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US5098305A Expired / Lapsed US ⏱️ 0.0 years remaining

Memory metal electrical connector

Assignee: Cray Inc
•
Filing: 1989-03-17
•
Granted: 1992-03-24
•
Expires: 2009-03-17
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Abstract

Abstract A method and apparatus for interconnecting circuit board assemblies using memory metal wires mechanically inserted into through-plated holes. The invention has its application in the interconnection of stacked circuit board assemblies where kinked memory metal wires are stretched so the wires are substantially straight; inserted into axially aligned through-plated holes of circuit boards; and released so that the memory metal wires reform their original kinked shaped within the through-plated holes, forming an electrical connection between the circuit boards. Memory metal alloys are used in the construction of the kinked memory metal wires to take advantage of the pseudoelastic behavior of the alloys in the austenitic phase below the forming temperature range.

Inventors

  • 👤 Nicholas J. Krajewski
  • 👤 David J. Johnson
  • 👤 Arthur O. Kunstmann

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 14:38
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; C; C22; C22F; C22F1/00; C22F1/006; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H01R12/523; H01R4/00; H01R4/01; H05; H05K; H05K3/00; H05K3/30; H05K3/306; H05K3/308; H05K3/32; H05K3/328; H05K3/36; H10W70/00; H10W70/099; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/10; H05K2201/10431; H05K2201/1059; H05K2201/10613; H05K2201/10742; H05K2201/1075; H05K2201/10818; H05K2201/10825; H05K2201/10886; H05K2201/10909; H05K2201/10946; H05K2203/00; H05K2203/04; H05K2203/0495; H05K3/368; H10W46/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/015; H10W72/01551; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07178; H10W72/075; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/07551; H10W72/07554; H10W72/251; H10W72/252; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/941; H10W72/944; H10W72/9445; H10W90/00; H10W90/20; H10W90/284; H10W90/288; H10W90/297; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126

