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US5770877A Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor memory device and method for fabricating the same

Assignee: SK Hynix Inc
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Filing: 1996-04-15
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Granted: 1998-06-23
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Expires: 2016-04-15
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Abstract

Abstract A semiconductor memory device includes a semiconductor substrate of a first conductivity-type, a first electrode formed on the semiconductor substrate for charging/discharging charges, a second electrode formed on the first electrode for controlling charging/discharging and data reading/writing of the first electrode, and a charge input/output stage formed on the semiconductor substrate on at least one side of the second electrode for supplying charges.

Inventors

  • 👤 Keun Hyung Park

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 21:04
CPC Classifications
H; H10; H10B; H10B69/00; H10B41/00; H10B41/30; G; G11; G11C; G11C16/00; G11C16/02; G11C16/04; G11C16/0408; G11C16/0416; H10D; H10D30/00; H10D30/60; H10D30/68; H10D30/681; H10D30/683; H10D30/701

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 195 words
A semiconductor memory device comprising; a semiconductor substrate of a first conductivity-type having a field region; a field insulating layer formed on the field region so that a plurality of active regions are formed in one direction at predetermined intervals; a plurality of charge input/output stages formed on the semiconductor substrate of the active regions at predetermined intervals; a tunnelling dielectric layer formed on the semiconductor substrate, the tunnelling dielectric layer having a contact hole in the charge input/output stage; a plurality of floating gates formed in a matrix arrangement on the tunnelling dielectric layer above the active regions between the charge input/output stages; a ferroelectric layer formed on the surface of the semiconductor substrate including the floating gates, the ferroelectric layer having a contact hole at the charge input/output stage; a plurality of wordlines each formed on the ferroelectric layer above the floating gates perpendicular to the active regions; an interlevel insulating layer formed on the wordlines, the interlevel insulating layer having a contact hole in the charge input/output stage; and a plurality of bitlines formed on the interlevel insulating layer to electrically connect the charge input/output stages formed on the same active region.
Claim 2
Dependent Claim 195 words
A semiconductor memory device comprising; a semiconductor substrate of a first conductivity-type having a field region; a field insulating layer formed on the field region so that a plurality of active regions are formed in one direction at predetermined intervals; a plurality of charge input/output stages formed on the semiconductor substrate of the active regions at predetermined intervals; a tunnelling dielectric layer formed on the semiconductor substrate, the tunnelling dielectric layer having a contact hole in the charge input/output stage; a plurality of floating gates formed in a matrix arrangement on the tunnelling dielectric layer above the active regions between the charge input/output stages; a ferroelectric layer formed on the surface of the semiconductor substrate including the floating gates, the ferroelectric layer having a contact hole at the charge input/output stage; a plurality of wordlines each formed on the ferroelectric layer above the floating gates perpendicular to the active regions; an interlevel insulating layer formed on the wordlines, the interlevel insulating layer having a contact hole in the charge input/output stage; and a plurality of bitlines formed on the interlevel insulating layer to electrically connect the charge input/output stages formed on the same active region.
Claim 3
Dependent Claim 30 words
The semiconductor memory device as claimed in claim 1, wherein two floating gates are formed on the tunnelling dielectric layer above the active regions placed between the charge input/output stages.
Claim 4
Dependent Claim 33 words
The semiconductor memory device as claimed in claim 1, wherein the tunnelling dielectric layer, ferroelectric layer and interlevel insulating layer are formed to have a contact hole for every other charge input/output stage.
Claim 5
Dependent Claim 18 words
The semiconductor memory device as claimed in claim 1, wherein the tunnelling dielectric layer is formed of PZT.
Claim 6
Dependent Claim 20 words
The semiconductor memory device as claimed in claim 1, wherein the wordlines are formed to surround the respective floating gates.
Claim 7
Dependent Claim 19 words
The semiconductor memory device as claimed in claim 1, wherein the tunnelling dielectric layer has a thickness of 70-150Å.
Claim 8
Dependent Claim 28 words
The semiconductor memory device as claimed in claim 1, wherein the ferroelectric layer includes one of an oxide layer, an oxide/nitride stack or an oxide/nitride/oxide stack, or PZT.

References Cited (Backward Citations)

US5315546A Cited
US5291046A Cited
US5265059A Cited
US5365098A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2001-06-22 2001-12-22 2002-06-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2005-06-22 2005-12-22 2006-06-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2009-06-22 2009-12-22 2010-06-23 $7700.00 Window Closed / Lapsed

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