59, wherein: the resilient contact structures are composite interconnection elements.

Claim 65

Dependent Claim 12 words

Socket, according to claim 59, wherein: the contact structures are solder balls.

Claim 66

Dependent Claim 26 words

Socket, according to claim 39, wherein: the electronic component is selected from the group consisting of LGA-type semiconductor package, BGA-type semiconductor package and bare semiconductor die.

Claim 67

Dependent Claim 129 words

Socket, according to claim 39, wherein selected ones of the resilient contact structures each comprise: a core element of a material selected from the group consisting of gold, aluminum, copper, and their alloys; silver, palladium, platinum; metals of the platinum group of elements and their alloys; and solder constituted from lead, tin, indium, bismuth, cadmium, antimony, and their alloys; and the core element is overcoated with a shell having at least one layer of a material selected from the group consisting of nickel, and its alloys; copper, cobalt, iron, and their alloys; gold (especially hard gold); silver; elements of the platinum group; noble metals; semi-noble metals and their alloys, particularly elements of the platinum group and their alloys; tungsten and molybdenum; and tin, lead, bismuth, indium and their alloys.

Claim 68

Dependent Claim 36 words

Socket, according to claim 39, wherein: selected ones of the resilient contact structures each comprise a core of a material having a relatively low yield strength overcoated by a material having a relatively high yield strength.

Claim 69

Dependent Claim 190 words

Solder-down socket for making pressure connections from a plurality of terminals of a first electronic component to a second electronic component, comprising: a substrate having a top surface and a bottom surface; a plurality of resilient contact structures extending from the top surface of the substrate, each resilient contact structure having a tip at a free end thereof; and means for effecting pressure connection between selected ones of the tips of at least a portion of the resilient contact structures and selected ones of the terminals of the first electronic component; wherein: the substrate comprises a plurality of plated through holes extending through the substrate from the top surface to the bottom surface of the substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the substrate and a bottom contact area exposed on the bottom surface of the substrate; and selected ones of the resilient contact structures mounted to selected ones of the top contact areas; and further comprising a plurality of contact structures, selected ones of the contact structures mounted on selected ones of the bottom contact areas.

Claim 70

Dependent Claim 190 words

Solder-down socket for making pressure connections from a plurality of terminals of a first electronic component to a second electronic component, comprising: a substrate having a top surface and a bottom surface; a plurality of resilient contact structures extending from the top surface of the substrate, each resilient contact structure having a tip at a free end thereof; and means for effecting pressure connection between selected ones of the tips of at least a portion of the resilient contact structures and selected ones of the terminals of the first electronic component; wherein: the substrate comprises a plurality of plated through holes extending through the substrate from the top surface to the bottom surface of the substrate; each of selected ones of the through holes comprise a top contact area exposed on the top surface of the substrate and a bottom contact area exposed on the bottom surface of the substrate; and selected ones of the resilient contact structures mounted to selected ones of the top contact areas; and further comprising a plurality of contact structures, selected ones of the contact structures mounted on selected ones of the bottom contact areas.

Claim 71

Dependent Claim 66 words

Solder-down socket, according to claim 65, wherein: the first electronic component has a plurality of terminals; a plurality of resilient contact structures extend upward from the top surface of the substrate; and a plurality of pressure connections are effected between selected ones of the tips of at least a portion of the resilient contact structures and selected ones of the terminals of the first electronic component.

Claim 72

Dependent Claim 49 words

Solder-down socket, according to claim 67, further comprising: a plurality of solderable raised contact structures disposed on the bottom surface of the support substrate; wherein; selected ones of the solderable raised contact structures are connected via the support substrate to selected ones of the plurality of resilient contact structures.

Claim 73

Dependent Claim 15 words

Solder-down socket, according to claim 68, wherein: the solderable raised contact structures are solder balls.

Claim 74

Dependent Claim 35 words

Solder-down socket, according to claim 67, wherein: the means for effecting a pressure connection moves the terminals of the first electronic component against the tips of at least a portion of the resilient contact structures.

Claim 75

Dependent Claim 35 words

Solder-down socket, according to claim 67, wherein: the means for effecting a pressure connection moves the tips of at least a portion of the resilient contact structures against the terminals of the first electronic component.