Claims Analysis

Total Claims: 73
Claim 1
Independent Claim 66 words
An electrical connector for use in forming an electrical connection between through-plated holes of a plurality of electronic circuit assemblies comprising a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and adapted for making electrical contact within the through-plated holes.
Claim 2
Dependent Claim 66 words
An electrical connector for use in forming an electrical connection between through-plated holes of a plurality of electronic circuit assemblies comprising a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and adapted for making electrical contact within the through-plated holes.
Claim 3
Dependent Claim 80 words
An electrical connector for use in forming an electrical connection between through-plated holes of a plurality of electronic circuit assemblies comprising a memory metal wire formed substantially of metal having a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and adapted for making electrical contact within the through-plated holes, wherein said memory metal wire is comprised of an alloy exhibiting martensitic transformation behavior.
Claim 4
Dependent Claim 80 words
An electrical connector for use in forming an electrical connection between through-plated holes of a plurality of electronic circuit assemblies comprising a memory metal wire formed substantially of metal having a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and adapted for making electrical contact within the through-plated holes, wherein said memory metal wire is comprised of an alloy exhibiting martensitic transformation behavior.
Claim 5
Dependent Claim 13 words
The connector according to claim 2 wherein said martensitic transformation behavior is stress-induced.
Claim 6
Dependent Claim 14 words
The connector according to claim 2 wherein said martensitic transformation behavior is temperature induced.
Claim 7
Dependent Claim 80 words
An electrical connector for use in forming an electrical connection between through-plated holes of a plurality of electronic circuit assemblies comprising a memory metal wire formed substantially of metal having a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and adapted for making electrical contact within the through-plated holes, wherein said memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior.
Claim 8
Dependent Claim 80 words
An electrical connector for use in forming an electrical connection between through-plated holes of a plurality of electronic circuit assemblies comprising a memory metal wire formed substantially of metal having a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and adapted for making electrical contact within the through-plated holes, wherein said memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior.
Claim 9
Dependent Claim 22 words
The connector according to claim 2 wherein said memory metal wire is comprised of an alloy containing at least nickel and titanium.
Claim 10
Dependent Claim 22 words
The connector according to claim 5 wherein said memory metal wire is comprised of an alloy containing at least nickel and titanium.
Claim 11
Dependent Claim 50 words
The connector according to claim 2 wherein said memory metal wire is comprised of an alloy selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 12
Dependent Claim 50 words
The connector according to claim 5 wherein said memory metal wire is comprised of an alloy selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 13
Dependent Claim 18 words
The connector according to claim 1 wherein said plurality of off-axis displacements are formed in a kinked shape.
Claim 14
Dependent Claim 19 words
The connector according to claim 1 wherein said plurality of off-axis displacements are formed in a substantially sinusoidal shape.
Claim 15
Dependent Claim 32 words
The connector according to claim 1 wherein said memory metal wire further comprises a substantially straight section along the longitudinal axis followed by a substantially sinusoidal shaped section along the longitudinal axis.
Claim 16
Dependent Claim 33 words
The connector according to claim 12 wherein said memory metal wire further comprises alternating sections of substantially straight sections along the longitudinal axis followed by substantially sinusoidal shaped sections along the longitudinal axis.
Claim 17
Dependent Claim 15 words
The connector according to claim 2 having a transformation temperature range below 60 degrees Fahrenheit.
Claim 18
Dependent Claim 61 words
An electrical connector comprising a plurality of electronic circuit assemblies each having a through-plated hole and an irregularly-shaped memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and placed within said through-plate hole of each assembly.
Claim 19
Dependent Claim 61 words
An electrical connector comprising a plurality of electronic circuit assemblies each having a through-plated hole and an irregularly-shaped memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and placed within said through-plate hole of each assembly.
Claim 20
Dependent Claim 76 words
An electrical connector comprising a plurality of electronic circuit assemblies each having a through-plated hole and an irregularly-shaped memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and placed within said through-plated hole of each assembly, wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting martensitic transformation behavior.
Claim 21
Dependent Claim 76 words
An electrical connector comprising a plurality of electronic circuit assemblies each having a through-plated hole and an irregularly-shaped memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and placed within said through-plated hole of each assembly, wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting martensitic transformation behavior.
Claim 22
Dependent Claim 13 words
The connector according to claim 16 wherein said martensitic transformation behavior is stress-induced.
Claim 23
Dependent Claim 14 words
The connector according to claim 16 wherein said martensitic transformation behavior is temperature induced.
Claim 24
Dependent Claim 76 words
An electrical connector comprising a plurality of electronic circuit assemblies each having a through-plated hole and an irregularly-shaped memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and placed within said through-plated hole of each assembly, wherein said shaped memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior.
Claim 25
Dependent Claim 76 words
An electrical connector comprising a plurality of electronic circuit assemblies each having a through-plated hole and an irregularly-shaped memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire and placed within said through-plated hole of each assembly, wherein said shaped memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior.
Claim 26
Dependent Claim 23 words
The connector according to claim 16 wherein said irregularly-shaped memory metal wire is comprised of an alloy containing at least nickel and titanium.
Claim 27
Dependent Claim 23 words
The connector according to claim 19 wherein said irregularly-shaped memory metal wire is comprised of an alloy containing at least nickel and titanium.
