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JPS6049656A Expired / Lapsed JP ⏱️ 0.0 years remaining

High density plane mutually connected integrated circuit package

Assignee: International Business Machines Corp
•
Filing: 1984-05-16
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Granted: —
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Expires: 2004-05-16
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Abstract

Abstract Translated from Japanese (57)【要約】本公報は電子出願前の出願データであるた め要約のデータは記録されません。 (57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Inventors

  • 👤 ロバート・バブカ
  • 👤 ジヨン・ローレンス・ピーチヨタ
  • 👤 レオナード・ジヨン・ポチ

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-29 06:44
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1061; H05K7/1069; H05K3/00; H05K3/30; H05K3/32; H05K3/325; H01; H01R; H01R12/00; H01R12/70; H01R12/7076; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10613; H05K2201/10621; H05K2201/10719; Y; Y02; Y02P; Y02P70/00; Y02P70/50

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

JPS4941877A Cited
JPS5783679U Cited

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