Claim 76

Dependent Claim 33 words

Solder-down socket, according to claim 67, further comprising: means for limiting wiping of the tips of at least a portion of the resilient contact structures across the terminals of the first electronic component.

Claim 77

Dependent Claim 16 words

Solder-down socket, according to claim 66, wherein: the first electronic component is a bare semiconductor die.

Claim 78

Dependent Claim 16 words

Solder-down socket, according to claim 66, wherein: the second electronic component is a bare semiconductor die.

Claim 79

Dependent Claim 130 words

Solder-down socket, according to claim 66, wherein selected ones of the resilient contact structures each comprise: a core element of a material selected from the group consisting of gold, aluminum, copper, and their alloys; silver, palladium, platinum; metals of the platinum group of elements and their alloys; and solder constituted from lead, tin, indium, bismuth, cadmium, antimony, and their alloys; and the core element is overcoated with a shell having at least one layer of a material selected from the group consisting of nickel, and its alloys; copper, cobalt, iron, and their alloys; gold (especially hard gold); silver; elements of the platinum group; noble metals; semi-noble metals and their alloys, particularly elements of the platinum group and their alloys; tungsten and molybdenum; and tin, lead, bismuth, indium and their alloys.

Claim 80

Dependent Claim 37 words

Solder-down socket, according to claim 66, wherein: selected ones of the resilient contact structures each comprise a core of a material having a relatively low yield strength overcoated by a material having a relatively high yield strength.

Claim 81

Dependent Claim 176 words

Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising: disposing a support substrate between the electronic component and the circuit board, the support substrate having a top surface and a bottom surface opposite the top surface; mounting a plurality of resilient contact structures to the top surface of the support substrate; mounting a plurality of contact structures to the bottom surface of the support substrate; mounting the support substrate to the circuit board so as to make permanent electrical connections between selected ones of the contact structures and selected ones of the contact areas; urging the electronic component against the resilient contact structure so that a removable connection is made between selected ones of the terminals and selected ones of the resilient contact structures; and within the support substrate, interconnecting selected ones of the resilient contact structures with selected ones of the contact structures; and forming the contact structures as solder balls.

Claim 82

Dependent Claim 176 words

Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising: disposing a support substrate between the electronic component and the circuit board, the support substrate having a top surface and a bottom surface opposite the top surface; mounting a plurality of resilient contact structures to the top surface of the support substrate; mounting a plurality of contact structures to the bottom surface of the support substrate; mounting the support substrate to the circuit board so as to make permanent electrical connections between selected ones of the contact structures and selected ones of the contact areas; urging the electronic component against the resilient contact structure so that a removable connection is made between selected ones of the terminals and selected ones of the resilient contact structures; and within the support substrate, interconnecting selected ones of the resilient contact structures with selected ones of the contact structures; and forming the contact structures as solder balls.

Claim 83

Dependent Claim 21 words

Method, according to claim 77, further comprising: fabricating at least a portion of the resilient contact structures as composite interconnection elements.

Claim 84

Dependent Claim 15 words

Method, according to claim 77, further comprising: soldering the contact structures to the contact areas.

Claim 85

Dependent Claim 26 words

Method, according to claim 77, wherein: the electronic component is selected from the group consisting of LGA-type semiconductor package, BGA-type semiconductor package and bare semiconductor die.

Claim 86

Dependent Claim 53 words

Method, according to claim 77, wherein. each of the resilient contact structures has a tip; and at least a portion of the terminals are urged against the tips of at least p portion of the resilient contact structures in a direction which is generally normal to the top surface of the support substrate.

Claim 87

Dependent Claim 98 words

Method, according to claim 77, wherein: each of the resilient contact structures has a tip; and when the terminals are urged against the tips of at least a portion of the resilient contact structures in a first direction which is generally normal to the top surface of the support substrate, at least a portion of the tips deflect in the first direction to effect a pressure connection between the tips and the terminals and move in a second direction which is generally parallel to the top surface of the support substrate so as to wipe across the pads.

Claim 88

Dependent Claim 47 words

Method, according to claim 77, wherein: each of the resilient contact structures has a tip; and the terminals are urged against tips of at least a portion of the resilient contact structures in a direction which is generally parallel to the top surface of the support substrate.