Claim 28
Dependent Claim 51 words
The connector according to claim 16 wherein said irregularly-shaped memory metal wire is comprised of an alloy selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 29
Dependent Claim 51 words
The connector according to claim 19 wherein said irregularly-shaped memory metal wire is comprised of an alloy selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 30
Dependent Claim 18 words
The connector according to claim 15 wherein said irregularly-shaped memory metal wire is formed in a kinked shape.
Claim 31
Dependent Claim 18 words
The connector according to claim 15 wherein said irregularly-shaped memory metal wire is formed in a sinusoidal shape.
Claim 32
Dependent Claim 24 words
The connector according to claim 15 wherein said irregularly-shaped memory metal wire further comprises a substantially straight section followed by a sinusoidal shaped section.
Claim 33
Dependent Claim 15 words
The connector according to claim 16 having a transformation temperature range below 60 degrees Fahrenheit.
Claim 34
Independent Claim 67 words
A method electrically connecting electronic circuit assemblies comprising the steps of: (a) axially aligning through-plated holes of two or more circuit boards; (b) cooling an irregularly-shaped memory metal wire below its transformation temperature range; (c) stretching the memory metal wire linearly to remove the shape; (d) inserting the memory metal wire into the through-plated holes; and (e) warming memory metal wire such that it regains its shape.
Claim 35
Independent Claim 67 words
A method electrically connecting electronic circuit assemblies comprising the steps of: (a) axially aligning through-plated holes of two or more circuit boards; (b) cooling an irregularly-shaped memory metal wire below its transformation temperature range; (c) stretching the memory metal wire linearly to remove the shape; (d) inserting the memory metal wire into the through-plated holes; and (e) warming memory metal wire such that it regains its shape.
Claim 36
Independent Claim 124 words
A method of electrically connecting two or more circuit boards comprising the steps of: (a) manufacturing the circuit boards with plated holes having hole patterns substantially matching and axially aligned; (b) positioning the circuit boards so that their planar surfaces are substantially parallel; (c) cooling a kinked shape-memory metal wire; (d) stretching the kinked shape-memory metal wire so that the wire is substantially straight; (e) inserting the memory metal wire into one of the axially aligned through-plated holes of the circuit boards; and (f) warming the memory metal wire so that the wire reforms to its kinked shape and so that the wire contacts the interior surfaces of the through-plated holes of the circuit boards and form an electrical connection between the circuit boards.
Claim 37
Independent Claim 124 words
A method of electrically connecting two or more circuit boards comprising the steps of: (a) manufacturing the circuit boards with plated holes having hole patterns substantially matching and axially aligned; (b) positioning the circuit boards so that their planar surfaces are substantially parallel; (c) cooling a kinked shape-memory metal wire; (d) stretching the kinked shape-memory metal wire so that the wire is substantially straight; (e) inserting the memory metal wire into one of the axially aligned through-plated holes of the circuit boards; and (f) warming the memory metal wire so that the wire reforms to its kinked shape and so that the wire contacts the interior surfaces of the through-plated holes of the circuit boards and form an electrical connection between the circuit boards.
Claim 38
Dependent Claim 88 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire, and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards.
Claim 39
Dependent Claim 88 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire, and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards.
Claim 40
Dependent Claim 104 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire, and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards, wherein said memory metal wire is comprised of an alloy exhibiting a temperature-induced martensitic transformation behavior.
Claim 41
Dependent Claim 104 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire, and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards, wherein said memory metal wire is comprised of an alloy exhibiting a temperature-induced martensitic transformation behavior.
Claim 42
Dependent Claim 22 words
The apparatus according to claim 31 wherein said memory metal wire is comprised of an alloy containing at least nickel and titanium.
Claim 43
Dependent Claim 108 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire; and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards, wherein said memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior containing at least nickel and titanium.
Claim 44
Dependent Claim 108 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire; and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards, wherein said memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior containing at least nickel and titanium.
Claim 45
Dependent Claim 50 words
The apparatus according to claim 31 wherein said memory metal wire is comprised of an alloy selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 46
Dependent Claim 135 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire; and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards, wherein said memory metal wire is comprised an alloy exhibiting a pseudoelastic behavior selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 47
Dependent Claim 135 words
An interconnection apparatus comprising a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and a memory metal wire formed substantially of metal exhibiting a shape-memory effect having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire; and said memory metal wire being cooled, being mechanically stretched, being inserted, being released and being warmed within said axially aligned through-plated holes of the circuit boards, wherein said memory metal wire is comprised an alloy exhibiting a pseudoelastic behavior selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 48
Dependent Claim 17 words
The apparatus according to claim 30 wherein said memory metal wire is formed in a kinked shape.
Claim 49
Dependent Claim 17 words
The apparatus according to claim 30 wherein said memory metal wire is formed in a sinusoidal shape.
Claim 50
Dependent Claim 23 words
The apparatus according to claim 30 wherein said memory metal wire further comprises a substantially straight section followed by a sinusoidal shaped section.
Claim 51
Dependent Claim 15 words
The apparatus according to claim 31 having a transformation temperature range below 60 degrees Fahrenheit.
Claim 52
Independent Claim 173 words
