Patent US5768104A successfully refreshed from Google Patents.
US5768104A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cooling approach for high power integrated circuits mounted on printed circuit boards
Assignee: Morgan Stanley and Co LLC
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Filing: 1996-02-22
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Granted: 1998-06-16
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Expires: 2016-02-22
Abstract
Abstract A method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.
Inventors
- 👤 Richard B. Salmonson
- 👤 Daniel John Dravis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 07:57
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20509; H05K7/20436; H05K7/20445; H05K7/20454; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
142 words
A method of cooling a plurality of electronic elements including a first electronic element mounted on a printed circuit board assembly, the method comprising the steps of: providing a cold plate; providing a plurality of thermal shims of varying thicknesses, wherein each shim is formed from a thermally conductive, compressible, material; determining a first gap between said first electronic element and said cold plate, wherein said first gap would result were said printed circuit board assembly mounted adjacent said cold plate; selecting one of said shims to fill said first gap, wherein the step of selecting includes determining the shim with the thickness that, when compressed, best fills said first gap; mounting said printed circuit board to said cold plate, wherein the step of mounting includes the step of positioning the selected shim between said cold plate and said first electronic element.
Claim 2
Independent Claim
142 words
A method of cooling a plurality of electronic elements including a first electronic element mounted on a printed circuit board assembly, the method comprising the steps of: providing a cold plate; providing a plurality of thermal shims of varying thicknesses, wherein each shim is formed from a thermally conductive, compressible, material; determining a first gap between said first electronic element and said cold plate, wherein said first gap would result were said printed circuit board assembly mounted adjacent said cold plate; selecting one of said shims to fill said first gap, wherein the step of selecting includes determining the shim with the thickness that, when compressed, best fills said first gap; mounting said printed circuit board to said cold plate, wherein the step of mounting includes the step of positioning the selected shim between said cold plate and said first electronic element.
Claim 3
Dependent Claim
61 words
The method of claim 1 wherein the step of providing a plurality of thermal shims includes the step of providing first and second groups of shims wherein said first group of shims each have approximately a first thickness and said second group of shims each have approximately a second thickness and wherein said first thickness is different from said second thickness.
Claim 4
Dependent Claim
76 words
The method of claim 2 wherein the step of providing said first and second groups further includes the step of forming said first group such that each thermal shim therein has a first color to identify thermal shims of said first thickness and forming said second group such that each thermal shim therein has a second color to identify thermal shims of said second thickness, and wherein said first color is different from said second color.
Claim 5
Dependent Claim
46 words
The method of claim 1 wherein the step of determining said first gap includes the step of placing said circuit board assembly in a fixture constructed and arranged to measure said circuit board assembly to obtain a first gap measurement associated with said first electronic element.
Claim 6
Dependent Claim
63 words
The method of claim 4 wherein the step of determining said first gap further includes the step of placing said cold plate in a fixture constructed and arranged to measure said cold plate to obtain a second gap measurement associated with said first electronic element, wherein a function of said first and second gap measurements is an approximate measure of said first gap.
Claim 7
Dependent Claim
32 words
The method of claim 1 wherein the step of providing a plurality of thermal shims includes the step of depositing an adhesive layer onto one side of each of said thermal shims.
Claim 8
Dependent Claim
48 words
The method of claim 6 wherein the step of positioning the selected shim includes the step of adhering the selected shim to said cold plate in an area where it will contact said first electronic element when said printed circuit board assembly is mounted to said cold plate.
Claim 9
Dependent Claim
89 words
A computer circuit module comprising: a cold plate, a printed circuit board carrying thereon a plurality of electronic elements, including a first and a second electronic element, said circuit board being mounted adjacent said cold plate with said first and second electronic elements disposed therebetween, a thermally conductive, compressible, first shim disposed between said cold plate and said first electronic element, and a thermally conductive, compressible, second shim disposed between said cold plate and said second electronic element, wherein the first and second shims, when uncompressed, have different thicknesses.
Claim 10
Dependent Claim
89 words
A computer circuit module comprising: a cold plate, a printed circuit board carrying thereon a plurality of electronic elements, including a first and a second electronic element, said circuit board being mounted adjacent said cold plate with said first and second electronic elements disposed therebetween, a thermally conductive, compressible, first shim disposed between said cold plate and said first electronic element, and a thermally conductive, compressible, second shim disposed between said cold plate and said second electronic element, wherein the first and second shims, when uncompressed, have different thicknesses.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-15 | 2001-12-15 | 2002-06-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-15 | 2005-12-15 | 2006-06-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-15 | 2009-12-15 | 2010-06-16 | $7700.00 | Window Closed / Lapsed |