Claim 89

Dependent Claim 288 words

Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising: disposing a support substrate between the electronic component and the circuit board, the support substrate having a top surface and a bottom surface opposite the top surface; mounting a plurality of resilient contact structures to the top surface of the support substrate; mounting a plurality of contact structures to the bottom surface of the support substrate; mounting the support substrate to the circuit board so as to make permanent electrical connections between selected ones of the contact structure& and selected ones of the contact areas; urging the electronic component against the resilient contact structure so that a removable connection is made between selected ones of the terminal& and selected ones of the resilient contact structures; and within the support substrate, interconnecting the selected ones of the resilient contact structures with selected ones of the contact structures; wherein: the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each through hole comprises a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; selected ones of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the contact structures are mounted to selected ones of the bottom contact areas; and at least a portion of the interconnections between the resilient contact structures and the contact structures comprises at least a portion of the plated through holes.

Claim 90

Dependent Claim 288 words

Method of removably connecting an electronic component to a circuit board, said circuit board having a plurality of contact areas on a surface thereof, said electronic component having a plurality of terminals, comprising: disposing a support substrate between the electronic component and the circuit board, the support substrate having a top surface and a bottom surface opposite the top surface; mounting a plurality of resilient contact structures to the top surface of the support substrate; mounting a plurality of contact structures to the bottom surface of the support substrate; mounting the support substrate to the circuit board so as to make permanent electrical connections between selected ones of the contact structure& and selected ones of the contact areas; urging the electronic component against the resilient contact structure so that a removable connection is made between selected ones of the terminal& and selected ones of the resilient contact structures; and within the support substrate, interconnecting the selected ones of the resilient contact structures with selected ones of the contact structures; wherein: the support substrate comprises a plurality of plated through holes extending through the support substrate from the top surface to the bottom surface of the support substrate; each through hole comprises a top contact area exposed on the top surface of the support substrate and a bottom contact area exposed on the bottom surface of the support substrate; selected ones of the resilient contact structures are mounted to selected ones of the top contact areas; selected ones of the contact structures are mounted to selected ones of the bottom contact areas; and at least a portion of the interconnections between the resilient contact structures and the contact structures comprises at least a portion of the plated through holes.

Claim 91

Dependent Claim 21 words

Method, according to claim 84, further comprising: fabricating at least a portion of the resilient contact structures as composite interconnection elements.

Claim 92

Dependent Claim 19 words

Method, according to claim 84, further comprising: forming at least a portion of the contact structures as solder balls.

Claim 93

Dependent Claim 15 words

Method, according to claim 84, further comprising: soldering the contact structures to the contact areas.

Claim 94

Dependent Claim 26 words

Method, according to claim 84, wherein: the electronic component is selected from the group consisting of LGA-type semiconductor package, BGA-type semiconductor package and bare semiconductor die.

Claim 95

Dependent Claim 48 words

Method, according to claim 84, wherein: each of the resilient contact structures has a tip; and the terminals are urged against the tips of at least a portion of the resilient contact structures in a direction which is generally normal to the top surface of the support substrate.

Claim 96

Dependent Claim 98 words

Method, according to claim 84, wherein: each of the resilient contact structures has a tip; and when the terminals are urged against the tips of at least a portion of the resilient contact structures in a first direction which is generally normal to the top surface of the support substrate, at least a portion of the tips deflect in the first direction to effect a pressure connection between the tips and the terminals and move in a second direction which is generally parallel to the top surface of the support substrate so as to wipe across the terminals.

Claim 97

Dependent Claim 47 words

Method, according to claim 84, wherein: each of the resilient contact structures has a tip; and the terminals are urged against tips of at least a portion of the resilient contact structures in a direction which is generally parallel to the top surface of the support substrate.

Claim 98

Dependent Claim 16 words

Solder-down socket, according to claim 66, wherein: the first electronic component is a bare semiconductor die.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2001-06-29	2001-12-29	2002-06-30	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2005-06-29	2005-12-29	2006-06-30	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2009-06-29	2009-12-29	2010-06-30	$7700.00	Window Closed / Lapsed

Sockets for electronic components and methods of connecting to electronic components

Abstract

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