US5766670A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Via fill compositions for direct attach of devices and methods for applying same
Assignee: International Business Machines Corp
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Filing: 1993-11-17
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Granted: 1998-06-16
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Expires: 2013-11-17
Abstract
Abstract The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes with an epoxy or cyanate fill composition. When cured and overplated, the fill composition provides support for the solder joint and provides a flat solderable surface for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.
Inventors
- 👤 Roy Lynn Arldt
- 👤 Christina Marie Boyko
- 👤 Burtran Joe Cayson
- 👤 Richard Michael Kozlowski
- 👤 Joseph Duane Kulesza
- 👤 John Matthew Lauffer
- 👤 Philip Chihchau Liu
- 👤 Voya Rista Markovich
- 👤 Issa Said Mahmoud
- 👤 James Francis Muska
- 👤 Kostas Papathomas
- 👤 Joseph Gene Sabia
- 👤 Richard Anthony Schumacher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:24
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; H05K1/113; B; B32; B32B; B32B7/00; B32B7/04; H01; H01B; H01B1/00; H01B1/20; H01B1/22; H01B1/24; H05K1/09; H05K1/092; H05K1/095; H05K1/16; H05K1/167; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09563; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0126; H05K2203/0191; H05K2203/02; H05K2203/0207; H05K2203/0278; H05K2203/03; H05K2203/0338; H05K2203/07; H05K2203/0756; H05K2203/0763; H05K3/0011; H05K3/0017; H05K3/0023; H05K3/0044; H05K3/0047; H05K3/0094; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49155; Y10T29/49165; Y10T428/00; Y10T428/24; Y10T428/24273; Y10T428/24322; Y10T428/24331; Y10T428/24339; Y10T428/24802; Y10T428/24826; Y10T428/24917; Y10T428/24926; Y10T428/25
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
74 words
A method of forming a resistor in a circuit carrier comprising the steps of: a. providing a circuit carrier having at least one aperture; b. filling the aperture with a resistor fill composition to provide a resistor with exposed ends; c. measuring the resistance of the resistor; and d. trimming the resistor to provide a desired resistance values; e. selective overplating the exposed ends of the resistor to provide a pad over the aperture.
Claim 2
Independent Claim
74 words
A method of forming a resistor in a circuit carrier comprising the steps of: a. providing a circuit carrier having at least one aperture; b. filling the aperture with a resistor fill composition to provide a resistor with exposed ends; c. measuring the resistance of the resistor; and d. trimming the resistor to provide a desired resistance values; e. selective overplating the exposed ends of the resistor to provide a pad over the aperture.
Claim 3
Dependent Claim
28 words
The method of claim 1, wherein the fill composition comprises metal and in step e, the metal is used as a seed layer to overplate the filled aperture.
Claim 4
Independent Claim
104 words
A method of forming a resistor having a resistance value, in a circuit carrier, comprising the steps of: a. providing a circuit carrier having at least one aperture of known dimensions or volume; b. calculating a material resistivity value required to produce the resistance value according to the formula: Rho=R<L/A Where: R=Resistance Value in ohms Rho=Material Resistivity in ohm-inches L=Resistor Length=Board Thickness A=Cross-sectional Area c. providing a fill composition of the material resistivity value calculated in step b; and d. filling the aperture with the resistor fill composition; e. selectively overplating the exposed ends of the resistor to provide a pad over the aperture.
Claim 5
Independent Claim
104 words
A method of forming a resistor having a resistance value, in a circuit carrier, comprising the steps of: a. providing a circuit carrier having at least one aperture of known dimensions or volume; b. calculating a material resistivity value required to produce the resistance value according to the formula: Rho=R<L/A Where: R=Resistance Value in ohms Rho=Material Resistivity in ohm-inches L=Resistor Length=Board Thickness A=Cross-sectional Area c. providing a fill composition of the material resistivity value calculated in step b; and d. filling the aperture with the resistor fill composition; e. selectively overplating the exposed ends of the resistor to provide a pad over the aperture.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-06-15 | 2001-12-15 | 2002-06-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-06-15 | 2005-12-15 | 2006-06-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-06-15 | 2009-12-15 | 2010-06-16 | $7700.00 | Window Closed / Lapsed |