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US5365098A Expired / Lapsed US ⏱️ 0.0 years remaining

Non-volatile semiconductor memory having improved erasure characteristics

Assignee: Toshiba Corp
•
Filing: 1992-10-20
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Granted: 1994-11-15
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Expires: 2012-10-20
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Abstract

Abstract A floating gate is formed via a first gate insulating film over the channel region between source and drain regions which are formed in a semiconductor substrate. A control gate is formed via a second gate insulating film over the floating gate. A low impurity concentration semiconductor region is formed on the side of the control gate which faces the floating gate. When erasing, a depletion layer is produced in this low impurity concentration region and further saturates the erase characteristic for the erasure time by decreasing the capacitance between the control gate and the floating gate.

Inventors

  • 👤 Junichi Miyamoto
  • 👤 Kuniyoshi Yoshikawa
  • 👤 Kiyomi Naruke

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 21:08
CPC Classifications
H; H10; H10B; H10B41/00; H10B41/40; H10B41/42; H10D; H10D30/00; H10D30/60; H10D30/68; H10D30/681; H10D30/684; H10D30/685; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/0144; H10D84/80; H10D84/82; H10D84/83; H10D84/834

Claims Analysis

Total Claims: 23
Claim 1
Independent Claim 159 words
A non-volatile semiconductor memory comprising a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region; and a control gate electrode including polycrystalline silicon of the first conductivity type, means for reducing a capacitance between the floating gate electrode and the control gate electrode when a voltage is applied between the source region and the control gate electrode, the reducing means comprising a depletion layer at a side of the control gate electrode facing the floating gate electrode, wherein the control gate electrode comprises a floating gate electrode side and an upper side on the floating gate electrode side, and an impurity concentration of the floating gate electrode side is lower than an impurity concentration of the upper side.
Claim 2
Dependent Claim 159 words
A non-volatile semiconductor memory comprising a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region; and a control gate electrode including polycrystalline silicon of the first conductivity type, means for reducing a capacitance between the floating gate electrode and the control gate electrode when a voltage is applied between the source region and the control gate electrode, the reducing means comprising a depletion layer at a side of the control gate electrode facing the floating gate electrode, wherein the control gate electrode comprises a floating gate electrode side and an upper side on the floating gate electrode side, and an impurity concentration of the floating gate electrode side is lower than an impurity concentration of the upper side.
Claim 3
Dependent Claim 26 words
The non-volatile semiconductor memory of claim 1, wherein the impurity concentration of the floating gate electrode side is not greater than 1×10 20 cm -3 .
Claim 4
Dependent Claim 26 words
The non-volatile semiconductor memory of claim 2, wherein The impurity concentration of the floating gate electrode side is not greater than 1×10 19 cm -3 .
Claim 5
Dependent Claim 25 words
The non-volatile semiconductor memory of claim 1, wherein the impurity concentration of the control gate electrode is not greater than 1×10 20 cm -3 .
Claim 6
Dependent Claim 25 words
The non-volatile semiconductor memory of claim 1, wherein an impurity concentration of the control gate electrode is not greater than 1×10 19 cm -3 .
Claim 7
Dependent Claim 19 words
The non-volatile semiconductor memory of claim 1, further comprising means for reducing a resistance of the control gate electrode.
Claim 8
Dependent Claim 23 words
The non-volatile semiconductor memory of claim 6, wherein the resistance reducing means comprises a metal layer in contact with the control gate electrode.
Claim 9
Dependent Claim 31 words
The non-volatile semiconductor memory of claim 7, the control gate electrode further comprising means for preventing the formation of a Shottky barrier between the capacitance reducing means and the metal layer.
Claim 10
Dependent Claim 164 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region, the floating gate electrode including polycrystalline silicon of the second conductivity type, means for reducing a capacitance between the floating gate electrode and the control gate electrode when a voltage is applied between the source region and the control gate electrode, the reducing means comprises a depletion layer at a side of the floating gate electrode facing the control gate electrode; and a control gate electrode electrically insulated from the floating gate electrode, wherein the floating gate electrode comprises a channel side and an upper side on the channel side, and an impurity concentration of the upper side is lower than an impurity concentration of the channel side.
Claim 11