A method of electrically connecting an interconnection apparatus, said apparatus comprising; a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and an irregularly-shaped memory metal wire having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire mechanically inserted within said axially aligned through-plated holes of the circuit boards; said method comprising the steps of: (a) cooling the memory metal wire; (b) inserting a leader section of the memory metal wire into the axially aligned through-plated holes of the circuit boards; (c) stretching the memory metal wire so that the wire is substantially straightened and the shape is removed; (d) further inserting the memory metal wire into the axially aligned through-plated holes of the circuit boards; and (e) warming the memory metal wire so that the wire substantially regains its shape and contacts the interior surfaces of the through-plated holes and forms an electrical connection between the circuit boards.
Claim 53
Independent Claim 173 words
A method of electrically connecting an interconnection apparatus, said apparatus comprising; a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; and an irregularly-shaped memory metal wire having a generally linear shape along a longitudinal axis including a plurality of off-axis displacements formed as a continuous part of said wire mechanically inserted within said axially aligned through-plated holes of the circuit boards; said method comprising the steps of: (a) cooling the memory metal wire; (b) inserting a leader section of the memory metal wire into the axially aligned through-plated holes of the circuit boards; (c) stretching the memory metal wire so that the wire is substantially straightened and the shape is removed; (d) further inserting the memory metal wire into the axially aligned through-plated holes of the circuit boards; and (e) warming the memory metal wire so that the wire substantially regains its shape and contacts the interior surfaces of the through-plated holes and forms an electrical connection between the circuit boards.
Claim 54
Dependent Claim 23 words
The apparatus according to claim 40 wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting a temperature-induced martensitic transformation behavior.
Claim 55
Dependent Claim 23 words
The apparatus according to claim 41 wherein said irregularly-shaped memory metal wire is comprised of an alloy containing at least nickel and titanium.
Claim 56
Dependent Claim 27 words
The apparatus according to claim 40 wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior containing at least nickel and titanium.
Claim 57
Dependent Claim 51 words
The apparatus according to claim 41 wherein said irregularly-shaped memory metal wire is comprised of an alloy selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 58
Dependent Claim 55 words
The apparatus according to claim 40 wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 59
Dependent Claim 18 words
The apparatus according to claim 40 wherein said irregularly-shaped memory metal wire is formed in a kinked shape.
Claim 60
Dependent Claim 18 words
The apparatus according to claim 40 wherein said irregularly-shaped memory metal wire is formed in a sinusoidal shape.
Claim 61
Dependent Claim 25 words
The apparatus according to claim 40 wherein said irregularly-shaped memory metal wire further comprises a substantially straight section followed by a substantially sinusoidal shaped section.
Claim 62
Dependent Claim 15 words
The apparatus according to claim 41 having a transformation temperature range below 60 degrees Fahrenheit.
Claim 63
Independent Claim 112 words
A method of electrically connecting an interconnection apparatus between a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; said apparatus comprising: an irregularly-shaped memory metal wire mechanically inserted within said axially aligned through-plated holes of the circuit boards; said method comprising the steps of: (a) axially aligning the through-plated holes of the circuit boards; (b) cooling the irregularly-shaped memory metal wire below its transformation temperature range; (c) stretching the memory metal wire linearly to remove the shape; (d) inserting the memory metal wire into the through-plated holes; and (e) warming the memory metal wire such that it regains its shape.
Claim 64
Independent Claim 112 words
A method of electrically connecting an interconnection apparatus between a plurality of circuit boards having at least one through-plated hole on each circuit board and axially aligned with one another; said apparatus comprising: an irregularly-shaped memory metal wire mechanically inserted within said axially aligned through-plated holes of the circuit boards; said method comprising the steps of: (a) axially aligning the through-plated holes of the circuit boards; (b) cooling the irregularly-shaped memory metal wire below its transformation temperature range; (c) stretching the memory metal wire linearly to remove the shape; (d) inserting the memory metal wire into the through-plated holes; and (e) warming the memory metal wire such that it regains its shape.
Claim 65
Dependent Claim 23 words
The apparatus according to claim 50 wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting a temperature-induced martensitic transformation behavior.
Claim 66
Dependent Claim 23 words
The apparatus according to claim 51 wherein said irregularly-shaped memory metal wire is comprised of an alloy containing at least nickel and titanium.
Claim 67
Dependent Claim 27 words
The apparatus according to claim 50 wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior containing at least nickel and titanium.
Claim 68
Dependent Claim 51 words
The apparatus according to claim 51 wherein said irregularly-shaped memory metal wire is comprised of an alloy selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Cu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 69
Dependent Claim 55 words
The apparatus according to claim 50 wherein said irregularly-shaped memory metal wire is comprised of an alloy exhibiting a pseudoelastic behavior selected from the group consisting of Ag-Zn, Au-Cd, Au-Cu-Zn, Cu-Al, Cu-Al-Ni, Cu-Au-Zn, Cu-Sn, Cu-Zn, Cu-Zn-Al, Cu-Zn-Ga, Gu-Zn-Si, Cu-Zn-Sn, Fe-Pt, In-Tl, Ni-Al, Ni-Ti, Ni-Ti-X (where X is a ternary element), Ti-Co-Ni, Ti-Cu-Ni, and mixtures thereof.
Claim 70
Dependent Claim 18 words
The apparatus according to claim 50 wherein said irregularly-shaped memory metal wire is formed in a kinked shape.
Claim 71
Dependent Claim 18 words
The apparatus according to claim 50 wherein said irregularly-shaped memory metal wire is formed in a sinusoidal shape.
Claim 72
Dependent Claim 25 words
The apparatus according to claim 50 wherein said irregularly-shaped memory metal wire further comprises a substantially straight section followed by a substantially sinusoidal shaped section.
Claim 73
Dependent Claim 15 words
The apparatus according to claim 51 having a transformation temperature range below 60 degrees Fahrenheit.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-03-24 1995-09-23 1996-03-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-03-24 1999-09-23 2000-03-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-03-24 2003-09-23 2004-03-24 $7700.00 Window Closed / Lapsed

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