Dependent Claim 164 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region, the floating gate electrode including polycrystalline silicon of the second conductivity type, means for reducing a capacitance between the floating gate electrode and the control gate electrode when a voltage is applied between the source region and the control gate electrode, the reducing means comprises a depletion layer at a side of the floating gate electrode facing the control gate electrode; and a control gate electrode electrically insulated from the floating gate electrode, wherein the floating gate electrode comprises a channel side and an upper side on the channel side, and an impurity concentration of the upper side is lower than an impurity concentration of the channel side.
Claim 12
Dependent Claim 23 words
The non-volatile semiconductor memory of claim 9, wherein the impurity concentration of the upper side is not greater 1×10 20 cm -3 .
Claim 13
Dependent Claim 24 words
The non-volatile semiconductor memory of claim 10, wherein the impurity concentration of the upper side is not greater than 1×10 19 cm -3 .
Claim 14
Dependent Claim 25 words
The non-volatile semiconductor memory of claim 9, wherein the impurity concentration of the floating gate electrode is not greater than 1×10 20 cm -3 .
Claim 15
Dependent Claim 25 words
The non-volatile semiconductor memory of claim 9, wherein an impurity concentration of the floating gate electrode is not greater than 1×10 19 cm -3 .
Claim 16
Dependent Claim 108 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region; and a control gate electrode of the first conductivity type semiconductor including a first portion opposing the floating gate electrode and a second portion separated from the floating gate electrode by the first portion, wherein an impurity concentration of the first portion is lower than an impurity concentration of the second portion.
Claim 17
Dependent Claim 108 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region; and a control gate electrode of the first conductivity type semiconductor including a first portion opposing the floating gate electrode and a second portion separated from the floating gate electrode by the first portion, wherein an impurity concentration of the first portion is lower than an impurity concentration of the second portion.
Claim 18
Dependent Claim 110 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode of the second conductivity type semiconductor over the channel region including a first portion opposing the channel region and a second portion separated from the channel region by the first portion, wherein an impurity concentration of the second portion is lower than an impurity concentration of the first portion; and a control gate electrode opposing the second portion.
Claim 19
Dependent Claim 110 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode of the second conductivity type semiconductor over the channel region including a first portion opposing the channel region and a second portion separated from the channel region by the first portion, wherein an impurity concentration of the second portion is lower than an impurity concentration of the first portion; and a control gate electrode opposing the second portion.
Claim 20
Dependent Claim 97 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region; and a control gate electrode including a floating gate electrode side and an upper side on the floating gate electrode side, and an impurity concentration of the floating gate electrode side is lower than an impurity concentration of the upper side.
Claim 21
Dependent Claim 97 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region; and a control gate electrode including a floating gate electrode side and an upper side on the floating gate electrode side, and an impurity concentration of the floating gate electrode side is lower than an impurity concentration of the upper side.
Claim 22
Dependent Claim 98 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region, including a channel side and an upper side on the channel side, and an impurity concentration of the upper side is lower than an impurity concentration of the channel side; and a control gate electrode electrically insulated from the floating gate electrode.
Claim 23
Dependent Claim 98 words
A non-volatile semiconductor memory comprising: a semiconductor substrate of a first conductivity type having a surface; a source region of a second conductivity type on the surface; a drain region of the second conductivity type on the surface; a channel region between the source and the drain regions; a floating gate electrode over the channel region, including a channel side and an upper side on the channel side, and an impurity concentration of the upper side is lower than an impurity concentration of the channel side; and a control gate electrode electrically insulated from the floating gate electrode.

References Cited (Backward Citations)

JPS60153167A Cited
JPS61163660A Cited
US4947221A Cited
EP0287031A2 Cited
EP0329569A2 Cited
EP0339586A2 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1997-11-14 1998-05-16 1998-11-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2001-11-14 2002-05-16 2002-11-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2005-11-14 2006-05-16 2006-11-15 $7700.00 Window Closed / Lapsed

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